KR20140129055A - 강화 유리를 분리하는 방법과 장치 및 이에 의해 제조된 물품 - Google Patents
강화 유리를 분리하는 방법과 장치 및 이에 의해 제조된 물품 Download PDFInfo
- Publication number
- KR20140129055A KR20140129055A KR1020147023711A KR20147023711A KR20140129055A KR 20140129055 A KR20140129055 A KR 20140129055A KR 1020147023711 A KR1020147023711 A KR 1020147023711A KR 20147023711 A KR20147023711 A KR 20147023711A KR 20140129055 A KR20140129055 A KR 20140129055A
- Authority
- KR
- South Korea
- Prior art keywords
- substrate
- major surface
- stress
- modified
- guide path
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/037—Controlling or regulating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
- B23K26/0821—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head using multifaceted mirrors, e.g. polygonal mirror
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
- C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/10—Glass-cutting tools, e.g. scoring tools
- C03B33/102—Glass-cutting tools, e.g. scoring tools involving a focussed radiation beam, e.g. lasers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic materials other than metals or composite materials
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T225/00—Severing by tearing or breaking
- Y10T225/10—Methods
- Y10T225/12—With preliminary weakening
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T225/00—Severing by tearing or breaking
- Y10T225/30—Breaking or tearing apparatus
- Y10T225/307—Combined with preliminary weakener or with nonbreaking cutter
- Y10T225/321—Preliminary weakener
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31—Surface property or characteristic of web, sheet or block
- Y10T428/315—Surface modified glass [e.g., tempered, strengthened, etc.]
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Chemical & Material Sciences (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Thermal Sciences (AREA)
- Toxicology (AREA)
- Health & Medical Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Surface Treatment Of Glass (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201261604416P | 2012-02-28 | 2012-02-28 | |
| US61/604,416 | 2012-02-28 | ||
| PCT/US2013/027988 WO2013130581A1 (en) | 2012-02-28 | 2013-02-27 | Method and apparatus for separation of strengthened glass and articles produced thereby |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20140129055A true KR20140129055A (ko) | 2014-11-06 |
Family
ID=49001741
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020147023711A Withdrawn KR20140129055A (ko) | 2012-02-28 | 2013-02-27 | 강화 유리를 분리하는 방법과 장치 및 이에 의해 제조된 물품 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20130221053A1 (https=) |
| JP (1) | JP2015511572A (https=) |
| KR (1) | KR20140129055A (https=) |
| CN (1) | CN104125934A (https=) |
| TW (1) | TW201350389A (https=) |
| WO (1) | WO2013130581A1 (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102241518B1 (ko) * | 2020-11-17 | 2021-04-19 | 주식회사 아이티아이 | 세라믹 절단방법 및 장치 |
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| US10357850B2 (en) | 2012-09-24 | 2019-07-23 | Electro Scientific Industries, Inc. | Method and apparatus for machining a workpiece |
| US9828277B2 (en) | 2012-02-28 | 2017-11-28 | Electro Scientific Industries, Inc. | Methods for separation of strengthened glass |
| US9828278B2 (en) | 2012-02-28 | 2017-11-28 | Electro Scientific Industries, Inc. | Method and apparatus for separation of strengthened glass and articles produced thereby |
| JP2015516352A (ja) | 2012-02-29 | 2015-06-11 | エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド | 強化ガラスを加工するための方法及び装置並びにこれにより生成された製品 |
| US9610653B2 (en) | 2012-09-21 | 2017-04-04 | Electro Scientific Industries, Inc. | Method and apparatus for separation of workpieces and articles produced thereby |
| WO2014079478A1 (en) | 2012-11-20 | 2014-05-30 | Light In Light Srl | High speed laser processing of transparent materials |
| EP2754524B1 (de) | 2013-01-15 | 2015-11-25 | Corning Laser Technologies GmbH | Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie |
| EP2781296B1 (de) | 2013-03-21 | 2020-10-21 | Corning Laser Technologies GmbH | Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser |
| EP2783786A1 (en) * | 2013-03-27 | 2014-10-01 | Bottero S.p.A. | Method and machine for cutting a glass sheet |
| ES2898636T3 (es) * | 2013-03-27 | 2022-03-08 | Bottero Spa | Método para cortar a forma una lámina de vidrio |
| US9328011B2 (en) * | 2013-06-04 | 2016-05-03 | Coherent, Inc. | Laser-scribing of chemically strengthened glass |
| CN104513004B (zh) * | 2013-09-30 | 2018-04-24 | 鸿富锦精密工业(深圳)有限公司 | 化学强化玻璃的切割方法 |
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| US20150165563A1 (en) * | 2013-12-17 | 2015-06-18 | Corning Incorporated | Stacked transparent material cutting with ultrafast laser beam optics, disruptive layers and other layers |
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| US20150165560A1 (en) | 2013-12-17 | 2015-06-18 | Corning Incorporated | Laser processing of slots and holes |
| US9850160B2 (en) | 2013-12-17 | 2017-12-26 | Corning Incorporated | Laser cutting of display glass compositions |
| US9815730B2 (en) | 2013-12-17 | 2017-11-14 | Corning Incorporated | Processing 3D shaped transparent brittle substrate |
| US11556039B2 (en) | 2013-12-17 | 2023-01-17 | Corning Incorporated | Electrochromic coated glass articles and methods for laser processing the same |
| US9701563B2 (en) | 2013-12-17 | 2017-07-11 | Corning Incorporated | Laser cut composite glass article and method of cutting |
| US9517963B2 (en) | 2013-12-17 | 2016-12-13 | Corning Incorporated | Method for rapid laser drilling of holes in glass and products made therefrom |
| US9776906B2 (en) | 2014-03-28 | 2017-10-03 | Electro Scientific Industries, Inc. | Laser machining strengthened glass |
| EP3166895B1 (en) | 2014-07-08 | 2021-11-24 | Corning Incorporated | Methods and apparatuses for laser processing materials |
| EP3169479B1 (en) | 2014-07-14 | 2019-10-02 | Corning Incorporated | Method of and system for arresting incident crack propagation in a transparent material |
| CN208586209U (zh) | 2014-07-14 | 2019-03-08 | 康宁股份有限公司 | 一种用于在工件中形成限定轮廓的多个缺陷的系统 |
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| JP2016068149A (ja) * | 2014-10-02 | 2016-05-09 | 株式会社ディスコ | レーザー加工装置 |
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| WO2017002656A1 (ja) * | 2015-07-02 | 2017-01-05 | セントラル硝子株式会社 | ガラス板の切断方法、ガラス板の切断装置、及び切断ガラス板の製造方法 |
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| KR20190035805A (ko) | 2016-07-29 | 2019-04-03 | 코닝 인코포레이티드 | 레이저 처리를 위한 장치 및 방법 |
| JP2019532908A (ja) | 2016-08-30 | 2019-11-14 | コーニング インコーポレイテッド | 強度マッピング光学システムによる材料のレーザー切断 |
| JP6923284B2 (ja) | 2016-09-30 | 2021-08-18 | コーニング インコーポレイテッド | 非軸対称ビームスポットを用いて透明被加工物をレーザ加工するための装置及び方法 |
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| US10688599B2 (en) | 2017-02-09 | 2020-06-23 | Corning Incorporated | Apparatus and methods for laser processing transparent workpieces using phase shifted focal lines |
| US11078112B2 (en) | 2017-05-25 | 2021-08-03 | Corning Incorporated | Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same |
| US10580725B2 (en) | 2017-05-25 | 2020-03-03 | Corning Incorporated | Articles having vias with geometry attributes and methods for fabricating the same |
| US10626040B2 (en) | 2017-06-15 | 2020-04-21 | Corning Incorporated | Articles capable of individual singulation |
| CN109909601A (zh) * | 2017-12-13 | 2019-06-21 | 京东方科技集团股份有限公司 | 一种激光加工系统及方法 |
| US12180108B2 (en) | 2017-12-19 | 2024-12-31 | Corning Incorporated | Methods for etching vias in glass-based articles employing positive charge organic molecules |
| US11554984B2 (en) | 2018-02-22 | 2023-01-17 | Corning Incorporated | Alkali-free borosilicate glasses with low post-HF etch roughness |
| EP4254368A3 (en) | 2018-11-01 | 2023-12-27 | Asahi Seiko Co., Ltd. | Coin deposit/disbursal device, coin elevation device, and coin elevation device of coin deposit/disbursal device |
| CN116213967A (zh) * | 2018-12-21 | 2023-06-06 | 东京毅力科创株式会社 | 周缘去除装置和周缘去除方法 |
| KR20210110510A (ko) | 2020-02-28 | 2021-09-08 | 쇼오트 아게 | 유리 부재의 분리 방법 및 유리 서브부재 |
| EP3875436B1 (de) | 2020-03-06 | 2024-01-17 | Schott Ag | Verfahren zum vorbereiten und/oder durchführen des trennens eines substratelements und substratteilelement |
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| JP4659300B2 (ja) * | 2000-09-13 | 2011-03-30 | 浜松ホトニクス株式会社 | レーザ加工方法及び半導体チップの製造方法 |
| JP3722731B2 (ja) * | 2000-09-13 | 2005-11-30 | 浜松ホトニクス株式会社 | レーザ加工方法 |
| US6962279B1 (en) * | 2000-10-18 | 2005-11-08 | Ge Medical Systems Global Technology Company, Llc | Apparatus and method for glass separation for flat panel displays |
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| US20080290077A1 (en) * | 2007-05-22 | 2008-11-27 | Demeritt Jeffery Alan | Separation of transparent glasses and systems and methods therefor |
| JP5345334B2 (ja) * | 2008-04-08 | 2013-11-20 | 株式会社レミ | 脆性材料の熱応力割断方法 |
| US8347651B2 (en) * | 2009-02-19 | 2013-01-08 | Corning Incorporated | Method of separating strengthened glass |
| US8327666B2 (en) * | 2009-02-19 | 2012-12-11 | Corning Incorporated | Method of separating strengthened glass |
| KR20100107253A (ko) * | 2009-03-25 | 2010-10-05 | 삼성모바일디스플레이주식회사 | 기판 절단 장치 및 이를 이용한 기판 절단 방법 |
| WO2010139841A1 (en) * | 2009-06-04 | 2010-12-09 | Corelase Oy | Method and apparatus for processing substrates |
| US8946590B2 (en) * | 2009-11-30 | 2015-02-03 | Corning Incorporated | Methods for laser scribing and separating glass substrates |
| DE102010012265B4 (de) * | 2010-03-22 | 2012-09-06 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zum Heraustrennen von Einzelscheiben aus einer Verbundglastafel und Verwendung einer Vorrichtung dafür |
| EP2834036B1 (en) * | 2012-04-05 | 2020-04-29 | Sage Electrochromics, Inc. | Method of thermal laser scribe cutting for electrochromic device production ; corresponding electrochromic panel |
-
2013
- 2013-02-27 US US13/779,050 patent/US20130221053A1/en not_active Abandoned
- 2013-02-27 JP JP2014559987A patent/JP2015511572A/ja not_active Withdrawn
- 2013-02-27 KR KR1020147023711A patent/KR20140129055A/ko not_active Withdrawn
- 2013-02-27 CN CN201380009726.5A patent/CN104125934A/zh active Pending
- 2013-02-27 WO PCT/US2013/027988 patent/WO2013130581A1/en not_active Ceased
- 2013-03-01 TW TW102107443A patent/TW201350389A/zh unknown
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102241518B1 (ko) * | 2020-11-17 | 2021-04-19 | 주식회사 아이티아이 | 세라믹 절단방법 및 장치 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20130221053A1 (en) | 2013-08-29 |
| WO2013130581A1 (en) | 2013-09-06 |
| TW201350389A (zh) | 2013-12-16 |
| CN104125934A (zh) | 2014-10-29 |
| JP2015511572A (ja) | 2015-04-20 |
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