KR20140071040A - Substrate treating apparatus - Google Patents

Abstract

The present invention relates to a substrate treating apparatus. More particularly, the present invention relates to a substrate treating apparatus which injects a chemical liquid to a substrate while the substrate is floated from a stage and is supported. A substrate treating apparatus according to one embodiment of the present invention includes a substrate floating unit for floating a substrate, a nozzle unit which is located in the upper part of the substrate floating unit and injects a chemical liquid to the substrate, a holding member which holds the edge of the substrate, and a substrate moving unit which moves the holding member in a first direction. The substrate floating unit includes a stage which has an upper surface where holes are provided, and a pressure providing member which provides gas pressure or vacuum pressure to the upper part of the stage through the holes. The holes are formed with columns. Each column is divided into floating regions. The holes are located in one among the adjacent floating regions in each column. The holes are not located in the other.

Description

[0001] SUBSTRATE TREATING APPARATUS [0002]

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a substrate processing apparatus, and more particularly, to a substrate processing apparatus that flushes a substrate on a stage to discharge a chemical liquid onto a substrate while supporting the substrate.

In order to manufacture a semiconductor device or a liquid crystal display, various processes of photolithography, etching, ion implantation, deposition, and cleaning to supply a chemical solution onto a substrate are performed. Among these processes, the photolithography process forms the desired pattern on the substrate.

The photolithography process includes a coating process for applying a photosensitive liquid such as a photoresist on a substrate, an exposure process for forming a specific pattern on the applied photosensitive film, and a developing process for removing a specific region from the exposed photosensitive film.

During these processes, the chemical liquid is ejected from the nozzle to the substrate while the substrate is being conveyed in one direction.

The movement of the substrate is achieved with the support member providing gas pressure and vacuum pressure to the bottom surface of the substrate and levitating the substrate. When the gas pressure and the vacuum pressure are provided on the bottom surface of the substrate, the substrate may be shaken due to a sudden change in pressure. If the substrate is shaken during the coating process, there may arise a problem that the substrate is stained from the applied chemical solution.

SUMMARY OF THE INVENTION The present invention provides a substrate processing apparatus that minimizes shaking of a substrate due to a pressure applied to the substrate when the substrate is lifted.

Another object of the present invention is to provide a substrate processing apparatus capable of preventing unevenness on the substrate when the chemical liquid is applied to the substrate.

The problems to be solved by the present invention are not limited to the above-mentioned problems, and the problems not mentioned can be clearly understood by those skilled in the art from the description and the accompanying drawings will be.

The present invention provides a substrate processing apparatus.

A substrate processing apparatus according to an embodiment of the present invention includes a substrate floating unit for floating a substrate, a nozzle unit disposed above the substrate floating unit, for ejecting a chemical liquid onto the substrate, and a gripping member holding the substrate And a substrate moving unit for moving the holding member in a first direction, wherein the substrate floating unit includes: a stage provided with a plurality of holes on an upper surface thereof; and a pressure providing unit for applying a gas pressure or a vacuum pressure to the upper portion of the stage through the holes Wherein the plurality of holes are provided to form a plurality of rows, the rows are divided into a plurality of floating regions, the holes are located in one of the adjacent floating regions in each column, One area is provided such that the hole is not located.

The first floating area provided with no hole in the floating area provided in each column may be provided longer than the second floating area provided with the hole.

Each of the columns may be provided in parallel with the first direction.

The same number of holes may be provided in each floating region.

When the length of the first floating area in which the holes are not provided in each of the columns is n (n is a natural number) times the length of the second floating area provided with the holes, n (n is a natural number) columns.

The holes include a gas hole providing a gas pressure and a vacuum hole providing a vacuum, and the holes may be alternately provided in the gas hole and the vacuum hole in the first direction.

The stage may include a carry-in portion, a apply portion, and a carry-out portion, and the number of holes per unit area provided to the application portion may be greater than that of the carry-in portion and the carry-out portion.

The nozzle unit includes a nozzle positioned in a second direction perpendicular to a first direction in which the substrate moves linearly, and the gripping member can hold the substrate by vacuum suction.

Wherein a region where the hole is not provided in the floating region provided in each column is provided longer than a region in which the hole is provided and each column is provided in parallel with the first direction, Holes are provided, and when the length of the first floating region in which the holes are not provided in the respective columns is n (n is a natural number) times the length of the second floating region provided with the holes, (N is a natural number) column between the columns, wherein the holes include a gas hole providing a gas pressure and a vacuum hole providing a vacuum, wherein the holes are formed in the gas hole The vacuum holes may be alternately provided.

The present invention also provides a substrate floating unit.

A substrate floating unit according to an embodiment of the present invention includes a stage provided with a plurality of holes on an upper surface thereof and a pressure providing member for providing a gas pressure or a vacuum pressure to the upper portion of the stage through the holes, Wherein each of the columns is divided into a plurality of floating regions and the holes are located in one of the adjacent floating regions in the respective columns and the holes are not located in the other region Provided

A region where the hole is not provided in the floating region provided in each column may be provided longer than an area where the hole is provided.

When the length of the first floating area in which the holes are not provided in each of the columns is n (n is a natural number) times the length of the second floating area provided with the holes, n (n is a natural number) columns.

The holes include a gas hole providing a gas pressure and a vacuum hole providing a vacuum, and the holes may be alternately provided in the gas hole and the vacuum hole in the first direction.

Wherein a region where the hole is not provided in the floating region provided in each column is provided longer than a region in which the hole is provided and each column is provided in parallel with the first direction, Holes are provided, and when the length of the first floating region in which the holes are not provided in the respective columns is n (n is a natural number) times the length of the second floating region provided with the holes, (N is a natural number) column between the columns, wherein the holes include a gas hole providing a gas pressure and a vacuum hole providing a vacuum, wherein the holes are formed in the gas hole The vacuum holes may be alternately provided.

According to an embodiment of the present invention, it is possible to minimize shaking of the substrate due to the pressure applied to the substrate when the substrate is floated.

In addition, according to an embodiment of the present invention, it is possible to prevent unevenness on the substrate when the chemical liquid is applied to the substrate.

The effects of the present invention are not limited to the above-mentioned effects, and the effects not mentioned can be clearly understood by those skilled in the art from the present specification and attached drawings.

1 is a view showing a substrate processing apparatus according to an embodiment of the present invention.
2 is a plan view showing a top surface of the substrate processing apparatus of FIG.
Figure 3 is a diagram illustrating one embodiment of the stage of Figure 1;
FIG. 4 is a view showing a coated portion in the stage of FIG. 3; FIG.
Fig. 5 is a view showing a modification of the stage of Fig. 1;
Fig. 6 is a view showing the application portion of the stage of Fig. 5;
FIG. 7 is a view showing another modification of the stage of FIG. 1; FIG.
FIG. 8 is a view showing a coated portion in the stage of FIG. 7; FIG.
9 is a view showing still another modification of the stage of FIG.
FIG. 10 is a view showing the application portion in the stage of FIG. 9; FIG.
11 is a cross-sectional view of the substrate processing apparatus of Fig. 2 cut along the line X-X '.
12 to 14 are views showing a process of applying a chemical liquid to a substrate in a substrate processing apparatus.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The embodiments of the present invention can be modified into various forms, and the scope of the present invention should not be construed as being limited to the following embodiments. This embodiment is provided to more fully describe the present invention to those skilled in the art. Thus, the shape of the elements in the figures has been exaggerated to emphasize a clearer description.

FIG. 1 is a view showing a substrate processing apparatus according to an embodiment of the present invention, and FIG. 2 is a plan view showing a top surface of the substrate processing apparatus of FIG. 1

1 and 2, the substrate processing apparatus 1 includes a substrate floating unit 100, a substrate moving unit 200, and a nozzle unit 300.

The substrate floating unit 100 includes a stage 110 and a pressure providing member 170. The stage 110 is provided so that its longitudinal direction extends along the first direction 91. The stage 110 may be provided in the form of a flat plate having a constant thickness. The stage 110 includes a carry-in section 111, a spreading section 112, and a carry-out section 113. The carrying unit 111, the application unit 112 and the carry-out unit 113 are sequentially provided from one end of the stage 110 to the first direction 91. According to an example, the carry-in unit 111, the application unit 112, and the carry-out unit 113 may be separated into separate stages. In this case, each of the stages provided to the carry-in unit 111, the application unit 112, and the carry-out unit 113 may be combined and provided as a single stage 110. Alternatively, one stage 110 may be provided by dividing into a region of the carry-in portion 111, the application portion 112, and the carry-out portion 113. [

FIG. 3 is a view showing an embodiment of the stage of FIG. 1, and FIG. 4 is a view showing an application portion of the stage of FIG.

Referring to FIGS. 3 and 4, the stage 1100 has a plurality of holes 1150 on its upper surface. The plurality of holes 1150 include gas holes 1151 providing gas pressure and vacuum holes 1152 providing vacuum pressure. The plurality of holes 1150 may be provided in different numbers in the carry-in portion 1110, the application portion 1120, and the carry-out portion 1130, respectively. The number of the holes 1150 per unit area provided to the application portion 1120 may be greater than the number of the receiving portion 1110 and the number of the receiving portions 1130. Alternatively, the same number of holes 1150 may be provided in the carrying-in portion 1110, the applying portion 1120, and the carrying-out portion 1130.

A plurality of holes 1150 may be provided to form a plurality of rows 1125. The plurality of rows 1125 may be provided in parallel with the first direction 91. According to an example, the plurality of columns 1125 are divided into a plurality of floating regions 1121 and 1122 having a predetermined length in the first direction 91. The floating regions 1121 and 1122 are divided into a first floating region 1121 in which the holes 1150 are not provided in each column 1125 and a second floating region 1122 in which the holes 1150 are provided. The floating regions 1121 and 1122 can be provided in such a length that the holes 1150 can be positioned four in the first direction 91. Alternatively, the length of the flotation zones 1121, 1122 may be lengthened or reduced.

In each column 1125, the first floating region 1121 and the second floating region 1122 may alternately be located. At this time, if the first flotation region 1121 is first located in the first column 1125a, the second flotation region 1122 is located first in the second column 1125b, and the third column 1125c is located in the first floating region 1125c 1121) may be located.

According to an example, the first flotation area 1121 and the second flotation area 1122 may be provided only to the application unit 1120. In this case, the holes 1150 may be provided in the carry-in part 1110 and the carry-out part 1130, forming a row parallel to the first direction 91. [ Alternatively, the first flotation area 1121 and the second flotation area 1122 may be provided in the carry-in part 1110, the application part 1120, and the carry-out part 1130 as well.

Holes 1150 are provided alternately in the gas holes 1151 and the vacuum holes 1152 in each column. In this case, the first hole of the adjacent column 1125 may be provided differently. For example, if the first hole of the first column 1125a is provided with a gas hole 1151, the first hole of the second column 1125b is a vacuum hole 1152, and the first hole of the third column 1125c And may be supplied again to the gas hole 1151. Alternatively, the types of holes 1150 provided in each column 1125 may be equally provided. For example, only the gas holes 1151 may be provided in the first column 1125a, and only the vacuum holes 1152 may be provided in the second column 1125b.

FIG. 5 is a view showing a modification of the stage of FIG. 1, and FIG. 6 is a view showing an application portion of the stage of FIG.

5 and 6, the stage 1200 includes a carry-in portion 1210, an application portion 1220, and a carry-out portion 1230. [ According to one example, the holes 1250 are formed in the second floating portion 1220 where the length of the first floating region 1221 in which the holes 1250 are not provided in each column 1225 in the application portion 1220, In the case of twice the length of the region 1222, the holes 1250 can be provided such that two rows 1225 are located between the columns 1225 having the same arrangement. The holes 1250 may be positioned in parallel in the first direction 91 in the carry-in unit 1210 and the carry-out unit 1230. [ Alternatively, the holes 1250 may be provided in the same position in the carrying-in portion 1210, the applying portion 1220, and the carrying-out portion 1230.

The holes 1250 are alternately provided in the gas holes 1251 and the vacuum holes 1252 in each row. In this case, the first hole of the adjacent column 1225 may be provided differently. For example, if the first hole of the first column 1225a is provided with a gas hole 1251, the first hole of the second column 1225b is a vacuum hole 1252, and the first stage of the third column 1225c And may be supplied again to the gas hole 1251. Alternatively, the types of holes 1250 provided in each column 1225 may be equally provided. For example, only the gas holes 1251 may be provided in the first column 1225a, and only the vacuum holes 1252 may be provided in the second column 1225b.

The number of the holes 1250 per unit area provided to the application portion 1220 may be more than the number of the receiving portion 1210 and the number of the receiving portion 1230.

FIG. 7 is a view showing another modification of the stage of FIG. 1, and FIG. 8 is a view showing an application portion of the stage of FIG.

7 and 8, the stage 1300 includes a carrying-in portion 1310, a applying portion 1320, and a carrying-out portion 1330. [ According to one example, the holes 1350 are formed in the second floating area 1320 where the length of the first floating area 1321 in which holes 1350 are not provided in each row 1325 in the application part 1320 is provided with holes 1350, In the case of three times the length of the region 1322, the holes 1350 can be provided such that three columns 1325 are located between the columns 1325 having the same arrangement. The holes 1350 may be positioned in parallel in the first direction 91 in the carry-in unit 1310 and the carry-out unit 1330. Alternatively, the holes 1350 may be provided at the same position in the loading section 1310, the applying section 1320, and the unloading section 1330.

Holes 1350 are provided in alternating rows of gas holes 1351 and vacuum holes 1352 in each column 1325. In this case, the first hole of the adjacent column 1325 may be provided differently. For example, if the first hole of the first column 1325a is provided in the gas hole 1351, the first hole of the second column 1325b is the vacuum hole 1352, and the first hole of the third column 1325c And then supplied again to the gas hole 1351. Alternatively, the types of holes 1350 provided in each column 1325 may be equally provided. For example, only the first column 1325a may be provided with the gas hole 1351, and the second column 1325b may be provided with only the vacuum hole 1352. [

The number of the holes 1350 per unit area provided to the application portion 1320 may be more than the number of the receiving portion 1310 and the number of the receiving portions 1330.

FIG. 9 is a view showing still another modification of the stage of FIG. 1, and FIG. 10 is a view showing an application portion of the stage of FIG.

9 and 10, the stage 1400 includes a carry-in portion 1410, an application portion 1420, and a carry-out portion 1430. [ According to one example, the holes 1450 may be positioned in the application portion 1420 such that each row 1425 extends in the hole arrangement direction 95, which is inclined at a certain angle (?) In the first direction 91. According to one example, the angle? Between the first direction 91 and the hole array direction 95 can be provided at an acute angle. In the carrying-in part 1410 and the carrying-out part 1430, the holes 1450 may be positioned in parallel in the first direction 91. Alternatively, the rows 1425 may be arranged in the hole arranging direction 95 in which the rows 1425 are inclined at a predetermined angle? In the first direction 91 in the carrying-in portion 1410, the applying portion 1420 and the carrying-out portion 1430 As shown in FIG. The angle? Between the first direction 91 and the hole array direction 95 may be provided equally in the carry-in portion 1410, the application portion 1420, and the carry-out portion 1430. [ Alternatively, the rows 1425 may be formed at different angles? In the carry-in portion 1410, the application portion 1420, and the carry-out portion 1430, respectively.

The plurality of columns 1425 are divided into a plurality of floating regions 1421 and 1422 having a predetermined length in the hole array direction 95. The floating regions 1421 and 1422 are divided into a first floating region 1421 in which no holes 1450 are provided in each column 1425 and a second floating region 1422 in which a hole 1450 is provided. The floating regions 1421 and 1422 may be provided in such a way that the holes 1450 can be positioned four in the first direction 91. Alternatively, the length of the flotation zones 1421 and 1422 may be lengthened or reduced.

In each column 1425, the first flotation region 1421 and the second flotation region 1422 may alternately be located. When the first flotation area 1421 is first located in the first column 1425a, the second flotation area 1422 is located first in the second column 1425b and the third column 1425c is located in the first floating area 1425b. 1421) may be located.

Holes 1450 are provided alternately in the gas holes 1451 and the vacuum holes 1452 in each column. In this case, the first hole of the adjacent column 1425 may be provided differently. For example, if the first hole of the first column 1425a is provided with a gas hole 1451, the first hole of the second column 1425b is a vacuum hole 1452, and the first stage of the third column 1425c And then supplied again to the gas hole 1451. Alternatively, the types of holes 1450 provided in each column 1425 may be equally provided. For example, only the first column 1425a may be provided with the gas hole 1451, and the second column 1425b may be provided with only the vacuum hole 1452. [

According to an example, the number of holes 1450 per unit area provided to the application portion 1420 may be greater than that of the carry-in portion 1410 and the carry-out portion 1430.

11 is a cross-sectional view of the substrate processing apparatus of Fig. 2 cut along the line X-X '.

Referring to FIG. 11, the pressure providing member 170 is connected to the holes 115 provided on the upper surface of the stage 110. The pressure providing member 170 provides gas pressure or vacuum pressure to the holes 115. The pressure providing member 170 includes a gas pressure providing member 171a, a gas pressure providing line 171b, a vacuum pressure providing member 172a and a vacuum pressure providing line 172b. The gas pressure providing member 171a generates gas pressure. The gas pressure providing member 171a may be located outside the stage 110. [ Alternatively, the gas pressure providing member 171a may be located inside the stage 110. [ The gas pressure providing line 171b connects the gas pressure providing member 171a and the gas hole 115a.

The vacuum pressure supply member 172a generates a vacuum pressure. The vacuum pressure providing member 172a may be located outside the stage 110. [ Alternatively, the vacuum pressure providing member 172a may be located inside the stage 110. [ The vacuum pressure providing line 172b connects the vacuum pressure providing member 172a and the vacuum hole 115b. According to one example, the vacuum pressure providing line 172b may be provided to be connected only to the holes 115 of the application unit 112. [ In this case, the carry-in portion 111 and the carry-out portion 113 may be provided with the exhaust hole 115c to which the gas hole 115a and the pressure providing member 170 are not connected.

1 and 2, the substrate transfer unit 200 includes a guide rail 210 and a gripping member 220. [ The substrate moving unit 200 grasps the substrate S on the stage 110 and moves the substrate S in the first direction 91.

The guide rail 210 is provided extending in the first direction 91 in parallel with the stage 110. The guide rail 210 includes a first guide rail 211 and a second guide rail 212. The first guide rail 211 is positioned on the left side in the first direction 91 with the stage 110 as a center. The second guide rail 212 is positioned on the right side of the stage 110 in the first direction 91. The first guide rail 211 and the second guide rail 212 are provided at symmetrical positions with respect to the stage 110.

The gripping member 220 includes a first gripping member 221 and a second gripping member 222. The first gripping member 221 and the second gripping member 222 grip both sides of the substrate S in the second direction 92.

The first gripping member 221 includes a body 221a and a gripping portion 221b. The body 221a is in contact with the first guide rail 211. The body 221a can move in the first direction 91 along the first guide rail 211. [ The grip portion 221b is provided in a shape protruding in the direction of the stage 110 from the right side surface of the body 221a. A plurality of grip portions 221b may be provided. The grip portion 221b is located above the upper surface of the stage 110. [ This is because the grip portion 221b grasps the substrate S in a state where the substrate S is spaced apart from the stage 110 in the upward direction. According to one example, the grip portion 221b can provide a vacuum to the bottom surface of the substrate S to grip the substrate S. Alternatively, the gripping portion 221b may grip the substrate S by a mechanical method. The second gripping member 222 includes a body 222a and a gripping portion 222b. The second holding member 222 has the same configuration as that of the first holding member 221. The second holding member 222 is provided at a position symmetrical to the first holding member 221 about the stage 110. [

The nozzle unit 300 includes a nozzle moving member 310 and a nozzle 320. The nozzle unit 300 discharges the chemical liquid onto the upper surface of the substrate S.

The nozzle moving member 310 includes a nozzle guide rail 311, a vertical frame 312, and a support 313. The nozzle guide rails 311 are provided outside the guide rails 210. The nozzle guide rails 311 are provided extending in the first direction 91 in parallel with the guide rails 210.

The vertical frame 312 connects the nozzle guide rail 311 and the support 313. The lower end of the vertical frame 312 is connected to the nozzle guide rail 311. So that the vertical frame 312 can move in the first direction 91 above the nozzle guide rails 311. Both ends of the support base 313 are connected to the upper end of the vertical frame 312. The support 313 is provided so that the longitudinal direction extends along the second direction 92. A nozzle 320 is positioned on the lower surface of the support base 313.

The nozzle 320 is provided so that the longitudinal direction extends along the second direction 92. At least one surface of the nozzle 320 is coupled to the support 313 and positioned to be spaced apart in the third direction 103 above the stage 110. The nozzle 320 discharges the chemical liquid to the substrate S. The chemical solution may be provided as a sensitizing solution, specifically, as a photoresist.

The nozzle guide rail 311 may not be provided when the chemical liquid is selectively discharged at a position where the nozzle 320 is fixed.

Hereinafter, a process of applying a chemical liquid onto a substrate by the substrate processing apparatus according to an embodiment of the present invention will be described in detail.

12 to 14 are views showing a process in which a chemical liquid is applied to a substrate in a substrate processing apparatus.

Referring to Figs. 12 to 14, the substrate S is transported from an external transport unit (not shown) to the carry-in unit 111. Fig. Thereafter, the substrate S is conveyed to the other transport unit (not shown) outside the coating unit 112 and the carry-out unit 113 sequentially. At this time, the external transfer unit (not shown) may be a robot with a hand or may be provided with shafts.

The substrate S is transported from an external transport unit (not shown) to the carry-in section 111 of the stage 110. The gripping member 220 grips the substrate S when the substrate S is moved to the carry-in portion 111. [ The substrate S is lifted and moved by the gas pressure provided on the carry-in part 111. [ According to one example, only the gas pressure is provided above the carry-in section 111, and vacuum pressure may not be provided. In this case, the gas provided on the upper portion of the carry-in portion 111 and the lower portion of the substrate S can be exhausted through the exhaust hole 115c. Alternatively, both the gas pressure and the vacuum pressure may be provided above the carry-in section 111. The substrate moving unit 200 moves the held substrate S to the application unit 112 in a floating state on the stage 110.

The substrate S is applied on the upper surface while the substrate S moves in the first direction 91 by the application unit 112. [ The chemical liquid is discharged downward from the nozzle 320 provided at a position spaced apart from the application unit 112 in the third direction 93. [ The chemical liquid is applied to the upper surface of the substrate S in a state in which the substrate S floats above the stage 110. [ The application unit 112 is provided with a gas pressure and a vacuum pressure on the bottom surface of the substrate S unlike the carry-in unit 111. [ The pressure between the bottom surface of the substrate S and the upper surface of the application portion 112 can be adjusted more precisely than the carrying-in portion 111. [ The substrate S is moved in the first direction 91 while being separated from the upper portion of the application portion 112 due to the provided pressure. Further, the holes 115 may be provided more than the carry-in portion 111. The pressure between the bottom surface of the substrate S and the upper surface of the application portion 112 can be adjusted more precisely than the carrying-in portion 111. [ When the holes 115 are arranged in the hole arrangement direction 95 to form a plurality of rows as in the embodiment of the substrate floating unit of the present invention, Can be minimized. Thus, it is possible to prevent problems such as occurrence of unevenness when the chemical liquid is discharged onto the substrate (S). When the application of the chemical solution is completed, the substrate S moves to the take-out unit 113 in a floating state.

The substrate S moved to the carry-out section 113 is moved in the first direction 91 together with the substrate moving unit 200. [ The substrate S is lifted and moved by the gas pressure provided to the upper portion of the carry-out portion 113 from the carry-out portion 113 as well. Only the gas pressure may be provided above the carry-out portion 113. Alternatively, both gas pressure and vacuum pressure may be provided. The substrate S is transported from an unloading section 113 to an external transport unit (not shown).

The foregoing detailed description is illustrative of the present invention. In addition, the foregoing is intended to illustrate and explain the preferred embodiments of the present invention, and the present invention may be used in various other combinations, modifications, and environments. That is, it is possible to make changes or modifications within the scope of the concept of the invention disclosed in this specification, within the scope of the disclosure, and / or within the skill and knowledge of the art. The embodiments described herein are intended to illustrate the best mode for implementing the technical idea of the present invention and various modifications required for specific applications and uses of the present invention are also possible. Accordingly, the detailed description of the invention is not intended to limit the invention to the disclosed embodiments. It is also to be understood that the appended claims are intended to cover such other embodiments.

100: substrate floating unit 110: stage
112: application part 115: hole
170: pressure providing member 200: substrate moving unit
220: grip member 300: nozzle unit

Claims (2)

A substrate floating unit for floating the substrate;
A nozzle unit located above the substrate floating unit and discharging the chemical liquid to the substrate; And
And a substrate moving unit including a gripping member for gripping the substrate and moving the gripping member in a first direction,
The substrate floating unit
A stage on which an upper surface is provided with a plurality of holes; And
And a pressure providing member for supplying a gas pressure or a vacuum pressure to the upper portion of the stage through the holes,
The plurality of holes being provided to form a plurality of rows,
Each column is divided into a plurality of floating regions,
Wherein the holes are provided in one of the adjacent floating regions in each of the columns and the holes are not provided in another region. The method according to claim 1,
Wherein a region in which the hole is not provided in the floating region provided in each column is provided longer than a region in which the hole is provided,
Each row being provided parallel to the first direction,
The same number of holes are provided in each of the floating regions,
When the length of the first floating area in which the holes are not provided in each of the columns is n (n is a natural number) times the length of the second floating area provided with the holes, n (n is a natural number) columns,
Wherein the holes include a gas hole providing a gas pressure and a vacuum hole providing a vacuum pressure, wherein the holes are alternately provided in a gas hole and a vacuum hole in a first direction.

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