TW201611929A - Method and device to break apart patterned baseboard - Google Patents

Method and device to break apart patterned baseboard

Info

Publication number
TW201611929A
TW201611929A TW104122533A TW104122533A TW201611929A TW 201611929 A TW201611929 A TW 201611929A TW 104122533 A TW104122533 A TW 104122533A TW 104122533 A TW104122533 A TW 104122533A TW 201611929 A TW201611929 A TW 201611929A
Authority
TW
Taiwan
Prior art keywords
apart
break
baseboard
patterned
expanding
Prior art date
Application number
TW104122533A
Other languages
Chinese (zh)
Other versions
TWI655046B (en
Inventor
Masakazu Takeda
Manabu Miyagawa
Original Assignee
Mitsuboshi Diamond Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Ind Co Ltd filed Critical Mitsuboshi Diamond Ind Co Ltd
Publication of TW201611929A publication Critical patent/TW201611929A/en
Application granted granted Critical
Publication of TWI655046B publication Critical patent/TWI655046B/en

Links

Landscapes

  • Engineering & Computer Science (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Dicing (AREA)
  • Mechanical Engineering (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Laser Beam Processing (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Ceramic Engineering (AREA)
  • Optics & Photonics (AREA)
  • Structural Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)

Abstract

The present invention provides a method and device to break apart a patterned baseboard without un-separated and damaged patterned baseboards. Particularly, a method and device to break apart a patterned baseboard which has an electronic circuitry pattern formed on the surface of a baseboard made of a brittle material. It comprises: a laser processing step (laser processing device (A)) to form multiple break-apart starting points (5) along a pre-determined break-apart line (L) by irradiating a laser beam onto the surface of a patterned baseboard (W) which is adhered to an expanding tape (2); a designated region separation step (designated region separation device (B) to designate a specific region, where an incomplete portion of the break-apart starting points (5) is formed during the laser processing step, and apply an external pressure to the designated region for bending and breaking apart the patterned baseboard (W); and an expanding break-apart step (expanding break-apart device (C)) to stretch the expanding tape (2), which applies tensile stress to the patterned baseboard (W) for breaking apart all pre-determined break-apart line (L).
TW104122533A 2014-09-30 2015-07-13 Method for disconnecting patterned substrate and disconnecting device TWI655046B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014-200116 2014-09-30
JP2014200116A JP6417828B2 (en) 2014-09-30 2014-09-30 Breaking method and apparatus for patterning substrate

Publications (2)

Publication Number Publication Date
TW201611929A true TW201611929A (en) 2016-04-01
TWI655046B TWI655046B (en) 2019-04-01

Family

ID=55597644

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104122533A TWI655046B (en) 2014-09-30 2015-07-13 Method for disconnecting patterned substrate and disconnecting device

Country Status (4)

Country Link
JP (1) JP6417828B2 (en)
KR (1) KR20160038714A (en)
CN (1) CN105459277B (en)
TW (1) TWI655046B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7340838B2 (en) 2019-04-26 2023-09-08 三星ダイヤモンド工業株式会社 Wafer breaking method and breaking device

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4409840B2 (en) * 2002-03-12 2010-02-03 浜松ホトニクス株式会社 Processing object cutting method
JP2006173520A (en) * 2004-12-20 2006-06-29 Canon Inc Laser fracture method and member to be fractured which can be fractured by the method
CN100546004C (en) * 2005-01-05 2009-09-30 Thk株式会社 The chalker of the method for cutting of workpiece and device, line and method for cutting and band break-in facility
JP5166899B2 (en) * 2007-02-13 2013-03-21 株式会社ディスコ Wafer division method
JP5163358B2 (en) * 2008-03-26 2013-03-13 日立化成株式会社 Semiconductor wafer dicing method
JP2010050175A (en) * 2008-08-20 2010-03-04 Disco Abrasive Syst Ltd Laser processing method and laser processing device
JP2011165766A (en) * 2010-02-05 2011-08-25 Disco Abrasive Syst Ltd Method of processing optical device wafer

Also Published As

Publication number Publication date
JP2016068393A (en) 2016-05-09
JP6417828B2 (en) 2018-11-07
TWI655046B (en) 2019-04-01
KR20160038714A (en) 2016-04-07
CN105459277B (en) 2020-03-17
CN105459277A (en) 2016-04-06

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees