TW201611929A - Method and device to break apart patterned baseboard - Google Patents
Method and device to break apart patterned baseboardInfo
- Publication number
- TW201611929A TW201611929A TW104122533A TW104122533A TW201611929A TW 201611929 A TW201611929 A TW 201611929A TW 104122533 A TW104122533 A TW 104122533A TW 104122533 A TW104122533 A TW 104122533A TW 201611929 A TW201611929 A TW 201611929A
- Authority
- TW
- Taiwan
- Prior art keywords
- apart
- break
- baseboard
- patterned
- expanding
- Prior art date
Links
Landscapes
- Engineering & Computer Science (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Dicing (AREA)
- Mechanical Engineering (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Laser Beam Processing (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Ceramic Engineering (AREA)
- Optics & Photonics (AREA)
- Structural Engineering (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
Abstract
The present invention provides a method and device to break apart a patterned baseboard without un-separated and damaged patterned baseboards. Particularly, a method and device to break apart a patterned baseboard which has an electronic circuitry pattern formed on the surface of a baseboard made of a brittle material. It comprises: a laser processing step (laser processing device (A)) to form multiple break-apart starting points (5) along a pre-determined break-apart line (L) by irradiating a laser beam onto the surface of a patterned baseboard (W) which is adhered to an expanding tape (2); a designated region separation step (designated region separation device (B) to designate a specific region, where an incomplete portion of the break-apart starting points (5) is formed during the laser processing step, and apply an external pressure to the designated region for bending and breaking apart the patterned baseboard (W); and an expanding break-apart step (expanding break-apart device (C)) to stretch the expanding tape (2), which applies tensile stress to the patterned baseboard (W) for breaking apart all pre-determined break-apart line (L).
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014-200116 | 2014-09-30 | ||
JP2014200116A JP6417828B2 (en) | 2014-09-30 | 2014-09-30 | Breaking method and apparatus for patterning substrate |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201611929A true TW201611929A (en) | 2016-04-01 |
TWI655046B TWI655046B (en) | 2019-04-01 |
Family
ID=55597644
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW104122533A TWI655046B (en) | 2014-09-30 | 2015-07-13 | Method for disconnecting patterned substrate and disconnecting device |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6417828B2 (en) |
KR (1) | KR20160038714A (en) |
CN (1) | CN105459277B (en) |
TW (1) | TWI655046B (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7340838B2 (en) | 2019-04-26 | 2023-09-08 | 三星ダイヤモンド工業株式会社 | Wafer breaking method and breaking device |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4409840B2 (en) * | 2002-03-12 | 2010-02-03 | 浜松ホトニクス株式会社 | Processing object cutting method |
JP2006173520A (en) * | 2004-12-20 | 2006-06-29 | Canon Inc | Laser fracture method and member to be fractured which can be fractured by the method |
CN100546004C (en) * | 2005-01-05 | 2009-09-30 | Thk株式会社 | The chalker of the method for cutting of workpiece and device, line and method for cutting and band break-in facility |
JP5166899B2 (en) * | 2007-02-13 | 2013-03-21 | 株式会社ディスコ | Wafer division method |
JP5163358B2 (en) * | 2008-03-26 | 2013-03-13 | 日立化成株式会社 | Semiconductor wafer dicing method |
JP2010050175A (en) * | 2008-08-20 | 2010-03-04 | Disco Abrasive Syst Ltd | Laser processing method and laser processing device |
JP2011165766A (en) * | 2010-02-05 | 2011-08-25 | Disco Abrasive Syst Ltd | Method of processing optical device wafer |
-
2014
- 2014-09-30 JP JP2014200116A patent/JP6417828B2/en not_active Expired - Fee Related
-
2015
- 2015-06-26 KR KR1020150090975A patent/KR20160038714A/en active Search and Examination
- 2015-07-03 CN CN201510389193.9A patent/CN105459277B/en not_active Expired - Fee Related
- 2015-07-13 TW TW104122533A patent/TWI655046B/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JP2016068393A (en) | 2016-05-09 |
JP6417828B2 (en) | 2018-11-07 |
TWI655046B (en) | 2019-04-01 |
KR20160038714A (en) | 2016-04-07 |
CN105459277B (en) | 2020-03-17 |
CN105459277A (en) | 2016-04-06 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |