SG10201500436XA - Semiconductor wafer processing method - Google Patents

Semiconductor wafer processing method

Info

Publication number
SG10201500436XA
SG10201500436XA SG10201500436XA SG10201500436XA SG10201500436XA SG 10201500436X A SG10201500436X A SG 10201500436XA SG 10201500436X A SG10201500436X A SG 10201500436XA SG 10201500436X A SG10201500436X A SG 10201500436XA SG 10201500436X A SG10201500436X A SG 10201500436XA
Authority
SG
Singapore
Prior art keywords
processing method
semiconductor wafer
wafer processing
semiconductor
wafer
Prior art date
Application number
SG10201500436XA
Other languages
English (en)
Inventor
Aikawa Chikara
Odanaka Kentaro
Tsuchiya Toshio
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of SG10201500436XA publication Critical patent/SG10201500436XA/en

Links

SG10201500436XA 2014-01-29 2015-01-20 Semiconductor wafer processing method SG10201500436XA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014014134A JP2015142015A (ja) 2014-01-29 2014-01-29 半導体ウェーハの加工方法

Publications (1)

Publication Number Publication Date
SG10201500436XA true SG10201500436XA (en) 2015-08-28

Family

ID=53695045

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201500436XA SG10201500436XA (en) 2014-01-29 2015-01-20 Semiconductor wafer processing method

Country Status (5)

Country Link
JP (1) JP2015142015A (zh)
KR (1) KR20150090833A (zh)
CN (1) CN104810323A (zh)
SG (1) SG10201500436XA (zh)
TW (1) TW201532135A (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6564301B2 (ja) * 2015-10-26 2019-08-21 東京応化工業株式会社 支持体分離方法
JP2018060988A (ja) * 2016-10-04 2018-04-12 日本特殊陶業株式会社 蓋部材、発光装置、およびこれらの製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0821623B2 (ja) * 1985-09-20 1996-03-04 株式会社日立製作所 レ−ザ処理方法
US6562698B2 (en) * 1999-06-08 2003-05-13 Kulicke & Soffa Investments, Inc. Dual laser cutting of wafers
US20070272666A1 (en) * 2006-05-25 2007-11-29 O'brien James N Infrared laser wafer scribing using short pulses
JP2011165766A (ja) * 2010-02-05 2011-08-25 Disco Abrasive Syst Ltd 光デバイスウエーハの加工方法
JP2013102039A (ja) * 2011-11-08 2013-05-23 Disco Abrasive Syst Ltd 半導体ウエーハの加工方法

Also Published As

Publication number Publication date
CN104810323A (zh) 2015-07-29
KR20150090833A (ko) 2015-08-06
JP2015142015A (ja) 2015-08-03
TW201532135A (zh) 2015-08-16

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