KR20150090833A - 반도체 웨이퍼의 가공 방법 - Google Patents
반도체 웨이퍼의 가공 방법 Download PDFInfo
- Publication number
- KR20150090833A KR20150090833A KR1020150004004A KR20150004004A KR20150090833A KR 20150090833 A KR20150090833 A KR 20150090833A KR 1020150004004 A KR1020150004004 A KR 1020150004004A KR 20150004004 A KR20150004004 A KR 20150004004A KR 20150090833 A KR20150090833 A KR 20150090833A
- Authority
- KR
- South Korea
- Prior art keywords
- passivation film
- laser beam
- semiconductor wafer
- street
- dividing groove
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 66
- 238000003672 processing method Methods 0.000 title claims description 4
- 238000002161 passivation Methods 0.000 claims abstract description 66
- 239000011521 glass Substances 0.000 claims abstract description 40
- 238000000034 method Methods 0.000 claims abstract description 28
- 239000000758 substrate Substances 0.000 claims abstract description 10
- 230000001678 irradiating effect Effects 0.000 claims description 17
- 238000010521 absorption reaction Methods 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 abstract description 4
- 238000005192 partition Methods 0.000 abstract description 4
- 230000005540 biological transmission Effects 0.000 abstract description 3
- 230000006378 damage Effects 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 description 50
- 238000003754 machining Methods 0.000 description 13
- 230000001681 protective effect Effects 0.000 description 8
- 238000002679 ablation Methods 0.000 description 6
- 238000003384 imaging method Methods 0.000 description 4
- 230000010355 oscillation Effects 0.000 description 4
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 229910004018 SiF Inorganic materials 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Inorganic materials [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/268—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- High Energy & Nuclear Physics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Laser Beam Processing (AREA)
- Dicing (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014014134A JP2015142015A (ja) | 2014-01-29 | 2014-01-29 | 半導体ウェーハの加工方法 |
JPJP-P-2014-014134 | 2014-01-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20150090833A true KR20150090833A (ko) | 2015-08-06 |
Family
ID=53695045
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020150004004A KR20150090833A (ko) | 2014-01-29 | 2015-01-12 | 반도체 웨이퍼의 가공 방법 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP2015142015A (zh) |
KR (1) | KR20150090833A (zh) |
CN (1) | CN104810323A (zh) |
SG (1) | SG10201500436XA (zh) |
TW (1) | TW201532135A (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6564301B2 (ja) * | 2015-10-26 | 2019-08-21 | 東京応化工業株式会社 | 支持体分離方法 |
JP2018060988A (ja) * | 2016-10-04 | 2018-04-12 | 日本特殊陶業株式会社 | 蓋部材、発光装置、およびこれらの製造方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0821623B2 (ja) * | 1985-09-20 | 1996-03-04 | 株式会社日立製作所 | レ−ザ処理方法 |
US6562698B2 (en) * | 1999-06-08 | 2003-05-13 | Kulicke & Soffa Investments, Inc. | Dual laser cutting of wafers |
US20070272666A1 (en) * | 2006-05-25 | 2007-11-29 | O'brien James N | Infrared laser wafer scribing using short pulses |
JP2011165766A (ja) * | 2010-02-05 | 2011-08-25 | Disco Abrasive Syst Ltd | 光デバイスウエーハの加工方法 |
JP2013102039A (ja) * | 2011-11-08 | 2013-05-23 | Disco Abrasive Syst Ltd | 半導体ウエーハの加工方法 |
-
2014
- 2014-01-29 JP JP2014014134A patent/JP2015142015A/ja active Pending
- 2014-12-04 TW TW103142147A patent/TW201532135A/zh unknown
-
2015
- 2015-01-12 KR KR1020150004004A patent/KR20150090833A/ko not_active Application Discontinuation
- 2015-01-20 SG SG10201500436XA patent/SG10201500436XA/en unknown
- 2015-01-27 CN CN201510039063.2A patent/CN104810323A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
CN104810323A (zh) | 2015-07-29 |
JP2015142015A (ja) | 2015-08-03 |
TW201532135A (zh) | 2015-08-16 |
SG10201500436XA (en) | 2015-08-28 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7585751B2 (en) | Wafer dividing method using laser beam with an annular spot | |
KR102150207B1 (ko) | 레이저 가공 방법 및 레이저 가공 장치 | |
JP4408361B2 (ja) | ウエーハの分割方法 | |
US7129150B2 (en) | Method of dividing a semiconductor wafer | |
US20120292297A1 (en) | Laser processing method and laser processing apparatus | |
KR20140095424A (ko) | 웨이퍼 가공 방법 | |
JP4977412B2 (ja) | レーザー加工装置 | |
JP2007173475A (ja) | ウエーハの分割方法 | |
KR20140105375A (ko) | 웨이퍼의 가공 방법 | |
KR102349663B1 (ko) | 웨이퍼의 가공 방법 | |
JP2005142398A (ja) | 半導体ウエーハの分割方法 | |
JP2004160483A (ja) | レーザー加工方法およびレーザー加工装置 | |
JP5992731B2 (ja) | ウエーハの加工方法 | |
KR20150043975A (ko) | 웨이퍼의 가공 방법 | |
JP2005209719A (ja) | 半導体ウエーハの加工方法 | |
KR20110089053A (ko) | 레이저 가공 장치 | |
KR20160088808A (ko) | 웨이퍼의 가공 방법 | |
JP2004179302A (ja) | 半導体ウエーハの分割方法 | |
JP6636384B2 (ja) | ウェーハの加工方法 | |
JP6113477B2 (ja) | ウエーハのレーザー加工方法およびレーザー加工装置 | |
KR101530390B1 (ko) | 레이저 가공 장치 | |
JP2006205187A (ja) | レーザー加工装置 | |
JP5453123B2 (ja) | 切削方法 | |
KR20150090833A (ko) | 반도체 웨이퍼의 가공 방법 | |
JP2010194584A (ja) | レーザー加工装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WITN | Withdrawal due to no request for examination |