KR20150092077A - 도전 재료, 접속 구조체 및 접속 구조체의 제조 방법 - Google Patents

도전 재료, 접속 구조체 및 접속 구조체의 제조 방법 Download PDF

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KR20150092077A
KR20150092077A KR1020157002618A KR20157002618A KR20150092077A KR 20150092077 A KR20150092077 A KR 20150092077A KR 1020157002618 A KR1020157002618 A KR 1020157002618A KR 20157002618 A KR20157002618 A KR 20157002618A KR 20150092077 A KR20150092077 A KR 20150092077A
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South Korea
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conductive material
conductive
compound
connection
particles
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KR1020157002618A
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English (en)
Korean (ko)
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아끼라 유우끼
준이찌 시마오까
은철 손
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세키스이가가쿠 고교가부시키가이샤
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Publication of KR20150092077A publication Critical patent/KR20150092077A/ko

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/24—Electrically-conducting paints
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/66—Additives characterised by particle size
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H01L51/0021—
    • H01L51/0024—
    • H01L51/5203—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional radiating surfaces
    • H05B33/26—Light sources with substantially two-dimensional radiating surfaces characterised by the composition or arrangement of the conductive material used as an electrode
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/82—Interconnections, e.g. terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/50—Forming devices by joining two substrates together, e.g. lamination techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/60—Forming conductive regions or layers, e.g. electrodes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/02—Ingredients treated with inorganic substances
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/331—Nanoparticles used in non-emissive layers, e.g. in packaging layer

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Physics & Mathematics (AREA)
  • Inorganic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Conductive Materials (AREA)
  • Electroluminescent Light Sources (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
KR1020157002618A 2012-12-06 2013-12-06 도전 재료, 접속 구조체 및 접속 구조체의 제조 방법 KR20150092077A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012267379 2012-12-06
JPJP-P-2012-267379 2012-12-06
PCT/JP2013/082822 WO2014088095A1 (ja) 2012-12-06 2013-12-06 導電材料、接続構造体及び接続構造体の製造方法

Publications (1)

Publication Number Publication Date
KR20150092077A true KR20150092077A (ko) 2015-08-12

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KR1020157002618A KR20150092077A (ko) 2012-12-06 2013-12-06 도전 재료, 접속 구조체 및 접속 구조체의 제조 방법

Country Status (4)

Country Link
JP (1) JP6364191B2 (ja)
KR (1) KR20150092077A (ja)
CN (1) CN104541333A (ja)
WO (1) WO2014088095A1 (ja)

Cited By (1)

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KR20180081454A (ko) * 2015-11-11 2018-07-16 세키스이가가쿠 고교가부시키가이샤 입자, 입자 재료, 접속 재료 및 접속 구조체

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JP2016178303A (ja) * 2015-03-18 2016-10-06 積水化学工業株式会社 太陽電池モジュール用導電材料及び太陽電池モジュール
CN107251163A (zh) * 2015-08-19 2017-10-13 积水化学工业株式会社 导电材料及连接结构体
KR101900544B1 (ko) * 2015-12-07 2018-09-19 삼성에스디아이 주식회사 이방 도전성 필름용 조성물, 이방 도전성 필름 및 이를 이용한 접속 구조체
JP2017147163A (ja) * 2016-02-19 2017-08-24 三菱マテリアル株式会社 導電性ペースト及びこれを用いて形成された導電性膜
CN105722254A (zh) * 2016-02-24 2016-06-29 东莞珂洛赫慕电子材料科技有限公司 一种柔性电热膜用光固化型电阻浆料及其制备方法
KR101805298B1 (ko) * 2016-03-22 2017-12-05 주식회사 케이씨씨 열경화형 접착 필름
JP7028641B2 (ja) * 2016-05-19 2022-03-02 積水化学工業株式会社 導電材料及び接続構造体
WO2018163921A1 (ja) * 2017-03-06 2018-09-13 デクセリアルズ株式会社 樹脂組成物、樹脂組成物の製造方法、及び構造体
CN109983543B (zh) * 2017-03-30 2021-07-02 积水化学工业株式会社 导电性粒子、导电材料以及连接结构体
WO2020128976A1 (en) * 2018-12-19 2020-06-25 Oqab Dietrich Induction Inc. Induction-based systems and methods for joining substrates

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180081454A (ko) * 2015-11-11 2018-07-16 세키스이가가쿠 고교가부시키가이샤 입자, 입자 재료, 접속 재료 및 접속 구조체

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JP6364191B2 (ja) 2018-07-25
WO2014088095A1 (ja) 2014-06-12
JPWO2014088095A1 (ja) 2017-01-05
CN104541333A (zh) 2015-04-22

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