TW201611930A - Method and device to break apart patterned baseboard - Google Patents

Method and device to break apart patterned baseboard

Info

Publication number
TW201611930A
TW201611930A TW104122534A TW104122534A TW201611930A TW 201611930 A TW201611930 A TW 201611930A TW 104122534 A TW104122534 A TW 104122534A TW 104122534 A TW104122534 A TW 104122534A TW 201611930 A TW201611930 A TW 201611930A
Authority
TW
Taiwan
Prior art keywords
apart
break
baseboard
patterned
expanding
Prior art date
Application number
TW104122534A
Other languages
Chinese (zh)
Other versions
TWI655047B (en
Inventor
Masakazu Takeda
Manabu Miyagawa
Original Assignee
Mitsuboshi Diamond Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Ind Co Ltd filed Critical Mitsuboshi Diamond Ind Co Ltd
Publication of TW201611930A publication Critical patent/TW201611930A/en
Application granted granted Critical
Publication of TWI655047B publication Critical patent/TWI655047B/en

Links

Landscapes

  • Engineering & Computer Science (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Dicing (AREA)
  • Laser Beam Processing (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Optics & Photonics (AREA)
  • Ceramic Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Structural Engineering (AREA)

Abstract

This invention provides a method and device to break apart a patterned baseboard without un-separated and damaged patterned baseboards. The method and device to break apart a patterned baseboard which has an electronic circuitry pattern formed on the surface of a baseboard made of a brittle material comprise: a laser processing step (laser processing device (A)) to form multiple break-apart starting points (5) along a pre-determined break-apart line (L) by irradiating a laser beam onto the surface of a patterned baseboard (W) which is adhered to an expanding tape (2); an inspection/break-apart step (inspection/ break-apart device (B) to apply tension to the expanding tape (2) while inspecting the break-apart starting points (5) of the pre-determined break-apart line (L) by an optical inspection component (16), and apply an external pressure to bend and break apart the pre-determined break-apart line (L) having the incomplete break-apart starting points; and an expanding break-apart step (expanding break-apart device (C)) to stretch the expanding tape (2), which applies tensile stress to the patterned baseboard (W) for breaking apart all pre-determined break-apart line (L).
TW104122534A 2014-09-30 2015-07-13 Method for disconnecting patterned substrate and disconnecting device TWI655047B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014-200117 2014-09-30
JP2014200117A JP6428113B2 (en) 2014-09-30 2014-09-30 Breaking method and apparatus for patterning substrate

Publications (2)

Publication Number Publication Date
TW201611930A true TW201611930A (en) 2016-04-01
TWI655047B TWI655047B (en) 2019-04-01

Family

ID=55789829

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104122534A TWI655047B (en) 2014-09-30 2015-07-13 Method for disconnecting patterned substrate and disconnecting device

Country Status (4)

Country Link
JP (1) JP6428113B2 (en)
KR (1) KR20160038715A (en)
CN (1) CN106181056B (en)
TW (1) TWI655047B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11204336B2 (en) 2016-03-30 2021-12-21 Ngk Insulators, Ltd. Sensor element and gas sensor
JP7020660B2 (en) * 2016-11-29 2022-02-16 三星ダイヤモンド工業株式会社 Brittle material Substrate fragmentation method and fragmentation device
CN115592257B (en) * 2022-12-13 2023-04-18 西北电子装备技术研究所(中国电子科技集团公司第二研究所) Mechanical stripping device for stripping wafer from laser modified crystal

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4409840B2 (en) * 2002-03-12 2010-02-03 浜松ホトニクス株式会社 Processing object cutting method
US7820941B2 (en) * 2004-07-30 2010-10-26 Corning Incorporated Process and apparatus for scoring a brittle material
JP3887394B2 (en) * 2004-10-08 2007-02-28 芝浦メカトロニクス株式会社 Brittle material cleaving system and method
JP2006147818A (en) * 2004-11-19 2006-06-08 Canon Inc Method for dicing substrate
CN100546004C (en) * 2005-01-05 2009-09-30 Thk株式会社 The chalker of the method for cutting of workpiece and device, line and method for cutting and band break-in facility
JP4847199B2 (en) * 2006-04-25 2011-12-28 株式会社ディスコ Breaking method of adhesive film attached to wafer
JP2010045151A (en) * 2008-08-12 2010-02-25 Disco Abrasive Syst Ltd Method of processing optical device wafer
JP5121746B2 (en) * 2009-01-29 2013-01-16 昭和電工株式会社 Substrate cutting method and electronic device manufacturing method
JP2011165766A (en) * 2010-02-05 2011-08-25 Disco Abrasive Syst Ltd Method of processing optical device wafer
JP5860272B2 (en) * 2011-11-24 2016-02-16 株式会社ディスコ Processing method of optical device wafer
JP2013149932A (en) * 2011-12-20 2013-08-01 Nitto Denko Corp Substrate fragmentation method and substrate fragmentation device using the same

Also Published As

Publication number Publication date
JP2016068394A (en) 2016-05-09
CN106181056B (en) 2020-10-13
CN106181056A (en) 2016-12-07
JP6428113B2 (en) 2018-11-28
KR20160038715A (en) 2016-04-07
TWI655047B (en) 2019-04-01

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees