TW201350389A - 用於分離強化玻璃之方法及裝置及由該強化玻璃生產之物品 - Google Patents

用於分離強化玻璃之方法及裝置及由該強化玻璃生產之物品 Download PDF

Info

Publication number
TW201350389A
TW201350389A TW102107443A TW102107443A TW201350389A TW 201350389 A TW201350389 A TW 201350389A TW 102107443 A TW102107443 A TW 102107443A TW 102107443 A TW102107443 A TW 102107443A TW 201350389 A TW201350389 A TW 201350389A
Authority
TW
Taiwan
Prior art keywords
substrate
major surface
stress
crack
altered
Prior art date
Application number
TW102107443A
Other languages
English (en)
Chinese (zh)
Inventor
Haibin Zhang
Original Assignee
Electro Scient Ind Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electro Scient Ind Inc filed Critical Electro Scient Ind Inc
Publication of TW201350389A publication Critical patent/TW201350389A/zh

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/02Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/037Controlling or regulating
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/02Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/0222Scoring using a focussed radiation beam, e.g. laser
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/082Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/082Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B23K26/0821Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head using multifaceted mirrors, e.g. polygonal mirror
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/083Devices involving movement of the workpiece in at least one axial direction
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50Working by transmitting the laser beam through or within the workpiece
    • B23K26/53Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/09Severing cooled glass by thermal shock
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/09Severing cooled glass by thermal shock
    • C03B33/091Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/10Glass-cutting tools, e.g. scoring tools
    • C03B33/102Glass-cutting tools, e.g. scoring tools involving a focussed radiation beam, e.g. lasers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/50Inorganic materials other than metals or composite materials
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00Severing by tearing or breaking
    • Y10T225/10Methods
    • Y10T225/12With preliminary weakening
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00Severing by tearing or breaking
    • Y10T225/30Breaking or tearing apparatus
    • Y10T225/307Combined with preliminary weakener or with nonbreaking cutter
    • Y10T225/321Preliminary weakener
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31Surface property or characteristic of web, sheet or block
    • Y10T428/315Surface modified glass [e.g., tempered, strengthened, etc.]

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Thermal Sciences (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Surface Treatment Of Glass (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
TW102107443A 2012-02-28 2013-03-01 用於分離強化玻璃之方法及裝置及由該強化玻璃生產之物品 TW201350389A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US201261604416P 2012-02-28 2012-02-28

Publications (1)

Publication Number Publication Date
TW201350389A true TW201350389A (zh) 2013-12-16

Family

ID=49001741

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102107443A TW201350389A (zh) 2012-02-28 2013-03-01 用於分離強化玻璃之方法及裝置及由該強化玻璃生產之物品

Country Status (6)

Country Link
US (1) US20130221053A1 (https=)
JP (1) JP2015511572A (https=)
KR (1) KR20140129055A (https=)
CN (1) CN104125934A (https=)
TW (1) TW201350389A (https=)
WO (1) WO2013130581A1 (https=)

Families Citing this family (59)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015511571A (ja) 2012-02-28 2015-04-20 エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド 強化ガラスの分離のための方法及び装置並びにこれにより生成された製品
US10357850B2 (en) 2012-09-24 2019-07-23 Electro Scientific Industries, Inc. Method and apparatus for machining a workpiece
US9828278B2 (en) 2012-02-28 2017-11-28 Electro Scientific Industries, Inc. Method and apparatus for separation of strengthened glass and articles produced thereby
WO2013130608A1 (en) 2012-02-29 2013-09-06 Electro Scientific Industries, Inc. Methods and apparatus for machining strengthened glass and articles produced thereby
US9610653B2 (en) 2012-09-21 2017-04-04 Electro Scientific Industries, Inc. Method and apparatus for separation of workpieces and articles produced thereby
WO2014079478A1 (en) 2012-11-20 2014-05-30 Light In Light Srl High speed laser processing of transparent materials
EP2754524B1 (de) 2013-01-15 2015-11-25 Corning Laser Technologies GmbH Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie
EP2781296B1 (de) 2013-03-21 2020-10-21 Corning Laser Technologies GmbH Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser
EP2783785B1 (en) * 2013-03-27 2021-10-20 Bottero S.p.A. Method for shape cutting a glass sheet
EP2783786A1 (en) * 2013-03-27 2014-10-01 Bottero S.p.A. Method and machine for cutting a glass sheet
US9328011B2 (en) * 2013-06-04 2016-05-03 Coherent, Inc. Laser-scribing of chemically strengthened glass
CN104513004B (zh) * 2013-09-30 2018-04-24 鸿富锦精密工业(深圳)有限公司 化学强化玻璃的切割方法
US20150165563A1 (en) * 2013-12-17 2015-06-18 Corning Incorporated Stacked transparent material cutting with ultrafast laser beam optics, disruptive layers and other layers
US9815730B2 (en) 2013-12-17 2017-11-14 Corning Incorporated Processing 3D shaped transparent brittle substrate
US20150165560A1 (en) 2013-12-17 2015-06-18 Corning Incorporated Laser processing of slots and holes
US9676167B2 (en) 2013-12-17 2017-06-13 Corning Incorporated Laser processing of sapphire substrate and related applications
US11556039B2 (en) 2013-12-17 2023-01-17 Corning Incorporated Electrochromic coated glass articles and methods for laser processing the same
US9850160B2 (en) 2013-12-17 2017-12-26 Corning Incorporated Laser cutting of display glass compositions
US9701563B2 (en) 2013-12-17 2017-07-11 Corning Incorporated Laser cut composite glass article and method of cutting
US10442719B2 (en) 2013-12-17 2019-10-15 Corning Incorporated Edge chamfering methods
US10293436B2 (en) 2013-12-17 2019-05-21 Corning Incorporated Method for rapid laser drilling of holes in glass and products made therefrom
US9776906B2 (en) 2014-03-28 2017-10-03 Electro Scientific Industries, Inc. Laser machining strengthened glass
TWI730945B (zh) 2014-07-08 2021-06-21 美商康寧公司 用於雷射處理材料的方法與設備
EP3169479B1 (en) 2014-07-14 2019-10-02 Corning Incorporated Method of and system for arresting incident crack propagation in a transparent material
WO2016010949A1 (en) 2014-07-14 2016-01-21 Corning Incorporated Method and system for forming perforations
KR20170028943A (ko) * 2014-07-14 2017-03-14 코닝 인코포레이티드 조정가능한 레이저 빔 촛점 라인을 사용하여 투명한 재료를 처리하는 방법 및 시스템
CN107073641B (zh) 2014-07-14 2020-11-10 康宁股份有限公司 接口块;用于使用这种接口块切割在波长范围内透明的衬底的系统和方法
JP2016068149A (ja) * 2014-10-02 2016-05-09 株式会社ディスコ レーザー加工装置
US10047001B2 (en) 2014-12-04 2018-08-14 Corning Incorporated Glass cutting systems and methods using non-diffracting laser beams
CN107406293A (zh) 2015-01-12 2017-11-28 康宁股份有限公司 使用多光子吸收方法来对经热回火的基板进行激光切割
US11773004B2 (en) 2015-03-24 2023-10-03 Corning Incorporated Laser cutting and processing of display glass compositions
KR20170131638A (ko) 2015-03-27 2017-11-29 코닝 인코포레이티드 가스 투과성 유리창 및 이의 제작방법
US20160311060A1 (en) * 2015-04-24 2016-10-27 Nanoplus Ltd. Brittle object cutting apparatus and cutting method thereof
US11420894B2 (en) 2015-04-24 2022-08-23 Nanoplus Ltd. Brittle object cutting apparatus and cutting method thereof
US10180416B2 (en) 2015-06-04 2019-01-15 Corning Incorporated Methods of characterizing ion-exchanged chemically strengthened glasses containing lithium
WO2017002656A1 (ja) * 2015-07-02 2017-01-05 セントラル硝子株式会社 ガラス板の切断方法、ガラス板の切断装置、及び切断ガラス板の製造方法
WO2017011296A1 (en) 2015-07-10 2017-01-19 Corning Incorporated Methods of continuous fabrication of holes in flexible substrate sheets and products relating to the same
US10759690B2 (en) 2015-08-10 2020-09-01 Saint-Gobain Glass France Method for cutting a thin glass layer
JP6938543B2 (ja) 2016-05-06 2021-09-22 コーニング インコーポレイテッド 透明基板からの、輪郭設定された形状のレーザ切断及び取り外し
US10410883B2 (en) 2016-06-01 2019-09-10 Corning Incorporated Articles and methods of forming vias in substrates
US10794679B2 (en) 2016-06-29 2020-10-06 Corning Incorporated Method and system for measuring geometric parameters of through holes
KR20190035805A (ko) 2016-07-29 2019-04-03 코닝 인코포레이티드 레이저 처리를 위한 장치 및 방법
KR102423775B1 (ko) 2016-08-30 2022-07-22 코닝 인코포레이티드 투명 재료의 레이저 가공
US10730783B2 (en) 2016-09-30 2020-08-04 Corning Incorporated Apparatuses and methods for laser processing transparent workpieces using non-axisymmetric beam spots
KR102428350B1 (ko) * 2016-10-24 2022-08-02 코닝 인코포레이티드 시트형 유리 기판의 레이저 기반 기계 가공을 위한 기판 프로세싱 스테이션
US10752534B2 (en) 2016-11-01 2020-08-25 Corning Incorporated Apparatuses and methods for laser processing laminate workpiece stacks
US20180118602A1 (en) * 2016-11-01 2018-05-03 Corning Incorporated Glass sheet transfer apparatuses for laser-based machining of sheet-like glass substrates
US10688599B2 (en) 2017-02-09 2020-06-23 Corning Incorporated Apparatus and methods for laser processing transparent workpieces using phase shifted focal lines
US10580725B2 (en) 2017-05-25 2020-03-03 Corning Incorporated Articles having vias with geometry attributes and methods for fabricating the same
US11078112B2 (en) 2017-05-25 2021-08-03 Corning Incorporated Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
US10626040B2 (en) 2017-06-15 2020-04-21 Corning Incorporated Articles capable of individual singulation
CN109909601A (zh) * 2017-12-13 2019-06-21 京东方科技集团股份有限公司 一种激光加工系统及方法
US12180108B2 (en) 2017-12-19 2024-12-31 Corning Incorporated Methods for etching vias in glass-based articles employing positive charge organic molecules
US11554984B2 (en) 2018-02-22 2023-01-17 Corning Incorporated Alkali-free borosilicate glasses with low post-HF etch roughness
US12118844B2 (en) 2018-11-01 2024-10-15 Asahi Seiko Co., Ltd Coin receiving and dispensing device, coin lifting device, and coin lifting device of coin receiving and dispensing device
KR102851263B1 (ko) * 2018-12-21 2025-08-27 도쿄엘렉트론가부시키가이샤 주연 제거 장치 및 주연 제거 방법
KR20210110510A (ko) 2020-02-28 2021-09-08 쇼오트 아게 유리 부재의 분리 방법 및 유리 서브부재
ES2976069T3 (es) 2020-03-06 2024-07-22 Schott Ag Procedimiento para la preparación y/o realización de la separación de un elemento de sustrato y un elemento parcial de sustrato
KR102241518B1 (ko) * 2020-11-17 2021-04-19 주식회사 아이티아이 세라믹 절단방법 및 장치

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4659300B2 (ja) * 2000-09-13 2011-03-30 浜松ホトニクス株式会社 レーザ加工方法及び半導体チップの製造方法
JP3722731B2 (ja) * 2000-09-13 2005-11-30 浜松ホトニクス株式会社 レーザ加工方法
US6962279B1 (en) * 2000-10-18 2005-11-08 Ge Medical Systems Global Technology Company, Llc Apparatus and method for glass separation for flat panel displays
JP2004299969A (ja) * 2003-03-31 2004-10-28 Toshiba Ceramics Co Ltd シリカガラスのスライス方法
US20080290077A1 (en) * 2007-05-22 2008-11-27 Demeritt Jeffery Alan Separation of transparent glasses and systems and methods therefor
JP5345334B2 (ja) * 2008-04-08 2013-11-20 株式会社レミ 脆性材料の熱応力割断方法
US8347651B2 (en) * 2009-02-19 2013-01-08 Corning Incorporated Method of separating strengthened glass
US8327666B2 (en) * 2009-02-19 2012-12-11 Corning Incorporated Method of separating strengthened glass
KR20100107253A (ko) * 2009-03-25 2010-10-05 삼성모바일디스플레이주식회사 기판 절단 장치 및 이를 이용한 기판 절단 방법
US9701581B2 (en) * 2009-06-04 2017-07-11 Corelase Oy Method and apparatus for processing substrates using a laser
US8946590B2 (en) * 2009-11-30 2015-02-03 Corning Incorporated Methods for laser scribing and separating glass substrates
DE102010012265B4 (de) * 2010-03-22 2012-09-06 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum Heraustrennen von Einzelscheiben aus einer Verbundglastafel und Verwendung einer Vorrichtung dafür
CN104661787A (zh) * 2012-04-05 2015-05-27 Sage电致变色显示有限公司 用于电变色装置制造的热激光划线切割方法和设备及相应的切割玻璃面板

Also Published As

Publication number Publication date
JP2015511572A (ja) 2015-04-20
CN104125934A (zh) 2014-10-29
US20130221053A1 (en) 2013-08-29
WO2013130581A1 (en) 2013-09-06
KR20140129055A (ko) 2014-11-06

Similar Documents

Publication Publication Date Title
TW201350389A (zh) 用於分離強化玻璃之方法及裝置及由該強化玻璃生產之物品
TWI573186B (zh) 加工強化玻璃的方法和裝置及藉此製造的物品
TWI529022B (zh) 雷射劃線及分裂薄玻璃之方法
JP5976906B2 (ja) ガラス基板のレーザスクライブおよび分離方法
TW201350245A (zh) 用於分離增強玻璃之方法及裝置及由該增強玻璃生產之物品
US8720228B2 (en) Methods of separating strengthened glass substrates
US10358374B2 (en) Methods for laser scribing and separating glass substrates
JP5245819B2 (ja) ガラス基板の面取り方法および装置
KR101581992B1 (ko) 취성 재료의 시트 분리 방법
US11053156B2 (en) Method of closed form release for brittle materials using burst ultrafast laser pulses
TWI629249B (zh) Method for cutting tempered glass sheets
US20110127242A1 (en) Methods for laser scribing and separating glass substrates
CN103249686B (zh) 切割钢化玻璃基板的方法
CN101646524A (zh) 热边缘精整
JP2009035433A (ja) ガラス基板の面取り方法および装置、面取りされたガラス基板
CN102442769A (zh) 玻璃基板的倒棱方法及装置
CN116568644B (zh) 陶瓷切割方法及装置
JP2013053019A (ja) 強化ガラスのくり抜き加工方法
WO2014077397A1 (ja) ワーク割断方法およびワーク割断装置
WO2013031771A1 (ja) 強化ガラスの切断方法
JP2009084133A (ja) 脆性材料のフルボディ割断方法
CN118930029A (zh) 一种划痕通道的形成及分离强化显示玻璃的方法