TW201611930A - Method and device to break apart patterned baseboard - Google Patents
Method and device to break apart patterned baseboardInfo
- Publication number
- TW201611930A TW201611930A TW104122534A TW104122534A TW201611930A TW 201611930 A TW201611930 A TW 201611930A TW 104122534 A TW104122534 A TW 104122534A TW 104122534 A TW104122534 A TW 104122534A TW 201611930 A TW201611930 A TW 201611930A
- Authority
- TW
- Taiwan
- Prior art keywords
- apart
- break
- baseboard
- patterned
- expanding
- Prior art date
Links
Landscapes
- Engineering & Computer Science (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Dicing (AREA)
- Laser Beam Processing (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Optics & Photonics (AREA)
- Ceramic Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Structural Engineering (AREA)
Abstract
This invention provides a method and device to break apart a patterned baseboard without un-separated and damaged patterned baseboards. The method and device to break apart a patterned baseboard which has an electronic circuitry pattern formed on the surface of a baseboard made of a brittle material comprise: a laser processing step (laser processing device (A)) to form multiple break-apart starting points (5) along a pre-determined break-apart line (L) by irradiating a laser beam onto the surface of a patterned baseboard (W) which is adhered to an expanding tape (2); an inspection/break-apart step (inspection/ break-apart device (B) to apply tension to the expanding tape (2) while inspecting the break-apart starting points (5) of the pre-determined break-apart line (L) by an optical inspection component (16), and apply an external pressure to bend and break apart the pre-determined break-apart line (L) having the incomplete break-apart starting points; and an expanding break-apart step (expanding break-apart device (C)) to stretch the expanding tape (2), which applies tensile stress to the patterned baseboard (W) for breaking apart all pre-determined break-apart line (L).
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014-200117 | 2014-09-30 | ||
JP2014200117A JP6428113B2 (en) | 2014-09-30 | 2014-09-30 | Breaking method and apparatus for patterning substrate |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201611930A true TW201611930A (en) | 2016-04-01 |
TWI655047B TWI655047B (en) | 2019-04-01 |
Family
ID=55789829
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW104122534A TWI655047B (en) | 2014-09-30 | 2015-07-13 | Method for disconnecting patterned substrate and disconnecting device |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6428113B2 (en) |
KR (1) | KR20160038715A (en) |
CN (1) | CN106181056B (en) |
TW (1) | TWI655047B (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11204336B2 (en) | 2016-03-30 | 2021-12-21 | Ngk Insulators, Ltd. | Sensor element and gas sensor |
JP7020660B2 (en) * | 2016-11-29 | 2022-02-16 | 三星ダイヤモンド工業株式会社 | Brittle material Substrate fragmentation method and fragmentation device |
CN115592257B (en) * | 2022-12-13 | 2023-04-18 | 西北电子装备技术研究所(中国电子科技集团公司第二研究所) | Mechanical stripping device for stripping wafer from laser modified crystal |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4409840B2 (en) * | 2002-03-12 | 2010-02-03 | 浜松ホトニクス株式会社 | Processing object cutting method |
US7820941B2 (en) * | 2004-07-30 | 2010-10-26 | Corning Incorporated | Process and apparatus for scoring a brittle material |
JP3887394B2 (en) * | 2004-10-08 | 2007-02-28 | 芝浦メカトロニクス株式会社 | Brittle material cleaving system and method |
JP2006147818A (en) * | 2004-11-19 | 2006-06-08 | Canon Inc | Method for dicing substrate |
CN100546004C (en) * | 2005-01-05 | 2009-09-30 | Thk株式会社 | The chalker of the method for cutting of workpiece and device, line and method for cutting and band break-in facility |
JP4847199B2 (en) * | 2006-04-25 | 2011-12-28 | 株式会社ディスコ | Breaking method of adhesive film attached to wafer |
JP2010045151A (en) * | 2008-08-12 | 2010-02-25 | Disco Abrasive Syst Ltd | Method of processing optical device wafer |
JP5121746B2 (en) * | 2009-01-29 | 2013-01-16 | 昭和電工株式会社 | Substrate cutting method and electronic device manufacturing method |
JP2011165766A (en) * | 2010-02-05 | 2011-08-25 | Disco Abrasive Syst Ltd | Method of processing optical device wafer |
JP5860272B2 (en) * | 2011-11-24 | 2016-02-16 | 株式会社ディスコ | Processing method of optical device wafer |
JP2013149932A (en) * | 2011-12-20 | 2013-08-01 | Nitto Denko Corp | Substrate fragmentation method and substrate fragmentation device using the same |
-
2014
- 2014-09-30 JP JP2014200117A patent/JP6428113B2/en not_active Expired - Fee Related
-
2015
- 2015-06-26 KR KR1020150090979A patent/KR20160038715A/en unknown
- 2015-07-03 CN CN201510388808.6A patent/CN106181056B/en active Active
- 2015-07-13 TW TW104122534A patent/TWI655047B/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JP2016068394A (en) | 2016-05-09 |
CN106181056B (en) | 2020-10-13 |
CN106181056A (en) | 2016-12-07 |
JP6428113B2 (en) | 2018-11-28 |
KR20160038715A (en) | 2016-04-07 |
TWI655047B (en) | 2019-04-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |