DE102014212720A1 - Sensor mit abdichtender Beschichtung - Google Patents

Sensor mit abdichtender Beschichtung Download PDF

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Publication number
DE102014212720A1
DE102014212720A1 DE102014212720.3A DE102014212720A DE102014212720A1 DE 102014212720 A1 DE102014212720 A1 DE 102014212720A1 DE 102014212720 A DE102014212720 A DE 102014212720A DE 102014212720 A1 DE102014212720 A1 DE 102014212720A1
Authority
DE
Germany
Prior art keywords
inner housing
sensor
coating
leadframe
housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE102014212720.3A
Other languages
German (de)
English (en)
Inventor
Thomas Jauch
Stephan Jonas
Jochen Zachow
Thomas Rudolph
Thomas Fischer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Continental Teves AG and Co OHG
Original Assignee
Continental Teves AG and Co OHG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Continental Teves AG and Co OHG filed Critical Continental Teves AG and Co OHG
Priority to DE102014212720.3A priority Critical patent/DE102014212720A1/de
Publication of DE102014212720A1 publication Critical patent/DE102014212720A1/de
Withdrawn legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
    • G01D11/24—Housings ; Casings for instruments
    • G01D11/245—Housings for sensors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/16—Making multilayered or multicoloured articles
    • B29C45/1671—Making multilayered or multicoloured articles with an insert
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3135—Double encapsulation or coating and encapsulation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/16—Making multilayered or multicoloured articles
    • B29C45/1657—Making multilayered or multicoloured articles using means for adhering or bonding the layers or parts to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Transmission And Conversion Of Sensor Element Output (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
DE102014212720.3A 2013-07-01 2014-07-01 Sensor mit abdichtender Beschichtung Withdrawn DE102014212720A1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE102014212720.3A DE102014212720A1 (de) 2013-07-01 2014-07-01 Sensor mit abdichtender Beschichtung

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102013010878 2013-07-01
DE102013010878.0 2013-07-01
DE102014212720.3A DE102014212720A1 (de) 2013-07-01 2014-07-01 Sensor mit abdichtender Beschichtung

Publications (1)

Publication Number Publication Date
DE102014212720A1 true DE102014212720A1 (de) 2015-01-08

Family

ID=51059459

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102014212720.3A Withdrawn DE102014212720A1 (de) 2013-07-01 2014-07-01 Sensor mit abdichtender Beschichtung

Country Status (4)

Country Link
KR (1) KR20160026895A (zh)
CN (1) CN105358940B (zh)
DE (1) DE102014212720A1 (zh)
WO (1) WO2015000905A1 (zh)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016161617A1 (en) * 2015-04-10 2016-10-13 Hamlin Electronics Suzhou Co. Ltd Encapsulated electrical device and method of fabrication
DE102016207664A1 (de) * 2016-05-03 2017-11-09 Continental Teves Ag & Co. Ohg Sensorelement für ein kraftfahrzeug
DE102019210375A1 (de) * 2019-07-12 2021-01-14 Continental Teves Ag & Co. Ohg Verfahren zur Herstellung eines robusten Sensors
US11448531B2 (en) 2016-09-26 2022-09-20 Sumitomo Wiring Systems, Ltd. Sensor component, sensor, and method for manufacturing sensor

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3687758B1 (en) * 2018-11-16 2023-07-12 Hewlett-Packard Development Company, L.P. Two-step molding for a lead frame

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0889774B1 (de) 1996-03-29 2002-01-09 Continental Teves AG & Co. oHG Kunststoffsensor und verfahren zu dessen herstellung

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62264648A (ja) * 1986-05-12 1987-11-17 Nec Corp 半導体装置の製造方法
US4974057A (en) * 1986-10-31 1990-11-27 Texas Instruments Incorporated Semiconductor device package with circuit board and resin
JP3671563B2 (ja) * 1996-12-09 2005-07-13 株式会社デンソー モールドｉｃをケースに固定した構造の半導体装置
DE102005025083B4 (de) * 2005-05-30 2007-05-24 Infineon Technologies Ag Thermoplast-Duroplast-Verbund und Verfahren zum Verbinden eines thermoplastischen Materials mit einem duroplastischen Material
JP2008209197A (ja) * 2007-02-26 2008-09-11 Sumiden Electronics Kk 回転検出センサ
JP5075171B2 (ja) * 2009-09-02 2012-11-14 パナソニック株式会社 超音波センサ

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0889774B1 (de) 1996-03-29 2002-01-09 Continental Teves AG & Co. oHG Kunststoffsensor und verfahren zu dessen herstellung

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016161617A1 (en) * 2015-04-10 2016-10-13 Hamlin Electronics Suzhou Co. Ltd Encapsulated electrical device and method of fabrication
US10362692B2 (en) 2015-04-10 2019-07-23 Hamlin Electronics (Suzhou) Co. Ltd. Encapsulated electrical device and method of fabrication
DE102016207664A1 (de) * 2016-05-03 2017-11-09 Continental Teves Ag & Co. Ohg Sensorelement für ein kraftfahrzeug
US10718640B2 (en) 2016-05-03 2020-07-21 Continental Teves Ag & Co. Ohg Sensor element for a motor vehicle
US11448531B2 (en) 2016-09-26 2022-09-20 Sumitomo Wiring Systems, Ltd. Sensor component, sensor, and method for manufacturing sensor
DE102019210375A1 (de) * 2019-07-12 2021-01-14 Continental Teves Ag & Co. Ohg Verfahren zur Herstellung eines robusten Sensors

Also Published As

Publication number Publication date
CN105358940B (zh) 2018-04-24
CN105358940A (zh) 2016-02-24
WO2015000905A1 (de) 2015-01-08
KR20160026895A (ko) 2016-03-09

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R163 Identified publications notified
R163 Identified publications notified

Effective date: 20150430

R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee