Classifications

• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
  • G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
  • G01D11/24—Housings ; Casings for instruments
  • G01D11/245—Housings for sensors
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
  • B29C45/16—Making multilayered or multicoloured articles
  • B29C45/1671—Making multilayered or multicoloured articles with an insert
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L23/00—Details of semiconductor or other solid state devices
  • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
  • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
  • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
  • H01L23/3135—Double encapsulation or coating and encapsulation
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
  • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
  • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
  • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
  • B29C45/16—Making multilayered or multicoloured articles
  • B29C45/1657—Making multilayered or multicoloured articles using means for adhering or bonding the layers or parts to each other
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L23/00—Details of semiconductor or other solid state devices
  • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
  • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
  • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/0001—Technical content checked by a classifier
  • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

• the invention relates to a sensor according to the preamble of claim 1 and to a method for producing a sensor according to the preamble of claim 10.
• Speed sensors are known, such as the wheel speed sensor disclosed in document EP 0 889 774 B1, which comprises a leadframe which is equipped with a sensor element and a signal processing circuit.
• the sensor element and the signal processing circuit are embedded on the leadframe in a first inner plastic housing, which positioning elements for positioning in one
• Injection molding tool wherein these positioning elements have fins, which connect tightly with an outer plastic housing, in which the first inner plastic housing is embedded.
• Such an outer housing for example made of thermoplastic, in particular if its housing wall has a relatively low material thickness, can sometimes tend to absorb moisture and to let in the interior. In addition, components of the outer housing can get into the interior, which may interfere with electronic components. Particularly with relatively small dimen ⁇ measurements of the sensor, whereby the distances between conductor tracks of the lead frame and between electrical contacts are relatively small, can be caused to possibly fault currents and leakage currents.
• the invention is based on the object to propose a sensor and a method for producing a sensor which is relatively reliable or robust and / or relatively inexpensive and / or relatively well sealed against environmental influences or insensitive, and in particular has a relatively high durability of the seal or insensitivity.
• An inner housing is preferably understood as an inner housing and an outer housing preferably as an outer housing.
• an inner housing is in particular a housing which houses one, particularly preferably completely, one or more components, particularly preferably electronic components, which are arranged on a leadframe.
• the outer housing is preferably formed of thermoplastic and / or thermosetting plastic material.
• a component such as a sensor element or a signal processing circuit
• an electrical contacting and / or an attachment of the component to the leadframe is preferably understood.
• an electrically leit ⁇ capable leadframe is meant by a leadframe or a stamped grid made of metal.
• the coating is preferably designed such that it seals at least the first inner housing.
• sealing it is expediently understood that an ingress of moisture and / or substances that are detachable from the outer housing and can get inward and / or can diffuse from the outer housing to the inside, for example, in the first inner Housing or other internal housing, through which coating is avoided.
• the sensor preferably comprises one or two or three or more inner housings, which are in particular jointly at least partially embedded in the outer housing.
• An at least partially embedding a substantially complete embedding or sheathing is advantageously understood or alternatively preferably embedding, at least a portion, such as an inner casing / an electronic component of the outer casing / from which the electronic component is a ⁇ end of the bed inner housing remains uncovered.
• the sensor element and / or a Sig ⁇ nal kausscrien, in particular integrated in a common sensor element are arranged on the leadframe and is formed from the first inner housing, made of plastic, in particular from epoxy, are enclosed, wherein at least one leadframe structure protrudes from the first inner housing and / or ends substantially flush with the outer surface of the first inner housing as a stump,
• the coating is formed so that it surrounds the first inner housing from the outside substantially completely sealingly.
• the sensor element and the signal processing ⁇ circuit are expediently integrated into a common electronic component, for example in an ASIC. It is expedient for the coating to at least partially surround and / or coat the one or more lead frame structures which protrude from the first inner housing or terminate substantially flush with the outer surface of the first inner housing, so that the coating is formed in this way .
• exit region and / or boundary region of these one or more lead frame structures are sealed to / from the first inner housing with respect to this first inner housing.
• the senor has at least a first inner
• first inner housing and the second inner housing are electrically and mechanically connected to each other by at least one intermediate segment of the leadframe and
• the coating encloses this at least one intermediate segment of the leadframe
• the coating that surrounds the we ⁇ least one intermediate segment of the lead frame and parts of the first and second inner housing is formed integrally and / or in one piece and is formed sealingly.
• the part of the housing of the respective inner housing which is directly adjacent to the intermediate segment of the leadframe is preferably coated, or alternatively preferably substantially one fourth or one third or half of the region of the surface of the corresponding inner housing adjacent to the intermediate segment of the leadframe ,
• the coating is / is preferably produced by means of a plasma coating method and the coating is formed in particular from at least one organosilicate, particularly preferably as a thermosetting lacquer or as a thermosetting coating which is produced or deposited by the plasma coating process.
• the coating is formed from at least one protective lacquer.
• the protective lacquer is in particular ⁇ special designed as a lacquer having one or more of the following base materials: acrylic, polyurethane, acrylates, epoxy, silicone-acrylic, modified silicone. It is / is the
• Protective coating as a coating particularly preferably applied by spraying or dipping is made of a plastic, in particular a thermoplastic or a cast thermoset or a thermosetting potting compound.
• the sensor is preferably designed as a speed sensor, in particular as a wheel speed sensor, that is, as an alternative, preferably as a speed sensor for the drive motor
• Motor vehicle and particularly preferably as Kurbelwel ⁇ lensensor or camshaft sensor.
• the method is expediently designed to produce one or more of the variants of the sensor explained above. It is preferred that after the insertion of the leadframe with at least one electronic component, such as the sensor element and after the subsequent embedding of at least one such electronic component in an inner housing by an injection molding process, one or more parts of the leadframe or as dambar designated lead frames or a Dambars, which protrude after this injection molding process from this inner housing, are separated, for example by punching or free dancing. As a result, at least one stump of the leadframe / dambar is produced, which ends essentially flush with the surface of an inner housing.
• the invention also relates to the use of the sensor in motor vehicles, in particular as a speed sensor.
• FIG. 1 and FIG. 2 each show an embodiment of the sensor, which comprises a leadframe 3 on which electronic components (not illustrated in each case) are arranged, which are embedded in a first inner housing 1 and a second inner housing 2. It is for example arranged in accordance with the first inner housing 1, a sensor element and a signal processing circuit ⁇ and embedded in the second inner housing 2, a capacitor as an electronic protection element.
• the first and second inner housings 1 and 2 are completely sealed by coating 3, wherein the coating 3 also completely or integrally completely covers the non-lead frame except for the ends of the two leadframe legs 7, which are provided for electrical contacting of the sensor are, as far as the leadframe 3 protrudes from the inner housings 1 and 2.
• First inner housing 1 has substantially flush on its outer surface a stump 5 of the leadframe or a leadframe structure, which is also covered by coating 3.
• Be ⁇ coating 3 is in contrast to FIG. Configured such that it encloses an intermediate segment of the lead frame 3, and also at least the portions of the first inner housing 1 and the envelopes the second inner housing 2, in which the at least one intermediate segment of the leadframe enters into these housing, said coated area, for example, each substantially equal to a third of the surface of the first inner and second inner housing 1, 2.
• Blunt 5 of the leadframe is not covered or covered by coating 3 in this embodiment.

Landscapes

• Engineering & Computer Science (AREA)
• Physics & Mathematics (AREA)
• General Physics & Mathematics (AREA)
• Manufacturing & Machinery (AREA)
• Mechanical Engineering (AREA)
• Condensed Matter Physics & Semiconductors (AREA)
• Computer Hardware Design (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Power Engineering (AREA)
• Transmission And Conversion Of Sensor Element Output (AREA)
• Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Priority Applications (2)

Applications Claiming Priority (2)

Publications (1)

Family

ID=51059459

Family Applications (1)

Country Status (4)

Cited By (1)

Families Citing this family (4)

Citations (5)

Family Cites Families (2)

• 2014
  • 2014-07-01 DE DE102014212720.3A patent/DE102014212720A1/de not_active Withdrawn
  • 2014-07-01 CN CN201480038078.0A patent/CN105358940B/zh active Active
  • 2014-07-01 KR KR1020157036518A patent/KR20160026895A/ko not_active Application Discontinuation
  • 2014-07-01 WO PCT/EP2014/063973 patent/WO2015000905A1/de active Application Filing

Patent Citations (5)

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