KR20160026895A - 밀봉 코팅을 구비하는 센서 - Google Patents

밀봉 코팅을 구비하는 센서 Download PDF

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Publication number
KR20160026895A
KR20160026895A KR1020157036518A KR20157036518A KR20160026895A KR 20160026895 A KR20160026895 A KR 20160026895A KR 1020157036518 A KR1020157036518 A KR 1020157036518A KR 20157036518 A KR20157036518 A KR 20157036518A KR 20160026895 A KR20160026895 A KR 20160026895A
Authority
KR
South Korea
Prior art keywords
inner housing
sensor
coating
lead frame
housing
Prior art date
Application number
KR1020157036518A
Other languages
English (en)
Korean (ko)
Inventor
토마스 야우흐
슈테판 요나스
요헨 자호브
토마스 루돌프
토마스 피셔
Original Assignee
콘티넨탈 테베스 아게 운트 코. 오하게
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 콘티넨탈 테베스 아게 운트 코. 오하게 filed Critical 콘티넨탈 테베스 아게 운트 코. 오하게
Publication of KR20160026895A publication Critical patent/KR20160026895A/ko

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
    • G01D11/24—Housings ; Casings for instruments
    • G01D11/245—Housings for sensors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/16—Making multilayered or multicoloured articles
    • B29C45/1671—Making multilayered or multicoloured articles with an insert
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3135—Double encapsulation or coating and encapsulation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/16—Making multilayered or multicoloured articles
    • B29C45/1657—Making multilayered or multicoloured articles using means for adhering or bonding the layers or parts to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Transmission And Conversion Of Sensor Element Output (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
KR1020157036518A 2013-07-01 2014-07-01 밀봉 코팅을 구비하는 센서 KR20160026895A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102013010878 2013-07-01
DE102013010878.0 2013-07-01
PCT/EP2014/063973 WO2015000905A1 (de) 2013-07-01 2014-07-01 Sensor mit abdichtender beschichtung

Publications (1)

Publication Number Publication Date
KR20160026895A true KR20160026895A (ko) 2016-03-09

Family

ID=51059459

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020157036518A KR20160026895A (ko) 2013-07-01 2014-07-01 밀봉 코팅을 구비하는 센서

Country Status (4)

Country Link
KR (1) KR20160026895A (zh)
CN (1) CN105358940B (zh)
DE (1) DE102014212720A1 (zh)
WO (1) WO2015000905A1 (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10362692B2 (en) 2015-04-10 2019-07-23 Hamlin Electronics (Suzhou) Co. Ltd. Encapsulated electrical device and method of fabrication
DE102016207664A1 (de) 2016-05-03 2017-11-09 Continental Teves Ag & Co. Ohg Sensorelement für ein kraftfahrzeug
CN109690326B (zh) 2016-09-26 2021-01-08 住友电装株式会社 传感器部件、传感器以及传感器的制造方法
EP3687758B1 (en) * 2018-11-16 2023-07-12 Hewlett-Packard Development Company, L.P. Two-step molding for a lead frame
DE102019210375A1 (de) * 2019-07-12 2021-01-14 Continental Teves Ag & Co. Ohg Verfahren zur Herstellung eines robusten Sensors

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62264648A (ja) * 1986-05-12 1987-11-17 Nec Corp 半導体装置の製造方法
US4974057A (en) * 1986-10-31 1990-11-27 Texas Instruments Incorporated Semiconductor device package with circuit board and resin
DE19612765A1 (de) 1996-03-29 1997-11-13 Teves Gmbh Alfred Kunststoffsensor und Verfahren zu dessen Herstellung
JP3671563B2 (ja) * 1996-12-09 2005-07-13 株式会社デンソー モールドｉｃをケースに固定した構造の半導体装置
DE102005025083B4 (de) * 2005-05-30 2007-05-24 Infineon Technologies Ag Thermoplast-Duroplast-Verbund und Verfahren zum Verbinden eines thermoplastischen Materials mit einem duroplastischen Material
JP2008209197A (ja) * 2007-02-26 2008-09-11 Sumiden Electronics Kk 回転検出センサ
JP5075171B2 (ja) * 2009-09-02 2012-11-14 パナソニック株式会社 超音波センサ

Also Published As

Publication number Publication date
CN105358940B (zh) 2018-04-24
CN105358940A (zh) 2016-02-24
WO2015000905A1 (de) 2015-01-08
DE102014212720A1 (de) 2015-01-08

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