KR20160038714A - 패터닝 기판의 브레이크 방법 그리고 브레이크 장치 - Google Patents

패터닝 기판의 브레이크 방법 그리고 브레이크 장치 Download PDF

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Publication number
KR20160038714A
KR20160038714A KR1020150090975A KR20150090975A KR20160038714A KR 20160038714 A KR20160038714 A KR 20160038714A KR 1020150090975 A KR1020150090975 A KR 1020150090975A KR 20150090975 A KR20150090975 A KR 20150090975A KR 20160038714 A KR20160038714 A KR 20160038714A
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KR
South Korea
Prior art keywords
substrate
patterning substrate
divided
point
patterning
Prior art date
Application number
KR1020150090975A
Other languages
English (en)
Korean (ko)
Inventor
마사카즈 다케다
마나부 미야가와
Original Assignee
미쓰보시 다이야몬도 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 미쓰보시 다이야몬도 고교 가부시키가이샤 filed Critical 미쓰보시 다이야몬도 고교 가부시키가이샤
Publication of KR20160038714A publication Critical patent/KR20160038714A/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
    • B28B11/00—Apparatus or processes for treating or working the shaped or preshaped articles
    • B28B11/14—Apparatus or processes for treating or working the shaped or preshaped articles for dividing shaped articles by cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76886—Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances
    • H01L21/76892—Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances modifying the pattern
    • H01L21/76894—Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances modifying the pattern using a laser, e.g. laser cutting, laser direct writing, laser repair

Landscapes

  • Engineering & Computer Science (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Dicing (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Laser Beam Processing (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Optics & Photonics (AREA)
  • Ceramic Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Structural Engineering (AREA)
KR1020150090975A 2014-09-30 2015-06-26 패터닝 기판의 브레이크 방법 그리고 브레이크 장치 KR20160038714A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2014-200116 2014-09-30
JP2014200116A JP6417828B2 (ja) 2014-09-30 2014-09-30 パターニング基板のブレイク方法並びにブレイク装置

Publications (1)

Publication Number Publication Date
KR20160038714A true KR20160038714A (ko) 2016-04-07

Family

ID=55597644

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150090975A KR20160038714A (ko) 2014-09-30 2015-06-26 패터닝 기판의 브레이크 방법 그리고 브레이크 장치

Country Status (4)

Country Link
JP (1) JP6417828B2 (ja)
KR (1) KR20160038714A (ja)
CN (1) CN105459277B (ja)
TW (1) TWI655046B (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7340838B2 (ja) 2019-04-26 2023-09-08 三星ダイヤモンド工業株式会社 ウエハーのブレイク方法並びにブレイク装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4409840B2 (ja) * 2002-03-12 2010-02-03 浜松ホトニクス株式会社 加工対象物切断方法
JP2006173520A (ja) * 2004-12-20 2006-06-29 Canon Inc レーザ割断方法および該方法により割断可能な被割断部材
CN100546004C (zh) * 2005-01-05 2009-09-30 Thk株式会社 工件的截断方法和装置、划线和截断方法、以及带截断功能的划线装置
US7858902B2 (en) * 2007-02-13 2010-12-28 Disco Corporation Wafer dividing method and laser beam processing machine
JP5163358B2 (ja) * 2008-03-26 2013-03-13 日立化成株式会社 半導体ウエハのダイシング方法
JP2010050175A (ja) * 2008-08-20 2010-03-04 Disco Abrasive Syst Ltd レーザー加工方法及びレーザー加工装置
JP2011165766A (ja) * 2010-02-05 2011-08-25 Disco Abrasive Syst Ltd 光デバイスウエーハの加工方法

Also Published As

Publication number Publication date
TW201611929A (en) 2016-04-01
CN105459277A (zh) 2016-04-06
TWI655046B (zh) 2019-04-01
CN105459277B (zh) 2020-03-17
JP2016068393A (ja) 2016-05-09
JP6417828B2 (ja) 2018-11-07

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