SG11201607061WA - Wafer shipper with stacked support rings - Google Patents
Wafer shipper with stacked support ringsInfo
- Publication number
- SG11201607061WA SG11201607061WA SG11201607061WA SG11201607061WA SG11201607061WA SG 11201607061W A SG11201607061W A SG 11201607061WA SG 11201607061W A SG11201607061W A SG 11201607061WA SG 11201607061W A SG11201607061W A SG 11201607061WA SG 11201607061W A SG11201607061W A SG 11201607061WA
- Authority
- SG
- Singapore
- Prior art keywords
- support rings
- stacked support
- wafer shipper
- shipper
- wafer
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
- H10P72/18—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] characterised by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
- H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
- H10P72/1911—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by materials, roughness, coatings or the like
- H10P72/1912—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by materials, roughness, coatings or the like characterised by shock absorbing elements, e.g. retainers or cushions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
- H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
- H10P72/1922—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by the construction of the closed carrier
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7606—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201461944455P | 2014-02-25 | 2014-02-25 | |
| US201462089087P | 2014-12-08 | 2014-12-08 | |
| US201462089103P | 2014-12-08 | 2014-12-08 | |
| PCT/US2015/017345 WO2015130690A1 (en) | 2014-02-25 | 2015-02-24 | Wafer shipper with stacked support rings |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201607061WA true SG11201607061WA (en) | 2016-09-29 |
Family
ID=54009550
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201607061WA SG11201607061WA (en) | 2014-02-25 | 2015-02-24 | Wafer shipper with stacked support rings |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US10896834B2 (https=) |
| EP (1) | EP3111472B1 (https=) |
| JP (1) | JP2017508291A (https=) |
| KR (1) | KR20160126020A (https=) |
| CN (1) | CN106463437B (https=) |
| SG (1) | SG11201607061WA (https=) |
| TW (1) | TWI733648B (https=) |
| WO (1) | WO2015130690A1 (https=) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SG11201607061WA (en) | 2014-02-25 | 2016-09-29 | Entegris Inc | Wafer shipper with stacked support rings |
| US10658212B2 (en) | 2014-11-27 | 2020-05-19 | Achilles Corporation | Ring spacer |
| USD799825S1 (en) * | 2015-08-31 | 2017-10-17 | Entegris, Inc. | Container |
| USD801046S1 (en) * | 2015-08-31 | 2017-10-31 | Entegris, Inc. | Container |
| US10832927B2 (en) * | 2015-12-18 | 2020-11-10 | Texas Instruments Incorporated | Interlocking nest wafer protector |
| DE102016113924B4 (de) | 2016-07-28 | 2024-06-13 | Infineon Technologies Ag | Waferbox und Verfahren zum Anordnen von Wafern in einer Waferbox |
| JP6966541B2 (ja) | 2016-09-30 | 2021-11-17 | チェ, チェ ソンCHOI, Jae Seung | 電動歯ブラシ |
| USD812907S1 (en) * | 2017-01-16 | 2018-03-20 | Endural, Llc | Container |
| WO2019046477A1 (en) | 2017-08-29 | 2019-03-07 | Daewon Semiconductor Packaging Industrial Company | SEPARATORS FOR HANDLING, TRANSPORTING OR STORING SEMICONDUCTOR WAFERS |
| DE202019101793U1 (de) * | 2018-06-27 | 2019-10-09 | Murata Machinery, Ltd. | Vorrichtungen zum mindestens einen aus Substrat-Handhabung, Substrat-Lagerung, Substrat-Behandlung und Substrat-Verarbeitung |
| KR102421675B1 (ko) | 2018-08-01 | 2022-07-15 | 히라따기꼬오 가부시키가이샤 | 반송 장치 및 제어 방법 |
| US10811292B2 (en) * | 2018-09-12 | 2020-10-20 | Texas Instruments Incorporated | Transport packaging and method for expanded wafers |
| US12165905B2 (en) * | 2019-05-20 | 2024-12-10 | Applied Materials, Inc. | Process kit enclosure system |
| USD917825S1 (en) | 2019-07-16 | 2021-04-27 | Entegris, Inc. | Wafer support ring |
| JP7330081B2 (ja) * | 2019-12-03 | 2023-08-21 | 三菱電機株式会社 | キャリアスペーサおよび半導体装置の製造方法 |
| US12159795B2 (en) | 2021-03-08 | 2024-12-03 | Applied Materials, Inc. | Enclosure system having walls comprising sidewalls and radio-frequency identifier holder coupled to rear wall |
| US11664257B2 (en) * | 2021-09-21 | 2023-05-30 | Intel Corporation | Contactless wafer separator |
| US12159799B2 (en) * | 2022-03-30 | 2024-12-03 | Achilles Corporation | Container for transporting semiconductor wafer |
| US12614052B2 (en) | 2024-05-28 | 2026-04-28 | Globalfoundries U.S. Inc. | Fixture for radio frequency identification tag |
Family Cites Families (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61291336A (ja) | 1985-06-20 | 1986-12-22 | Matsushita Electric Ind Co Ltd | 送出装置 |
| JP2688664B2 (ja) * | 1994-09-07 | 1997-12-10 | シノン電気産業株式会社 | 半導体デバイス用トレー |
| JP2910684B2 (ja) | 1996-07-31 | 1999-06-23 | 日本電気株式会社 | ウエハー容器 |
| JP3054701U (ja) * | 1998-06-05 | 1998-12-18 | 株式会社倉元製作所 | 膜付きガラス基板のスペーサ |
| DE60044028D1 (de) * | 1999-07-23 | 2010-04-29 | Ray G Brooks | Sicherungssystem für wafer mit integriertem schaltkreis (ic) |
| US6550619B2 (en) * | 2000-05-09 | 2003-04-22 | Entergris, Inc. | Shock resistant variable load tolerant wafer shipper |
| US7040487B2 (en) | 2001-07-14 | 2006-05-09 | Entegris, Inc. | Protective shipper |
| JP4261170B2 (ja) * | 2002-11-08 | 2009-04-30 | 株式会社ヴァンテック | 半導体ウェハ搬送容器 |
| US6926150B2 (en) * | 2003-02-05 | 2005-08-09 | Texas Instruments Incorporated | Protective interleaf for stacked wafer shipping |
| JP4150963B2 (ja) * | 2003-02-07 | 2008-09-17 | 株式会社ダイフク | 被支持体積層支持装置 |
| JP4329536B2 (ja) | 2003-12-26 | 2009-09-09 | アキレス株式会社 | 半導体ウェハーの収納具 |
| US7225929B2 (en) * | 2004-12-30 | 2007-06-05 | Illinois Tool Works Inc. | Adjustable height wafer box |
| TW200746349A (en) | 2006-02-08 | 2007-12-16 | Entegris Inc | Stacking rings for wafers |
| FR2901543B1 (fr) * | 2006-05-23 | 2009-02-27 | Mezrag Mohamed Seiffeddine Bou | Recipient modulaire pour contenir des denrees sensibles a leur mise a l'air. |
| JP4716928B2 (ja) * | 2006-06-07 | 2011-07-06 | 信越ポリマー株式会社 | ウェーハ収納容器 |
| JP2008044636A (ja) * | 2006-08-11 | 2008-02-28 | Sanyu Kikaku:Kk | 収納用トレー |
| JP3130509U (ja) * | 2007-01-16 | 2007-03-29 | 山汰科技企業有限公司 | 基板搬送装置 |
| JP5043475B2 (ja) | 2007-03-05 | 2012-10-10 | ミライアル株式会社 | 半導体ウエハ収納容器 |
| JP2009076646A (ja) * | 2007-09-20 | 2009-04-09 | Shin Etsu Polymer Co Ltd | 基板保持具 |
| CN101888957B (zh) * | 2007-10-12 | 2013-01-02 | 大元半导体包装产业有限公司 | 带有交错壁结构的晶圆容器 |
| JP4825771B2 (ja) * | 2007-10-22 | 2011-11-30 | 信越ポリマー株式会社 | ウェーハ収納容器およびウェーハのハンドリング方法 |
| US20100224517A1 (en) * | 2009-03-03 | 2010-09-09 | Haggard Clifton C | Disk separator device |
| US9224627B2 (en) * | 2011-02-16 | 2015-12-29 | Texchem Advanced Products Incorporated Sdn Bhd | Single and dual stage wafer cushion and wafer separator |
| JP5712058B2 (ja) | 2011-06-03 | 2015-05-07 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
| US20140076774A1 (en) * | 2012-09-18 | 2014-03-20 | Kurt F. Kaashoek | Automated Wafer Container with Equipment Interface |
| SG11201607061WA (en) | 2014-02-25 | 2016-09-29 | Entegris Inc | Wafer shipper with stacked support rings |
| JP6427674B2 (ja) | 2014-12-08 | 2018-11-21 | インテグリス・インコーポレーテッド | 基板格納用の一体型コーナースプリングを備える水平基板コンテナ |
-
2015
- 2015-02-24 SG SG11201607061WA patent/SG11201607061WA/en unknown
- 2015-02-24 US US15/120,973 patent/US10896834B2/en active Active
- 2015-02-24 CN CN201580019500.2A patent/CN106463437B/zh active Active
- 2015-02-24 EP EP15754712.6A patent/EP3111472B1/en active Active
- 2015-02-24 JP JP2016553865A patent/JP2017508291A/ja active Pending
- 2015-02-24 WO PCT/US2015/017345 patent/WO2015130690A1/en not_active Ceased
- 2015-02-24 KR KR1020167026139A patent/KR20160126020A/ko not_active Ceased
- 2015-02-25 TW TW104106010A patent/TWI733648B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| CN106463437A (zh) | 2017-02-22 |
| EP3111472A1 (en) | 2017-01-04 |
| JP2017508291A (ja) | 2017-03-23 |
| TWI733648B (zh) | 2021-07-21 |
| TW201539641A (zh) | 2015-10-16 |
| KR20160126020A (ko) | 2016-11-01 |
| EP3111472B1 (en) | 2018-09-26 |
| US20160365265A1 (en) | 2016-12-15 |
| WO2015130690A1 (en) | 2015-09-03 |
| US10896834B2 (en) | 2021-01-19 |
| CN106463437B (zh) | 2019-09-06 |
| EP3111472A4 (en) | 2017-07-12 |
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