KR20150140221A - 금속박이 부착된 액정 폴리머 필름과, 그 제조 방법, 및, 다층 프린트 배선판과, 그 제조 방법 - Google Patents

금속박이 부착된 액정 폴리머 필름과, 그 제조 방법, 및, 다층 프린트 배선판과, 그 제조 방법 Download PDF

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Publication number
KR20150140221A
KR20150140221A KR1020150077665A KR20150077665A KR20150140221A KR 20150140221 A KR20150140221 A KR 20150140221A KR 1020150077665 A KR1020150077665 A KR 1020150077665A KR 20150077665 A KR20150077665 A KR 20150077665A KR 20150140221 A KR20150140221 A KR 20150140221A
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KR
South Korea
Prior art keywords
metal foil
liquid crystal
polymer film
crystal polymer
bonding sheet
Prior art date
Application number
KR1020150077665A
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English (en)
Korean (ko)
Inventor
다다시 모리
마사야 고야마
미노루 우노
Original Assignee
파나소닉 아이피 매니지먼트 가부시키가이샤
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Publication date
Application filed by 파나소닉 아이피 매니지먼트 가부시키가이샤 filed Critical 파나소닉 아이피 매니지먼트 가부시키가이샤
Publication of KR20150140221A publication Critical patent/KR20150140221A/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/02—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
    • B32B37/025—Transfer laminating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
    • B32B37/22—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of both discrete and continuous layers
    • B32B37/223—One or more of the layers being plastic
    • B32B37/226—Laminating sheets, panels or inserts between two continuous plastic layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/03—3 layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0141—Liquid crystal polymer [LCP]

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)
KR1020150077665A 2014-06-05 2015-06-02 금속박이 부착된 액정 폴리머 필름과, 그 제조 방법, 및, 다층 프린트 배선판과, 그 제조 방법 KR20150140221A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2014-117069 2014-06-05
JP2014117069 2014-06-05

Publications (1)

Publication Number Publication Date
KR20150140221A true KR20150140221A (ko) 2015-12-15

Family

ID=54714180

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150077665A KR20150140221A (ko) 2014-06-05 2015-06-02 금속박이 부착된 액정 폴리머 필름과, 그 제조 방법, 및, 다층 프린트 배선판과, 그 제조 방법

Country Status (4)

Country Link
JP (1) JP6653466B2 (zh)
KR (1) KR20150140221A (zh)
CN (2) CN105128450A (zh)
TW (1) TWI551439B (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10668697B2 (en) * 2016-05-20 2020-06-02 Panasonic Intellectual Property Management Co., Ltd. Method for manufacturing metal clad laminated board, method for manufacturing electronic circuit board, and rigid body pendulum type viscoelasticity measuring device
CN105973091A (zh) * 2016-06-22 2016-09-28 韩德庆 一种玻璃定栅数显卡尺
KR102214641B1 (ko) * 2018-07-16 2021-02-10 삼성전기주식회사 인쇄회로기판
TWI697409B (zh) * 2019-02-25 2020-07-01 臻鼎科技股份有限公司 覆卷材料層疊體及其製備方法
JP7458396B2 (ja) 2019-06-17 2024-03-29 株式会社クラレ 金属張積層体の製造方法
CN112433405B (zh) * 2020-11-24 2022-04-19 中国科学技术大学 一种液晶高分子基板及其加工方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5719354A (en) * 1994-09-16 1998-02-17 Hoechst Celanese Corp. Monolithic LCP polymer microelectronic wiring modules
JPH1027960A (ja) * 1996-07-09 1998-01-27 Mitsui Mining & Smelting Co Ltd 多層プリント配線板の製造方法
JP2000264987A (ja) * 1999-03-11 2000-09-26 Kuraray Co Ltd 熱可塑性液晶ポリマーフィルムの熱処理方法
JP4064897B2 (ja) * 2002-08-28 2008-03-19 株式会社クラレ 多層回路基板およびその製造方法
JP2005081649A (ja) * 2003-09-08 2005-03-31 Toray Eng Co Ltd 液晶ポリマーフィルム積層基材の製造方法
JP4615226B2 (ja) * 2004-02-06 2011-01-19 古河電気工業株式会社 基板用複合材及びそれを用いた回路基板
JP2007258697A (ja) * 2006-02-27 2007-10-04 Nippon Steel Chem Co Ltd 多層プリント配線板の製造方法
TWI443015B (zh) * 2007-01-16 2014-07-01 Sumitomo Bakelite Co 絕緣樹脂片積層體、由該絕緣樹脂片積層體所積層而成之多層印刷配線板
WO2009064121A2 (en) * 2007-11-13 2009-05-22 Samsung Fine Chemicals Co., Ltd. Prepreg having uniform permittivity, and metal clad laminates and print wiring board using the same
JP5382410B2 (ja) * 2008-09-25 2014-01-08 日立化成株式会社 三層配線基板及びその製造方法
JP5661051B2 (ja) * 2010-01-29 2015-01-28 新日鉄住金化学株式会社 片面金属張積層体の製造方法
KR101913368B1 (ko) * 2010-08-12 2018-10-30 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 금속장 적층판

Also Published As

Publication number Publication date
CN105128450A (zh) 2015-12-09
TW201605612A (zh) 2016-02-16
CN110328934A (zh) 2019-10-15
JP2016010967A (ja) 2016-01-21
TWI551439B (zh) 2016-10-01
JP6653466B2 (ja) 2020-02-26

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