TW201350389A - 用於分離強化玻璃之方法及裝置及由該強化玻璃生產之物品 - Google Patents

用於分離強化玻璃之方法及裝置及由該強化玻璃生產之物品 Download PDF

Info

Publication number
TW201350389A
TW201350389A TW102107443A TW102107443A TW201350389A TW 201350389 A TW201350389 A TW 201350389A TW 102107443 A TW102107443 A TW 102107443A TW 102107443 A TW102107443 A TW 102107443A TW 201350389 A TW201350389 A TW 201350389A
Authority
TW
Taiwan
Prior art keywords
substrate
major surface
stress
crack
altered
Prior art date
Application number
TW102107443A
Other languages
English (en)
Chinese (zh)
Inventor
Haibin Zhang
Original Assignee
Electro Scient Ind Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electro Scient Ind Inc filed Critical Electro Scient Ind Inc
Publication of TW201350389A publication Critical patent/TW201350389A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/037—Controlling or regulating
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B23K26/0821—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head using multifaceted mirrors, e.g. polygonal mirror
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/10—Glass-cutting tools, e.g. scoring tools
    • C03B33/102—Glass-cutting tools, e.g. scoring tools involving a focussed radiation beam, e.g. lasers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/10—Methods
    • Y10T225/12—With preliminary weakening
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/30—Breaking or tearing apparatus
    • Y10T225/307—Combined with preliminary weakener or with nonbreaking cutter
    • Y10T225/321—Preliminary weakener
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31—Surface property or characteristic of web, sheet or block
    • Y10T428/315—Surface modified glass [e.g., tempered, strengthened, etc.]

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Thermal Sciences (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Surface Treatment Of Glass (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
TW102107443A 2012-02-28 2013-03-01 用於分離強化玻璃之方法及裝置及由該強化玻璃生產之物品 TW201350389A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US201261604416P 2012-02-28 2012-02-28

Publications (1)

Publication Number Publication Date
TW201350389A true TW201350389A (zh) 2013-12-16

Family

ID=49001741

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102107443A TW201350389A (zh) 2012-02-28 2013-03-01 用於分離強化玻璃之方法及裝置及由該強化玻璃生產之物品

Country Status (6)

Country Link
US (1) US20130221053A1 (https=)
JP (1) JP2015511572A (https=)
KR (1) KR20140129055A (https=)
CN (1) CN104125934A (https=)
TW (1) TW201350389A (https=)
WO (1) WO2013130581A1 (https=)

Families Citing this family (59)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10357850B2 (en) 2012-09-24 2019-07-23 Electro Scientific Industries, Inc. Method and apparatus for machining a workpiece
US9828277B2 (en) 2012-02-28 2017-11-28 Electro Scientific Industries, Inc. Methods for separation of strengthened glass
US9828278B2 (en) 2012-02-28 2017-11-28 Electro Scientific Industries, Inc. Method and apparatus for separation of strengthened glass and articles produced thereby
JP2015516352A (ja) 2012-02-29 2015-06-11 エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド 強化ガラスを加工するための方法及び装置並びにこれにより生成された製品
US9610653B2 (en) 2012-09-21 2017-04-04 Electro Scientific Industries, Inc. Method and apparatus for separation of workpieces and articles produced thereby
WO2014079478A1 (en) 2012-11-20 2014-05-30 Light In Light Srl High speed laser processing of transparent materials
EP2754524B1 (de) 2013-01-15 2015-11-25 Corning Laser Technologies GmbH Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie
EP2781296B1 (de) 2013-03-21 2020-10-21 Corning Laser Technologies GmbH Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser
EP2783786A1 (en) * 2013-03-27 2014-10-01 Bottero S.p.A. Method and machine for cutting a glass sheet
ES2898636T3 (es) * 2013-03-27 2022-03-08 Bottero Spa Método para cortar a forma una lámina de vidrio
US9328011B2 (en) * 2013-06-04 2016-05-03 Coherent, Inc. Laser-scribing of chemically strengthened glass
CN104513004B (zh) * 2013-09-30 2018-04-24 鸿富锦精密工业（深圳）有限公司 化学强化玻璃的切割方法
US9676167B2 (en) 2013-12-17 2017-06-13 Corning Incorporated Laser processing of sapphire substrate and related applications
US20150165563A1 (en) * 2013-12-17 2015-06-18 Corning Incorporated Stacked transparent material cutting with ultrafast laser beam optics, disruptive layers and other layers
US10442719B2 (en) 2013-12-17 2019-10-15 Corning Incorporated Edge chamfering methods
US20150165560A1 (en) 2013-12-17 2015-06-18 Corning Incorporated Laser processing of slots and holes
US9850160B2 (en) 2013-12-17 2017-12-26 Corning Incorporated Laser cutting of display glass compositions
US9815730B2 (en) 2013-12-17 2017-11-14 Corning Incorporated Processing 3D shaped transparent brittle substrate
US11556039B2 (en) 2013-12-17 2023-01-17 Corning Incorporated Electrochromic coated glass articles and methods for laser processing the same
US9701563B2 (en) 2013-12-17 2017-07-11 Corning Incorporated Laser cut composite glass article and method of cutting
US9517963B2 (en) 2013-12-17 2016-12-13 Corning Incorporated Method for rapid laser drilling of holes in glass and products made therefrom
US9776906B2 (en) 2014-03-28 2017-10-03 Electro Scientific Industries, Inc. Laser machining strengthened glass
EP3166895B1 (en) 2014-07-08 2021-11-24 Corning Incorporated Methods and apparatuses for laser processing materials
EP3169479B1 (en) 2014-07-14 2019-10-02 Corning Incorporated Method of and system for arresting incident crack propagation in a transparent material
CN208586209U (zh) 2014-07-14 2019-03-08 康宁股份有限公司 一种用于在工件中形成限定轮廓的多个缺陷的系统
WO2016010991A1 (en) 2014-07-14 2016-01-21 Corning Incorporated Interface block; system for and method of cutting a substrate being transparent within a range of wavelengths using such interface block
JP2017530867A (ja) * 2014-07-14 2017-10-19 コーニング インコーポレイテッド 長さおよび直径の調節可能なレーザビーム焦線を用いて透明材料を加工するためのシステムおよび方法
JP2016068149A (ja) * 2014-10-02 2016-05-09 株式会社ディスコ レーザー加工装置
US10047001B2 (en) 2014-12-04 2018-08-14 Corning Incorporated Glass cutting systems and methods using non-diffracting laser beams
KR20170105562A (ko) 2015-01-12 2017-09-19 코닝 인코포레이티드 다중 광자 흡수 방법을 사용한 열적 템퍼링된 기판의 레이저 절단
JP7292006B2 (ja) 2015-03-24 2023-06-16 コーニング インコーポレイテッド ディスプレイガラス組成物のレーザ切断及び加工
EP3274313A1 (en) 2015-03-27 2018-01-31 Corning Incorporated Gas permeable window and method of fabricating the same
US11420894B2 (en) 2015-04-24 2022-08-23 Nanoplus Ltd. Brittle object cutting apparatus and cutting method thereof
US20160311060A1 (en) * 2015-04-24 2016-10-27 Nanoplus Ltd. Brittle object cutting apparatus and cutting method thereof
JP6694448B2 (ja) * 2015-06-04 2020-05-13 コーニング インコーポレイテッド イオン交換により化学強化されたリチウム含有ガラスを特徴付ける方法
WO2017002656A1 (ja) * 2015-07-02 2017-01-05 セントラル硝子株式会社 ガラス板の切断方法、ガラス板の切断装置、及び切断ガラス板の製造方法
CN107835794A (zh) 2015-07-10 2018-03-23 康宁股份有限公司 在挠性基材板中连续制造孔的方法和与此相关的产品
PL3334697T3 (pl) * 2015-08-10 2022-01-24 Saint-Gobain Glass France Sposób cięcia cienkiej warstwy szkła
EP3452418B1 (en) 2016-05-06 2022-03-02 Corning Incorporated Laser cutting and removal of contoured shapes from transparent substrates
US10410883B2 (en) 2016-06-01 2019-09-10 Corning Incorporated Articles and methods of forming vias in substrates
US10794679B2 (en) 2016-06-29 2020-10-06 Corning Incorporated Method and system for measuring geometric parameters of through holes
KR20190035805A (ko) 2016-07-29 2019-04-03 코닝 인코포레이티드 레이저 처리를 위한 장치 및 방법
JP2019532908A (ja) 2016-08-30 2019-11-14 コーニング インコーポレイテッド 強度マッピング光学システムによる材料のレーザー切断
JP6923284B2 (ja) 2016-09-30 2021-08-18 コーニング インコーポレイテッド 非軸対称ビームスポットを用いて透明被加工物をレーザ加工するための装置及び方法
LT3529214T (lt) * 2016-10-24 2021-02-25 Corning Incorporated Substrato apdorojimo stotis lakšto formos stiklo substratų lazeriniam mašininiam apdorojimui
US10752534B2 (en) 2016-11-01 2020-08-25 Corning Incorporated Apparatuses and methods for laser processing laminate workpiece stacks
US20180118602A1 (en) * 2016-11-01 2018-05-03 Corning Incorporated Glass sheet transfer apparatuses for laser-based machining of sheet-like glass substrates
US10688599B2 (en) 2017-02-09 2020-06-23 Corning Incorporated Apparatus and methods for laser processing transparent workpieces using phase shifted focal lines
US11078112B2 (en) 2017-05-25 2021-08-03 Corning Incorporated Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
US10580725B2 (en) 2017-05-25 2020-03-03 Corning Incorporated Articles having vias with geometry attributes and methods for fabricating the same
US10626040B2 (en) 2017-06-15 2020-04-21 Corning Incorporated Articles capable of individual singulation
CN109909601A (zh) * 2017-12-13 2019-06-21 京东方科技集团股份有限公司 一种激光加工系统及方法
US12180108B2 (en) 2017-12-19 2024-12-31 Corning Incorporated Methods for etching vias in glass-based articles employing positive charge organic molecules
US11554984B2 (en) 2018-02-22 2023-01-17 Corning Incorporated Alkali-free borosilicate glasses with low post-HF etch roughness
EP4254368A3 (en) 2018-11-01 2023-12-27 Asahi Seiko Co., Ltd. Coin deposit/disbursal device, coin elevation device, and coin elevation device of coin deposit/disbursal device
CN116213967A (zh) * 2018-12-21 2023-06-06 东京毅力科创株式会社 周缘去除装置和周缘去除方法
KR20210110510A (ko) 2020-02-28 2021-09-08 쇼오트 아게 유리 부재의 분리 방법 및 유리 서브부재
EP3875436B1 (de) 2020-03-06 2024-01-17 Schott Ag Verfahren zum vorbereiten und/oder durchführen des trennens eines substratelements und substratteilelement
KR102241518B1 (ko) * 2020-11-17 2021-04-19 주식회사 아이티아이 세라믹 절단방법 및 장치

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4659300B2 (ja) * 2000-09-13 2011-03-30 浜松ホトニクス株式会社 レーザ加工方法及び半導体チップの製造方法
JP3722731B2 (ja) * 2000-09-13 2005-11-30 浜松ホトニクス株式会社 レーザ加工方法
US6962279B1 (en) * 2000-10-18 2005-11-08 Ge Medical Systems Global Technology Company, Llc Apparatus and method for glass separation for flat panel displays
JP2004299969A (ja) * 2003-03-31 2004-10-28 Toshiba Ceramics Co Ltd シリカガラスのスライス方法
US20080290077A1 (en) * 2007-05-22 2008-11-27 Demeritt Jeffery Alan Separation of transparent glasses and systems and methods therefor
JP5345334B2 (ja) * 2008-04-08 2013-11-20 株式会社レミ 脆性材料の熱応力割断方法
US8347651B2 (en) * 2009-02-19 2013-01-08 Corning Incorporated Method of separating strengthened glass
US8327666B2 (en) * 2009-02-19 2012-12-11 Corning Incorporated Method of separating strengthened glass
KR20100107253A (ko) * 2009-03-25 2010-10-05 삼성모바일디스플레이주식회사 기판 절단 장치 및 이를 이용한 기판 절단 방법
WO2010139841A1 (en) * 2009-06-04 2010-12-09 Corelase Oy Method and apparatus for processing substrates
US8946590B2 (en) * 2009-11-30 2015-02-03 Corning Incorporated Methods for laser scribing and separating glass substrates
DE102010012265B4 (de) * 2010-03-22 2012-09-06 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum Heraustrennen von Einzelscheiben aus einer Verbundglastafel und Verwendung einer Vorrichtung dafür
EP2834036B1 (en) * 2012-04-05 2020-04-29 Sage Electrochromics, Inc. Method of thermal laser scribe cutting for electrochromic device production ; corresponding electrochromic panel

Also Published As

Publication number Publication date
US20130221053A1 (en) 2013-08-29
WO2013130581A1 (en) 2013-09-06
CN104125934A (zh) 2014-10-29
KR20140129055A (ko) 2014-11-06
JP2015511572A (ja) 2015-04-20

Similar Documents

Publication Publication Date Title
TW201350389A (zh) 用於分離強化玻璃之方法及裝置及由該強化玻璃生產之物品
TWI573186B (zh) 加工強化玻璃的方法和裝置及藉此製造的物品
TWI529022B (zh) 雷射劃線及分裂薄玻璃之方法
JP5976906B2 (ja) ガラス基板のレーザスクライブおよび分離方法
TW201350245A (zh) 用於分離增強玻璃之方法及裝置及由該增強玻璃生產之物品
US8720228B2 (en) Methods of separating strengthened glass substrates
US10358374B2 (en) Methods for laser scribing and separating glass substrates
JP5245819B2 (ja) ガラス基板の面取り方法および装置
KR101581992B1 (ko) 취성 재료의 시트 분리 방법
US11053156B2 (en) Method of closed form release for brittle materials using burst ultrafast laser pulses
TWI629249B (zh) Method for cutting tempered glass sheets
US20110127242A1 (en) Methods for laser scribing and separating glass substrates
CN103249686B (zh) 切割钢化玻璃基板的方法
CN101646524A (zh) 热边缘精整
JP2009035433A (ja) ガラス基板の面取り方法および装置、面取りされたガラス基板
CN102442769A (zh) 玻璃基板的倒棱方法及装置
CN116568644B (zh) 陶瓷切割方法及装置
JP2013053019A (ja) 強化ガラスのくり抜き加工方法
WO2014077397A1 (ja) ワーク割断方法およびワーク割断装置
WO2013031771A1 (ja) 強化ガラスの切断方法
JP2009084133A (ja) 脆性材料のフルボディ割断方法
CN118930029A (zh) 一种划痕通道的形成及分离强化显示玻璃的方法