CN106181056B - Method and device for breaking patterned substrate - Google Patents
Method and device for breaking patterned substrate Download PDFInfo
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- CN106181056B CN106181056B CN201510388808.6A CN201510388808A CN106181056B CN 106181056 B CN106181056 B CN 106181056B CN 201510388808 A CN201510388808 A CN 201510388808A CN 106181056 B CN106181056 B CN 106181056B
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Abstract
Provided are a method and an apparatus for breaking a patterned substrate, which do not cause non-separation or substrate damage. A method and apparatus for breaking a patterned substrate having an electronic circuit pattern formed on a surface of a brittle material substrate, comprising: a laser processing step (laser processing device (A)) of attaching a patterned substrate (W) to a stretch tape (2) and irradiating the surface of the patterned substrate (W) with laser light to form a plurality of break start points (5) along a predetermined break line (L); an inspection/breaking step (inspection/breaking device (B)) of applying tension to the stretched adhesive tape (2), inspecting a breaking start point (5) of the predetermined breaking line (L) with an optical inspection member (16), and breaking the predetermined breaking line (L) having an incomplete breaking start point by flexing the substrate (W) by external pressure; and a stretch breaking step (stretch breaking device (C)) for applying a tensile stress to the patterned substrate (W) by stretching the stretch tape (2) to break all the predetermined breaking lines (L).
Description
Technical Field
The present invention relates to a method and apparatus for dividing a patterned substrate, on the surface of which a fine electronic circuit pattern is formed, into individual devices, the substrate being made of a brittle material such as glass, ceramic, or silicon.
Background
Conventionally, for example, patent document 1 and the like disclose a breaking method of a so-called "extended (expanded) method" in which a modified region (a crack region, a melt-processed region, a refractive index change region) formed by multiphoton absorption is formed inside a substrate along a predetermined breaking line by irradiating a surface of the substrate with a laser beam and focusing the surface into the substrate, and then a tensile stress is applied to the substrate to break the substrate with the modified region as a starting point.
The breaking method of the "stretch mode" will be described with reference to fig. 1 and 2, and fig. 9 and 10.
As shown in fig. 1 and 2, a patterned substrate W to be cut is attached to a stretchable tape (generally also referred to as a dicing tape) 2 stretched over a dicing ring 1, and a laser beam is irradiated to the patterned substrate W with a focal point P being focused on the inside of the substrate, thereby forming a cut starting point 5 of a modified region formed by multiphoton absorption in the substrate along a predetermined cut line L.
Next, as shown in fig. 9 and 10, the stretch tape 2 is placed on the lift table 19 'with the patterned substrate W positioned on the upper side, and the lift table 19' is raised to stretch (stretch) the stretch tape 2, thereby generating tensile stress in the patterned substrate W attached to the stretch tape 2 and breaking the patterned substrate W from the break starting point 5.
The formation of the break initiation point may also be formed by an initial crack propagation method using a thermal stress distribution. As shown in fig. 3, this method is a method in which an initial crack (trigger crack) is formed on the surface of the patterned substrate W attached to the stretch tape 2, and the laser beam is irradiated and heated while scanning from the beginning of the initial crack, and then a coolant is sprayed from a nozzle 6 of a cooling mechanism to the heated region. The initial crack (crack) is propagated along the predetermined breaking line on the surface of the patterned substrate W by the thermal stress distribution (temperature distribution) in the substrate thickness direction due to the compressive stress caused by heating at this time and the tensile stress caused by the subsequent rapid cooling. The propagating crack may be used as a starting point 5 for breaking.
The formation of the starting point of the break may be performed by forming an ablation (forming a groove) on the surface of the substrate, a modified region, and a modified region inside the substrate by irradiation with laser light (e.g., Ultraviolet (UV) laser), or may be performed by thermal stress crack propagation caused by heating and cooling with laser light (e.g., Infrared (IR) laser).
In the present invention, as described above, the modified region formed on the surface or inside of the substrate by multiphoton absorption by the laser, the groove formed by ablation, and the crack formed according to the thermal stress distribution are collectively referred to as "break starting point".
Documents of the prior art
Patent document
Patent document 1: japanese patent laid-open publication No. 2003-334812
Disclosure of Invention
Technical problem to be solved by the invention
In the above-described breaking method of the "stretch method", the break starting point formed along the planned disconnection line is broken by stretching the stretch tape, and therefore, the plurality of planned disconnection lines can be simultaneously broken with a small force.
However, when such a breaking method is employed, as shown in the plan view of fig. 5 (a) and the cross-sectional view of fig. 5 (b), if a pattern 13 such as TEG exists on the planned breaking line L, i.e., the laser-irradiated Street (Street), the pattern may obstruct the transmission of the laser light and may not form a sufficient breaking start point. Therefore, when the stretch tape 2 is stretched in the next stretch breaking step, the following problem occurs: that is, damage such as non-separation, dendritic cracking or disconnection other than the planned disconnection line L, or breakage of the electronic circuit pattern occurs.
Here, "TEG" refers to a semiconductor element that is manufactured separately from a main device in order to evaluate whether or not a desired device has been formed according to a process. TEG includes various elements such as wiring resistance measurement, via resistance measurement, pattern defect measurement by fine particles, diode characteristic measurement, short circuit measurement, and leakage measurement.
An object of the present invention is to provide a novel breaking method and breaking apparatus that can solve the above-described problems of the prior art and that does not cause unseparation or damage to the substrate.
Means for solving the technical problem
In order to achieve the above object, the present invention adopts the following technical solutions. That is, a breaking method according to the present invention is a method for breaking a patterned substrate having an electronic circuit pattern formed on a surface of a brittle material substrate such as glass, ceramic, or silicon, the method including: a laser processing step of attaching a patterned substrate to be cut to a stretchable adhesive tape having stretchability, and irradiating a surface of the patterned substrate with laser light to form a plurality of cut start points along a predetermined cut line; an inspection/breaking step of inspecting a breaking start point of a predetermined breaking line formed in the laser processing step using an optical inspection member while applying tension to the stretched tape, and breaking the detected predetermined breaking line having an incomplete breaking start point by flexing the patterned substrate by applying external pressure; and a stretch breaking step of applying a tensile stress to the patterned substrate by stretching the stretch tape, thereby breaking all the predetermined breaking lines.
In the present specification, the term "bending the patterned substrate" by applying external pressure to the non-separated portion includes, for example, pressing the non-separated portion with a knock-off bar to "bend the patterned substrate", and the same applies to the following.
The present invention is also a breaking device for a patterned substrate having an electronic circuit pattern formed on a surface of a brittle material substrate, the breaking device comprising: namely, comprising: a laser processing device having a laser irradiation portion for irradiating a surface of the patterned substrate attached to the stretch tape with a laser beam to form a plurality of break start points along a predetermined break line; an inspection/breaking device including an optical inspection part that inspects a breaking start point of a predetermined breaking line formed by the laser processing device while tension is applied to the spread tape, and a breaking blade that breaks the predetermined breaking line having an incomplete breaking start point detected by the optical inspection part by flexing the patterned substrate by applying external pressure with the breaking blade; and a stretch breaking device for applying a tensile stress to the patterned substrate by stretching the stretch tape, thereby breaking all the predetermined breaking lines.
The starting point of disconnection may be formed by generating a modified region due to multiphoton absorption in the substrate by irradiating the patterned substrate with a focused laser beam.
The starting point of disconnection may be formed by heating the surface of the patterned substrate while scanning the surface of the patterned substrate with laser light, and subsequently spraying a coolant from a nozzle of a cooling mechanism to a heating region to generate a crack in the surface of the patterned substrate due to a stress distribution in the thickness direction of the substrate caused by a compressive stress generated by the front heating and a tensile stress generated by the rear rapid cooling.
That is, the starting point of disconnection may be formed by forming an ablation (forming a groove) on the surface of the substrate, a modified region, and a modified region inside the substrate by irradiation with laser light (e.g., Ultraviolet (UV) laser), or may be formed by thermal stress crack propagation caused by heating and cooling by laser light (e.g., Infrared (IR) laser).
In the inspection/disconnection step, the disconnection may be performed each time the incomplete disconnection start point is detected while the disconnection start points are sequentially inspected, or the detected incomplete disconnection start points may be disconnected after all the disconnection start points are inspected.
Effects of the invention
According to the breaking method of the present invention, the optical inspection means detects a portion which is not completely formed as a breaking start point to be formed in the previous laser processing step and may be unseparated in the subsequent stretch breaking step, and applies external pressure to the detected portion to bend the patterned substrate, thereby breaking the detected portion in advance. This prevents the occurrence of unseparated portions when the stretch tape is stretched to break the patterned substrate in the subsequent stretch breaking step, and suppresses the occurrence of damage such as dendritic cracking or breaking other than the planned breaking line or breakage of the electronic circuit pattern, thereby obtaining a high-precision unit device having excellent end face strength.
Further, since the inspection step of the optical inspection member is performed in a state where tension is applied to the patterned substrate, the break start points that have been completely processed in the previous laser processing step are slightly separated, but the break start points that have been incompletely formed due to the pattern such as TEG are not separated and remain intact. This has the effect of allowing the light transmittance of the portion separated from the cut-off starting point and the non-separated portion to show a significant difference, allowing the brightness of the camera image to be easily determined, and allowing the non-separated portion to be accurately detected.
In the inspection/breaking step, it is preferable that the patterned substrate is bent (curved) by pressing a plate-like breaking blade having a sharp tip against a predetermined breaking line of an unseparated portion, thereby breaking the patterned substrate from the predetermined breaking line. This makes it possible to reliably break the non-separated portions of the patterned substrate.
Drawings
Fig. 1 is a perspective view showing a state in which a patterned substrate to be cut is attached to a stretch tape of a dicing ring.
Fig. 2 is an explanatory diagram illustrating an example of processing of the start point of disconnection.
Fig. 3 is an explanatory diagram showing another processing example of the starting point of disconnection.
Fig. 4 is a sectional view schematically showing the inspection/disconnection apparatus.
Fig. 5 (a) and (b) are a plan view and a sectional view showing a state where a TEG pattern is provided on a predetermined broken line of a patterned substrate.
Fig. 6 is a sectional view showing a disconnected state of the inspection/disconnection device.
Fig. 7 (a) and (b) are sectional views schematically showing the stretch breaking device.
Fig. 8 is a flow chart illustrating the disconnection method of the present invention.
Fig. 9 is a sectional view illustrating a breaking method in a conventional stretching system.
Fig. 10 is a sectional view showing a stretched state of the stretch tape after the elevating table of fig. 9 is raised.
Detailed Description
Hereinafter, the details of the breaking method and the breaking device according to the present invention will be described in detail with reference to the drawings.
The breaking method and breaking device of the present invention are directed to breaking a patterned substrate W having a pattern such as an electronic circuit or TEG formed on the surface of a brittle material substrate such as glass, ceramic, or silicon.
As shown in fig. 1 and 2, the patterned substrate W is attached to a stretchable adhesive tape 2 having stretchability, which is supported by a dicing ring 1, and is placed on a table 3 of a laser processing apparatus a. Then, the surface of the patterned substrate W is irradiated with laser light from the laser irradiation unit 4 while focusing the focal point P on the inside of the substrate, and a modified region (a weakened melt-processed region or the like) formed by multiphoton absorption, that is, a break starting point 5 is formed inside the substrate along a predetermined break line L in the X direction (or the Y direction). After the starting points 5 are formed along all the predetermined breaking lines in the X direction, the table 3 is rotated or the like to form the starting points 5 along the predetermined breaking lines L in the Y direction (laser processing step).
As described above, the starting point for disconnection 5 can also be formed by processing by a method utilizing thermal stress distribution.
That is, as shown in fig. 3, the surface of the patterned substrate W attached to the stretch tape 2 is heated while being scanned with laser light from the laser irradiation unit 4, and then coolant is sprayed from the nozzle 6 of the cooling mechanism to the heated region. By the thermal stress distribution (temperature distribution) in the substrate thickness direction due to the compressive stress caused by heating at this time and the tensile stress caused by rapid cooling next, the initial crack (crack) can be propagated on the surface of the patterned substrate W along the predetermined breaking line L, that is, a continuously propagated crack as the breaking start point 5 can be formed.
In the laser processing step, if a pattern 13 such as TEG exists on a planned dividing line L of the patterned substrate W, i.e., on a street (street) to which the laser light is irradiated, as shown in fig. 5, the pattern may obstruct the transmission of the laser light when the laser light is irradiated, and may fail to form a sufficient dividing start point, and may be formed incompletely and remain. Therefore, in the subsequent inspection/breaking step, an incomplete breaking start point is detected, and the breaking blade 12 described later is used to break the portion.
Fig. 4 schematically shows an inspection/breaking apparatus B for performing an inspection/breaking process, which has a pedestal 7 for placing and fixing the cutting ring 1 having the patterned substrate W. The intermediate portion of the base 7 is hollow, a stationary blade 11 having a flat upper surface is disposed in the hollow portion 9, and the position of the stationary blade 11 can be adjusted vertically. The fixed blade 11 is formed with a pair of left and right fixed blades 11a, 11b, and the pair of left and right fixed blades 11a, 11b receive both side portions of the patterned substrate W so as to sandwich a predetermined breaking line L to be broken, i.e., the breaking start point 5. A plate-shaped breaking blade 12 having a pointed end is disposed above the left and right stationary blades 11a and 11b so as to be movable up and down.
Further, an optical inspection member 16 is provided, the optical inspection member 16 including: a light source 14 for irradiating light between the stationary blades 11a and 11b from above, and a camera (for example, an IR camera) 15 disposed between the stationary blades 11a and 11b for observing the light from the light source 14.
The optical inspection part 16 is formed of: the position of the stationary blade 11 and the breaking blade 12 can be changed by moving them in the hollow portion 9 in the left-right direction (arrow direction) of fig. 4 in synchronization with each other.
The stationary blade 11 of the inspection/disconnection apparatus B is raised so that the upper surface of the stationary blade 11 is positioned above the pedestal 7, the dicing ring 1 is pressed against the pedestal 7 in a state where the patterned substrate W is positioned on the lower side, and the dicing ring 1 is fixed to the pedestal 7 in a state where tension is applied to the stretch tape 2.
By pressing against the cutting ring 1, the stretch tape 2 is stretched, and the patterned substrate W stuck thereon is pulled outward. Thus, although the cracks of the starting points 5 of the predetermined breaking lines L machined in the previous laser machining step progress in the substrate thickness direction and are slightly separated, the starting points 5 of the incomplete breaking lines L formed by the pattern such as TEG are not separated and remain as they are. The height of the stationary blade 11 is adjusted in advance so that the width of the crack at the break origin 5 separated by the stretching of the stretch tape 2 is 1 μm to 10 μm, preferably about 3 μm.
In this state, in order to bring the predetermined disconnection line L of the patterned substrate W directly below the light source 14, the light source 14 and the camera 15 are moved left and right together with the stationary blade 11, and light is irradiated from the light source 14, and it is determined whether or not the disconnection start point 5 is properly separated according to the brightness reflected in the image of the camera 15. Then, when it is determined that the substrate is not separated, as shown in fig. 6, the breaking blade 12 is lowered, and the non-separated portion is broken by pressing the patterned substrate W with a tap by a three-point bending moment formed by the breaking blade 12 and the stationary blades 11a and 11b to bend the patterned substrate W. The stretch tape 2 is preferably formed of a material that transmits light.
Since the non-separated portion can be detected from the brightness of the transmitted light when the inspection is performed by the optical inspection unit 16, an inspection instrument with an inexpensive and simple optical system can be used.
In the inspection/breaking step, the optical inspection unit 16 may sequentially inspect the breaking start point 5 of the planned breaking line L and break the intended breaking line L with the breaking blade 12 every time an unseparated portion is found; the detected non-separated portion may be cut by the cutting blade 12 after all the predetermined cut lines L are checked.
In the latter case, it is preferable to program the machining recipe designating the detected non-separated portion to be automatically input to a computer attached thereto, and after all the predetermined breaking lines L are checked, the non-separated portion is sequentially broken by the breaking blade 12 in accordance with the input machining recipe.
Next, the stretch breaking process is performed by the stretch breaking device C to completely break all the planned breaking lines L.
Fig. 7 shows the spreader-disconnector C with a stand 17 for placing the stationary cutting ring 1. The pedestal 17 is hollow at its middle portion, and a lift table 19 for receiving the patterned substrate W is disposed in the hollow portion 18. The lift table 19 is formed to be vertically movable by a lift mechanism 20 such as an air cylinder.
In the stretch breaking step, as shown in fig. 7 (a), the dicing ring 1 is turned over and placed on and fixed to the pedestal 17 in a state where the patterned substrate W faces upward.
Then, as shown in fig. 7 (b), the elevating mechanism 20 raises the elevating table 19 to stretch the stretch tape 2. By this stretching, the patterned substrate W attached to the stretch tape 2 is subjected to an outward tensile stress and is broken from the break starting points 5 as indicated by arrows, and all the predetermined break lines L are broken. The unit devices cut into individual pieces are taken out in a state of being attached to the stretch tape 2.
Further, the patterned substrate W (the unit devices that are cut into individual pieces) may be reattached to another dicing ring (the stretch tape) while the stretch tape 2 is stretched. In this case, since the unit devices which become broken into individual pieces are attached to the new stretch tape in an unstretched state, the broken unit devices can be easily taken out (picked up) from the stretch tape.
As shown in fig. 8, the steps of the disconnection method are schematically shown in a flowchart.
First, the laser processing apparatus a processes the break starting point 5 on the patterned substrate W attached to the stretch tape 2 (S1).
Next, tension is applied to the spread adhesive tape 2 by the inspecting/breaking device B to slightly separate the breaking start point 5 of the predetermined breaking line L (S2).
Next, the unseparated portion of the intended disconnection line L is detected by the optical inspection means 16 (S3).
Next, the unseparated portion of the intended disconnection line L is disconnected by the disconnection blade 12 of the inspection/disconnection device B (S4). The disconnection may be performed every time an unseparated portion is found while the optical inspection member 16 is being inspected, or may be performed after all the predetermined disconnection lines L have been inspected.
Next, the stretch tape 2 is stretched by the stretch breaking device C to stretch the patterned substrate W, thereby simultaneously breaking all the predetermined breaking lines L from the breaking start point 5 (S5).
As described above, according to the breaking method, the optical inspection unit 16 detects a portion where the starting point 5 to be formed on the patterned substrate W in the previous laser processing step is not completely formed and may be unseparated in the subsequent stretch breaking step, and applies external pressure to the detected portion by the breaking blade 12 to bend the patterned substrate W, thereby breaking the detected portion in advance. This prevents the occurrence of unseparated portions when the stretch tape 2 is stretched in the subsequent stretch breaking step, and suppresses the occurrence of damage such as dendritic cracks or breaks other than the planned breaking lines or breakage of the electronic circuit pattern, thereby obtaining a high-precision unit device having excellent end surface strength.
Since the inspection step of the optical inspection member 16 is performed in a state where tension is applied to the patterned substrate W, the break start points 5 that have been completely processed in the previous laser processing step are slightly separated, but the break start points that have been incompletely formed due to the pattern such as TEG are not separated and remain intact. This makes it possible to easily distinguish the brightness of the camera image and accurately detect the non-separated portion because the light transmittance of the portion separated from the disconnection starting point 5 and the non-separated portion significantly differ from each other.
While the present invention has been described with reference to the exemplary embodiments, the present invention is not limited to the above-described embodiments, and modifications and changes may be made as appropriate without departing from the scope of the claims.
For example, in the above embodiment, the inspection of the non-separated portion of the patterned substrate W and the breaking of the non-separated portion are performed in the inspection/breaking device B, but the non-separated inspection step of the optical inspection member may be performed on another stage (ステージ), and after the non-separated portion is detected, the breaking may be performed by the three-point bending type breaking unit formed by the breaking blade and the stationary blade.
In the above embodiment, the pattern substrate W attached to the stretch tape 2 is supported by the fixed blade 11 in the breaking step, but may be supported by a general table. When the patterned substrate is supported by the stage, it is preferable that an elastic body is disposed on the surface of the stage and supported via the elastic body, and for non-separation inspection, it is preferable to use a transparent stage and an elastic body.
Industrial applicability of the invention
The present invention is suitable for breaking a patterned substrate in which an electronic circuit pattern or a thin film is formed on a surface of a brittle material substrate such as glass or ceramic by stretching.
Description of the reference numerals
A laser processing device
B checking/disconnecting device
C-stretch disconnect
L predetermined disconnection line
W patterned substrate
1 cutting ring (ダイシングリング)
2 stretch adhesive tape
5 starting point of disconnection
11 fixed blade (receiving edge)
12 break blade (ブレイク blade)
13 TEG, etc. pattern
14 light source
15 Camera
16 optical inspection unit
19 lifting platform
20 lifting mechanism
Claims (9)
1. A method of breaking a patterned substrate having an electronic circuit pattern formed on a surface of a brittle material substrate, comprising:
a laser processing step of attaching the patterned substrate to be cut to a stretchable adhesive tape having stretchability, and irradiating a surface of the patterned substrate with laser light to form a plurality of cut start points along a predetermined cut line;
an inspection/breaking step of inspecting the breaking start point of the predetermined breaking line formed in the laser processing step using an optical inspection means while applying tension to the stretch tape to detect a TEG, and breaking the detected predetermined breaking line having the TEG by applying external pressure to bend the patterned substrate; and
and a stretch breaking step of applying a tensile stress to the patterned substrate by stretching the stretch tape to break all the predetermined breaking lines, thereby breaking the patterned substrate.
2. The method of claim 1, wherein,
in the checking/disconnecting step, the disconnection is performed every time the TEG is detected while the disconnection start point is checked in sequence.
3. The method of claim 1, wherein,
in the checking/disconnecting step, the detected TEG is disconnected after all the disconnection start points are checked.
4. The method for breaking a patterned substrate according to any one of claims 1 to 3, wherein,
the starting point of disconnection is formed by irradiating the patterned substrate with the laser beam focused on the substrate, thereby generating a modified region due to multiphoton absorption in the substrate.
5. The method for breaking a patterned substrate according to any one of claims 1 to 3, wherein,
the starting point of disconnection is formed by heating the surface of the patterned substrate by scanning the laser beam, and then spraying a coolant from a nozzle of a cooling mechanism to a heating region to generate a crack in the surface of the patterned substrate by a stress distribution in the substrate thickness direction due to a compressive stress generated by front heating and a tensile stress generated by rapid cooling in the rear.
6. The method for breaking a patterned substrate according to any one of claims 1 to 3, wherein,
in the inspection/breaking process, the patterned substrate is deflected by pressing a plate-shaped breaking blade having a pointed tip against a predetermined breaking line having a TEG, thereby breaking from the predetermined breaking line.
7. The method for breaking of a patterned substrate according to claim 4, wherein,
in the inspection/breaking process, the patterned substrate is deflected by pressing a plate-shaped breaking blade having a pointed tip against a predetermined breaking line having a TEG, thereby breaking from the predetermined breaking line.
8. The method of breaking of a patterned substrate according to claim 5,
in the inspection/breaking process, the patterned substrate is deflected by pressing a plate-shaped breaking blade having a pointed tip against a predetermined breaking line having a TEG, thereby breaking from the predetermined breaking line.
9. A breaking device of a patterned substrate having an electronic circuit pattern formed on a surface of a brittle material substrate, comprising:
a laser processing device having a laser irradiation portion for irradiating a surface of the patterned substrate attached to the stretch tape with a laser beam to form a plurality of break start points along a predetermined break line;
an inspection/breaking device including an optical inspection part that inspects the breaking start point of the predetermined breaking line formed by the laser processing device to detect a TEG while tension is applied to the stretched tape, and a breaking blade that breaks the predetermined breaking line having the TEG detected by the optical inspection part by flexing the patterned substrate by applying external pressure with the breaking blade; and
and a stretch breaking device which applies tensile stress to the patterned substrate by stretching the stretch tape, and breaks all the predetermined breaking lines to break the patterned substrate.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014-200117 | 2014-09-30 | ||
| JP2014200117A JP6428113B2 (en) | 2014-09-30 | 2014-09-30 | Breaking method and apparatus for patterning substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106181056A CN106181056A (en) | 2016-12-07 |
| CN106181056B true CN106181056B (en) | 2020-10-13 |
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| CN201510388808.6A Active CN106181056B (en) | 2014-09-30 | 2015-07-03 | Method and device for breaking patterned substrate |
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| Country | Link |
|---|---|
| JP (1) | JP6428113B2 (en) |
| KR (1) | KR20160038715A (en) |
| CN (1) | CN106181056B (en) |
| TW (1) | TWI655047B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US11204336B2 (en) | 2016-03-30 | 2021-12-21 | Ngk Insulators, Ltd. | Sensor element and gas sensor |
| JP7020660B2 (en) * | 2016-11-29 | 2022-02-16 | 三星ダイヤモンド工業株式会社 | Brittle material Substrate fragmentation method and fragmentation device |
| CN115592257B (en) * | 2022-12-13 | 2023-04-18 | 西北电子装备技术研究所(中国电子科技集团公司第二研究所) | Mechanical stripping device for stripping wafer from laser modified crystal |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1765561A (en) * | 2004-10-08 | 2006-05-03 | 芝浦机械电子装置股份有限公司 | Brittle workpiece splitting system and brittle workpiece splitting method |
| CN101005915A (en) * | 2004-07-30 | 2007-07-25 | 康宁股份有限公司 | Process and apparatus for scoring brittle material |
| CN101064274A (en) * | 2006-04-25 | 2007-10-31 | 株式会社迪斯科 | Method of dividing an adhesive film bonded to a wafer |
| CN101099228A (en) * | 2005-01-05 | 2008-01-02 | Thk株式会社 | Method and device for breaking work, method for scribing and breaking work, and scribing device with breaking function |
| CN102265386A (en) * | 2009-01-29 | 2011-11-30 | 昭和电工株式会社 | Method for cutting substrate and method for manufacturing electronic element |
| JP2013107128A (en) * | 2011-11-24 | 2013-06-06 | Disco Corp | Optical device wafer-processing method |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4409840B2 (en) * | 2002-03-12 | 2010-02-03 | 浜松ホトニクス株式会社 | Processing object cutting method |
| JP2006147818A (en) * | 2004-11-19 | 2006-06-08 | Canon Inc | Method for dicing substrate |
| JP2010045151A (en) * | 2008-08-12 | 2010-02-25 | Disco Abrasive Syst Ltd | Method of processing optical device wafer |
| JP2011165766A (en) * | 2010-02-05 | 2011-08-25 | Disco Abrasive Syst Ltd | Method of processing optical device wafer |
| JP2013149932A (en) * | 2011-12-20 | 2013-08-01 | Nitto Denko Corp | Substrate fragmentation method and substrate fragmentation device using the same |
-
2014
- 2014-09-30 JP JP2014200117A patent/JP6428113B2/en not_active Expired - Fee Related
-
2015
- 2015-06-26 KR KR1020150090979A patent/KR20160038715A/en unknown
- 2015-07-03 CN CN201510388808.6A patent/CN106181056B/en active Active
- 2015-07-13 TW TW104122534A patent/TWI655047B/en not_active IP Right Cessation
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101005915A (en) * | 2004-07-30 | 2007-07-25 | 康宁股份有限公司 | Process and apparatus for scoring brittle material |
| CN1765561A (en) * | 2004-10-08 | 2006-05-03 | 芝浦机械电子装置股份有限公司 | Brittle workpiece splitting system and brittle workpiece splitting method |
| CN101099228A (en) * | 2005-01-05 | 2008-01-02 | Thk株式会社 | Method and device for breaking work, method for scribing and breaking work, and scribing device with breaking function |
| CN101064274A (en) * | 2006-04-25 | 2007-10-31 | 株式会社迪斯科 | Method of dividing an adhesive film bonded to a wafer |
| CN102265386A (en) * | 2009-01-29 | 2011-11-30 | 昭和电工株式会社 | Method for cutting substrate and method for manufacturing electronic element |
| JP2013107128A (en) * | 2011-11-24 | 2013-06-06 | Disco Corp | Optical device wafer-processing method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106181056A (en) | 2016-12-07 |
| JP2016068394A (en) | 2016-05-09 |
| TW201611930A (en) | 2016-04-01 |
| JP6428113B2 (en) | 2018-11-28 |
| TWI655047B (en) | 2019-04-01 |
| KR20160038715A (en) | 2016-04-07 |
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