KR20140116539A - 적층 집적 구성요소 장치 내의 다수의 동력공급 요소 - Google Patents

적층 집적 구성요소 장치 내의 다수의 동력공급 요소 Download PDF

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KR20140116539A
KR20140116539A KR1020147023516A KR20147023516A KR20140116539A KR 20140116539 A KR20140116539 A KR 20140116539A KR 1020147023516 A KR1020147023516 A KR 1020147023516A KR 20147023516 A KR20147023516 A KR 20147023516A KR 20140116539 A KR20140116539 A KR 20140116539A
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South Korea
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power supply
electrical
elements
layer
stacked
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Korean (ko)
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랜달 비. 퓨
프레드릭 에이. 플릿시
다니엘 비. 오츠
제임스 다니엘 리알
아담 토너
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존슨 앤드 존슨 비젼 케어, 인코포레이티드
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Publication of KR20140116539A publication Critical patent/KR20140116539A/ko
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00—Producing optical elements, e.g. lenses or prisms
    • B29D11/0074—Production of other optical elements not provided for in B29D11/00009- B29D11/0073
    • B29D11/00807—Producing lenses combined with electronics, e.g. chips
    • B29D11/00817—Producing electro-active lenses or lenses with energy receptors, e.g. batteries or antennas
    • B29D11/00826—Producing electro-active lenses or lenses with energy receptors, e.g. batteries or antennas with energy receptors for wireless energy transmission
    • G—PHYSICS
    • G02—OPTICS
    • G02C—SPECTACLES; SUNGLASSES OR GOGGLES INSOFAR AS THEY HAVE THE SAME FEATURES AS SPECTACLES; CONTACT LENSES
    • G02C11/00—Non-optical adjuncts; Attachment thereof
    • G02C11/10—Electronic devices other than hearing aids
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00—Producing optical elements, e.g. lenses or prisms
    • B29D11/00009—Production of simple or compound lenses
    • B29D11/00038—Production of contact lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02C—SPECTACLES; SUNGLASSES OR GOGGLES INSOFAR AS THEY HAVE THE SAME FEATURES AS SPECTACLES; CONTACT LENSES
    • G02C7/00—Optical parts
    • G02C7/02—Lenses; Lens systems ; Methods of designing lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02C—SPECTACLES; SUNGLASSES OR GOGGLES INSOFAR AS THEY HAVE THE SAME FEATURES AS SPECTACLES; CONTACT LENSES
    • G02C7/00—Optical parts
    • G02C7/02—Lenses; Lens systems ; Methods of designing lenses
    • G02C7/04—Contact lenses for the eyes
    • G—PHYSICS
    • G02—OPTICS
    • G02C—SPECTACLES; SUNGLASSES OR GOGGLES INSOFAR AS THEY HAVE THE SAME FEATURES AS SPECTACLES; CONTACT LENSES
    • G02C7/00—Optical parts
    • G02C7/02—Lenses; Lens systems ; Methods of designing lenses
    • G02C7/08—Auxiliary lenses; Arrangements for varying focal length
    • G02C7/081—Ophthalmic lenses with variable focal length
    • G02C7/083—Electrooptic lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10D89/00
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    • G—PHYSICS
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    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
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    • H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
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    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
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    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
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    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48145—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes
    • H01L2225/04—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same main group of the same subclass of class H10
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06506—Wire or wire-like electrical connections between devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes
    • H01L2225/04—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes the devices not having separate containers
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    • H01L2225/06555—Geometry of the stack, e.g. form of the devices, geometry to facilitate stacking
    • H01L2225/06562—Geometry of the stack, e.g. form of the devices, geometry to facilitate stacking at least one device in the stack being rotated or offset
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    • H01L2225/04—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes the devices not having separate containers
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    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
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    • H01L2924/11—Device type
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    • H01L2924/1304—Transistor
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    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
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    • H01M50/10—Primary casings; Jackets or wrappings
    • H01M50/102—Primary casings; Jackets or wrappings characterised by their shape or physical structure
    • H01M50/107—Primary casings; Jackets or wrappings characterised by their shape or physical structure having curved cross-section, e.g. round or elliptic
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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Ophthalmology & Optometry (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Health & Medical Sciences (AREA)
  • Optics & Photonics (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Otolaryngology (AREA)
  • Acoustics & Sound (AREA)
  • Electrochemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Eyeglasses (AREA)
  • Prostheses (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Tests Of Electric Status Of Batteries (AREA)
  • Bipolar Integrated Circuits (AREA)
  • Secondary Cells (AREA)
KR1020147023516A 2012-01-26 2013-01-25 적층 집적 구성요소 장치 내의 다수의 동력공급 요소 Ceased KR20140116539A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/358,916 2012-01-26
US13/358,916 US9110310B2 (en) 2011-03-18 2012-01-26 Multiple energization elements in stacked integrated component devices
PCT/US2013/023097 WO2013112803A2 (en) 2012-01-26 2013-01-25 Multiple energization elements in stacked integrated component devices

Publications (1)

Publication Number Publication Date
KR20140116539A true KR20140116539A (ko) 2014-10-02

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KR1020147023516A Ceased KR20140116539A (ko) 2012-01-26 2013-01-25 적층 집적 구성요소 장치 내의 다수의 동력공급 요소

Country Status (13)

Country Link
US (2) US9110310B2 (enExample)
EP (1) EP2807672A2 (enExample)
JP (2) JP6158227B2 (enExample)
KR (1) KR20140116539A (enExample)
CN (1) CN104205329B (enExample)
AU (1) AU2013212002B2 (enExample)
BR (1) BR112014018454A8 (enExample)
CA (1) CA2862640A1 (enExample)
HK (1) HK1204508A1 (enExample)
RU (1) RU2596629C2 (enExample)
SG (1) SG11201404171YA (enExample)
TW (1) TWI593080B (enExample)
WO (1) WO2013112803A2 (enExample)

Families Citing this family (69)

* Cited by examiner, † Cited by third party
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US9675443B2 (en) 2009-09-10 2017-06-13 Johnson & Johnson Vision Care, Inc. Energized ophthalmic lens including stacked integrated components
US9475709B2 (en) 2010-08-25 2016-10-25 Lockheed Martin Corporation Perforated graphene deionization or desalination
US8950862B2 (en) 2011-02-28 2015-02-10 Johnson & Johnson Vision Care, Inc. Methods and apparatus for an ophthalmic lens with functional insert layers
US9110310B2 (en) * 2011-03-18 2015-08-18 Johnson & Johnson Vision Care, Inc. Multiple energization elements in stacked integrated component devices
US9698129B2 (en) 2011-03-18 2017-07-04 Johnson & Johnson Vision Care, Inc. Stacked integrated component devices with energization
US9889615B2 (en) 2011-03-18 2018-02-13 Johnson & Johnson Vision Care, Inc. Stacked integrated component media insert for an ophthalmic device
US10451897B2 (en) 2011-03-18 2019-10-22 Johnson & Johnson Vision Care, Inc. Components with multiple energization elements for biomedical devices
US9804418B2 (en) 2011-03-21 2017-10-31 Johnson & Johnson Vision Care, Inc. Methods and apparatus for functional insert with power layer
US8857983B2 (en) 2012-01-26 2014-10-14 Johnson & Johnson Vision Care, Inc. Ophthalmic lens assembly having an integrated antenna structure
IL224796A (en) * 2012-02-22 2017-08-31 Johnson & Johnson Vision Care Whole rings for implant a functional layer of eye lenses
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WO2013112803A3 (en) 2013-10-10
TW201349441A (zh) 2013-12-01
US20120235277A1 (en) 2012-09-20
JP6158227B2 (ja) 2017-07-05
WO2013112803A2 (en) 2013-08-01
US9535268B2 (en) 2017-01-03
AU2013212002B2 (en) 2016-02-25
AU2013212002A1 (en) 2014-09-11
BR112014018454A8 (pt) 2017-07-11
TWI593080B (zh) 2017-07-21
CA2862640A1 (en) 2013-08-01
JP6312904B2 (ja) 2018-04-18
BR112014018454A2 (enExample) 2017-06-20
CN104205329A (zh) 2014-12-10
US20150309337A1 (en) 2015-10-29
EP2807672A2 (en) 2014-12-03
US9110310B2 (en) 2015-08-18
JP2017199003A (ja) 2017-11-02
CN104205329B (zh) 2017-07-18
RU2014134724A (ru) 2016-03-20
HK1204508A1 (en) 2015-11-20
SG11201404171YA (en) 2014-09-26
JP2015515115A (ja) 2015-05-21
RU2596629C2 (ru) 2016-09-10

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