MY168988A - Adhesive tape for semiconductor processing and semiconductor device produced using the same - Google Patents

Adhesive tape for semiconductor processing and semiconductor device produced using the same

Info

Publication number
MY168988A
MY168988A MYPI2017000293A MYPI2017000293A MY168988A MY 168988 A MY168988 A MY 168988A MY PI2017000293 A MYPI2017000293 A MY PI2017000293A MY PI2017000293 A MYPI2017000293 A MY PI2017000293A MY 168988 A MY168988 A MY 168988A
Authority
MY
Malaysia
Prior art keywords
adhesive layer
adhesive tape
semiconductor processing
same
semiconductor
Prior art date
Application number
MYPI2017000293A
Inventor
Toshimitsu Nakamura
Jirou Sugiyama
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Publication of MY168988A publication Critical patent/MY168988A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
  • Laser Beam Processing (AREA)

Abstract

Provided is an adhesive tape for semiconductor processing having excellent processability, in which there is no occurrence of incisions or cracks caused by the impact at the time of transportation or the like, and even if the adhesive layer is stretched during a precutting process of processing the adhesive layer to a defined size, the adhesive layer does not crack. An adhesive tape for semiconductor processing (10) of the invention has an adhesive layer (13) and a tacky adhesive sheet (15) laminated together, in which the adhesive layer (13) has a tear strength (A) according to the right angled tear method defined in JIS K7128-3, of 0.8 MPa or more, and a tear strength (C) according to the right angled tear method defined in JIS K7128-3 at -15?C, of 0.8 MPa or less.
MYPI2017000293A 2014-09-05 2015-08-28 Adhesive tape for semiconductor processing and semiconductor device produced using the same MY168988A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014181752A JP5863914B1 (en) 2014-09-05 2014-09-05 Semiconductor processing tape and manufacturing method of semiconductor device manufactured using the same

Publications (1)

Publication Number Publication Date
MY168988A true MY168988A (en) 2019-01-29

Family

ID=55346911

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2017000293A MY168988A (en) 2014-09-05 2015-08-28 Adhesive tape for semiconductor processing and semiconductor device produced using the same

Country Status (8)

Country Link
JP (1) JP5863914B1 (en)
KR (1) KR101828226B1 (en)
CN (1) CN106663617B (en)
MY (1) MY168988A (en)
PH (1) PH12017500394B1 (en)
SG (1) SG11201701479TA (en)
TW (1) TWI591701B (en)
WO (1) WO2016035687A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7471879B2 (en) * 2020-03-18 2024-04-22 リンテック株式会社 Film-like adhesive and dicing die bonding sheet
CN114615835A (en) * 2022-04-26 2022-06-10 生益电子股份有限公司 Stepped circuit board, manufacturing method thereof and double-layer adhesive tape
CN116544151B (en) * 2023-07-05 2023-09-19 砺铸智能设备(天津)有限公司 Detection and packaging equipment for chip

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4358502B2 (en) 2002-03-12 2009-11-04 浜松ホトニクス株式会社 Semiconductor substrate cutting method
JP2004273895A (en) 2003-03-11 2004-09-30 Disco Abrasive Syst Ltd Dividing method of semiconductor wafer
JP4770126B2 (en) * 2003-06-06 2011-09-14 日立化成工業株式会社 Adhesive sheet
CN101362926B (en) * 2003-06-06 2012-08-15 日立化成工业株式会社 Adhesive sheet, dicing tape integrated type adhesive sheet, and semiconductor device producing method
JP4754278B2 (en) 2005-06-23 2011-08-24 リンテック株式会社 Chip body manufacturing method
JP4979063B2 (en) * 2006-06-15 2012-07-18 日東電工株式会社 Manufacturing method of semiconductor device
JP2009164556A (en) * 2007-12-11 2009-07-23 Furukawa Electric Co Ltd:The Tape for processing wafer
JP4785095B2 (en) * 2009-08-25 2011-10-05 古河電気工業株式会社 Wafer processing tape
JP5323779B2 (en) * 2010-07-26 2013-10-23 古河電気工業株式会社 Wafer processing tape
CN102373017A (en) * 2010-08-19 2012-03-14 古河电气工业株式会社 Wafer processing adhesive tape
JP5607843B2 (en) * 2012-07-26 2014-10-15 古河電気工業株式会社 Manufacturing method of semiconductor wafer processing tape and semiconductor wafer processing tape

Also Published As

Publication number Publication date
TW201616560A (en) 2016-05-01
SG11201701479TA (en) 2017-03-30
TWI591701B (en) 2017-07-11
KR101828226B1 (en) 2018-02-09
PH12017500394A1 (en) 2017-07-17
WO2016035687A1 (en) 2016-03-10
JP5863914B1 (en) 2016-02-17
JP2016058458A (en) 2016-04-21
KR20170030645A (en) 2017-03-17
CN106663617A (en) 2017-05-10
CN106663617B (en) 2018-05-29
PH12017500394B1 (en) 2017-07-17

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