SG10201500436XA - Semiconductor wafer processing method - Google Patents
Semiconductor wafer processing methodInfo
- Publication number
- SG10201500436XA SG10201500436XA SG10201500436XA SG10201500436XA SG10201500436XA SG 10201500436X A SG10201500436X A SG 10201500436XA SG 10201500436X A SG10201500436X A SG 10201500436XA SG 10201500436X A SG10201500436X A SG 10201500436XA SG 10201500436X A SG10201500436X A SG 10201500436XA
- Authority
- SG
- Singapore
- Prior art keywords
- processing method
- semiconductor wafer
- wafer processing
- semiconductor
- wafer
- Prior art date
Links
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014014134A JP2015142015A (ja) | 2014-01-29 | 2014-01-29 | 半導体ウェーハの加工方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201500436XA true SG10201500436XA (en) | 2015-08-28 |
Family
ID=53695045
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201500436XA SG10201500436XA (en) | 2014-01-29 | 2015-01-20 | Semiconductor wafer processing method |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP2015142015A (zh) |
KR (1) | KR20150090833A (zh) |
CN (1) | CN104810323A (zh) |
SG (1) | SG10201500436XA (zh) |
TW (1) | TW201532135A (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6564301B2 (ja) * | 2015-10-26 | 2019-08-21 | 東京応化工業株式会社 | 支持体分離方法 |
JP2018060988A (ja) * | 2016-10-04 | 2018-04-12 | 日本特殊陶業株式会社 | 蓋部材、発光装置、およびこれらの製造方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0821623B2 (ja) * | 1985-09-20 | 1996-03-04 | 株式会社日立製作所 | レ−ザ処理方法 |
US6562698B2 (en) * | 1999-06-08 | 2003-05-13 | Kulicke & Soffa Investments, Inc. | Dual laser cutting of wafers |
US20070272666A1 (en) * | 2006-05-25 | 2007-11-29 | O'brien James N | Infrared laser wafer scribing using short pulses |
JP2011165766A (ja) * | 2010-02-05 | 2011-08-25 | Disco Abrasive Syst Ltd | 光デバイスウエーハの加工方法 |
JP2013102039A (ja) * | 2011-11-08 | 2013-05-23 | Disco Abrasive Syst Ltd | 半導体ウエーハの加工方法 |
-
2014
- 2014-01-29 JP JP2014014134A patent/JP2015142015A/ja active Pending
- 2014-12-04 TW TW103142147A patent/TW201532135A/zh unknown
-
2015
- 2015-01-12 KR KR1020150004004A patent/KR20150090833A/ko not_active Application Discontinuation
- 2015-01-20 SG SG10201500436XA patent/SG10201500436XA/en unknown
- 2015-01-27 CN CN201510039063.2A patent/CN104810323A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
CN104810323A (zh) | 2015-07-29 |
KR20150090833A (ko) | 2015-08-06 |
JP2015142015A (ja) | 2015-08-03 |
TW201532135A (zh) | 2015-08-16 |
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