KR100837849B1 - Processing solution supplying method and processing solution supplying apparatus - Google Patents

Abstract

Since the application sequence is applied from the discharge start point S1 to the discharge end point Sn so as to be directed from both ends to the center of the substrate, the drying time of the application heat is approximately the same at both ends. Therefore, since the drying time of each coating heat is symmetrical about the coating heat in the center line of the substrate, the processing of the next process proceeds as it is in this dry state, so that the uniformity of the film thickness can be ensured, and the nozzle When the outside is moved, the resist liquid discharge amount is reduced or the discharge is stopped so that the resist can be saved.

Description

Process solution supply method and process solution supply device {PROCESSING SOLUTION SUPPLYING METHOD AND PROCESSING SOLUTION SUPPLYING APPARATUS}

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a plan view showing a coating and developing processing system for an LCD substrate to which the present invention is applied.

2 is a schematic plan view of a resist coating apparatus CT according to a first embodiment of the present invention.

FIG. 3 is a partial sectional view showing a schematic configuration of the resist coating device CT shown in FIG. 2.

4 is a plan view for explaining a resist coating procedure according to the first embodiment of the present invention.

5 is a plan view for explaining the application procedure.

6 is a plan view for explaining the coating procedure.

FIG. 7: is a figure for demonstrating the application | coating procedure, and is a top view which shows application | coating toward the center part from the both ends of a board | substrate.

8 is a schematic plan view of a resist coating apparatus CT according to a second embodiment of the present invention.

Fig. 9 is a view for explaining the resist coating procedure according to the second embodiment of the present invention, and is a plan view showing coating from both ends of the substrate toward the center portion.

It is a figure for demonstrating the application | coating procedure and is a top view which shows application | coating toward the both ends from the center part of a board | substrate.

11 is a plan view for explaining the coating procedure.

Fig. 12 is a view for explaining a resist supply method according to a third embodiment of the present invention, and is a plan view showing the application by lapping.

Fig. 13 is a view for explaining a resist supply method according to a fourth embodiment of the present invention, and is a plan view showing a supply method by an elongated nozzle.

Fig. 14 is a view for explaining a resist supply method according to a fifth embodiment of the present invention, which is a plan view showing a supply method by two long nozzles.

<Description of the symbols for the main parts of the drawings>

G: glass substrate G1 to G4: each side of the glass substrate

22: resist coating device 41: resist coating device

46: nozzle 46a: one nozzle

46b: other nozzle 58: substrate adsorption table

74: CPU

TECHNICAL FIELD This invention relates to the processing liquid supply method and processing liquid supply apparatus which apply | coat a processing liquid, such as a resist liquid, on the glass substrate used for a liquid crystal display (LCD), for example.

In the LCD manufacturing process, the same photolithography technique used in the manufacture of semiconductor devices is used to form a thin film or an electrode pattern of indium tin oxide (ITO) on an LCD glass substrate. In photolithography, a photoresist is applied to a glass substrate, which is exposed and developed.

As a resist liquid supplying method, there is a method of applying a resist liquid supply nozzle on a glass substrate by scanning the resist liquid in the horizontal and vertical directions from the end to the end of the substrate to form a thin line. In such a supply method, a single system having one discharge hole of a resist liquid supply nozzle and a plurality of discharge holes of a resist liquid supply nozzle are provided at regular intervals, and a method of simultaneously discharging resist from the plurality of discharge holes. have. According to such a plurality of ejection holes, the number of times the supply nozzle scans on the glass substrate can be reduced as compared with one ejection hole method, so that the tact of the coating process can be shortened.

However, even in the case of the plurality of ejection hole nozzles, the coating is applied by scanning from the end of the glass substrate to the end. Therefore, there is a time difference between the application start side and the application end side of the glass substrate, so that the resist drying time is the application start side of the glass substrate. This results in different results at both ends on the application end side. Therefore, in the state where the drying time of the resist is different at both ends of the substrate, for example, a reduced pressure drying process is performed to prevent the formation of transfer marks in the next step, and the thickness of the resist film becomes uneven at both ends of the glass substrate. Throw it away.

In addition, since the application by the plurality of ejection hole nozzles has a large amount of resist ejection per unit time as compared with the case of one ejection hole nozzle, the amount of ejection to parts other than the substrate is large when the nozzle scans the periphery of the glass substrate. The resist was wasted.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and in the case of coating with a plurality of discharge hole nozzles, it is desirable to ensure uniformity of the thickness of the resist film on the substrate by symmetrically drying the resist liquid on the substrate. The purpose.

In order to achieve the above object, a first aspect of the present invention provides a process for supplying a processing liquid to a first region on a substrate, and a processing liquid for a second region on the substrate that is linearly symmetrical with the first region. The process of supplying is provided.

According to this structure, the processing liquid is supplied to one end of a board | substrate as a 1st area | region, for example, and the other end of the said opposite side of the said end as a 2nd area | region which becomes line symmetry with a 1st area | region ( Since the treatment liquid is supplied to vi), the treatment liquid drying time can be made symmetrical on the substrate. As a result, even in the next step, the film thickness can be maintained uniform.

According to one aspect of the present invention, the supply of the processing liquid to the first region and the second region has a length shorter than half the length of one side of the substrate, and at the same time discharges the processing liquid along the longitudinal direction. It consists of a nozzle provided with the some discharge hole which draws out. By supplying the processing liquid by the nozzle having the plurality of discharge holes, the tact can be shortened as compared with the conventional single-hole nozzle, contributing to the improvement of symmetry in the drying time of the processing liquid. Further, for example, by using a nozzle having a length of about half of one side of the substrate, the tact can be further shortened because the processing liquid is supplied to the entire surface of the substrate only by reciprocating the nozzle on the substrate. Contributes to the improvement of symmetry in drying time.

According to one aspect of the present invention, the supply of the processing liquid to the first region and the second region is performed while moving the nozzle in parallel with one side of the substrate, and is centered from both ends of the substrate. The processing liquid is supplied over the side. Thereby, processing liquid drying time can be made symmetrical on a board | substrate. Therefore, even if the treatment is performed in the next step, it is possible to maintain the uniformity of the film thickness. For example, conventionally, the viscosity of the processing liquid is low depending on the type of processing liquid, so that the film thickness becomes thinner from the center of the substrate toward both ends, so that the processing liquid flows outward from both ends thereof. However, according to the present invention, since the drying time becomes longer from the center of the substrate toward both ends, there is no fear that the processing liquid will flow from both ends.

According to one aspect of the present invention, the supply of the processing liquid to the first region and the second region is performed while moving the nozzle in parallel with one side of the substrate, and is processed from the center side of the substrate to both ends. Supply the liquid. Thereby, processing liquid drying time can be made symmetrical on a board | substrate. Therefore, even if the treatment is performed in the next step, it is possible to maintain the uniformity of the film thickness. For example, in the past, depending on the type of treatment liquid, there was a case in which the viscosity of the liquid was high in the treatment liquid and the treatment liquid became thick at both ends due to the surface tension. Since the drying time is shortened from the both ends to the both ends, there is no fear that the treatment liquid will be dried and thick at both ends, thereby ensuring uniformity of the film thickness.

According to one aspect of the present invention, the discharge amount of the processing liquid is reduced from the nozzle outside the substrate or the discharge is stopped. As a result, it is possible to save the processing liquid by reducing the unnecessary processing liquid discharged to the outside of the substrate.                         

According to one aspect of the present invention, the supply of the processing liquid to the first region and the second region has a length shorter than the length of about half of one side of the substrate, and the processing liquid along the length direction. The processing liquid is simultaneously discharged by the first nozzle and the second nozzle having a plurality of discharge holes for discharging the liquid. Thus, since two nozzles apply | coat simultaneously, for example from both ends of a board | substrate simultaneously, the drying time in the both ends of a board | substrate matches more correctly, and the uniformity of a film thickness can be improved further and a tact can be shortened further.

According to a second aspect of the present invention, there is provided a nozzle for discharging a processing liquid onto a substrate, a moving mechanism for moving the nozzle on the substrate, and moving the nozzle by the moving mechanism to supply the processing liquid to the first region on the substrate. And a control unit for controlling the supply of the processing liquid to the second region on the substrate which is in line symmetry with the first region.

According to this structure, for example, the processing liquid is supplied to one end of the substrate as the first region while the nozzle is moved, and then the processing liquid is supplied to the other end of the opposite side of the one end as the second region which is linearly symmetric with the first region. By doing this, the drying time of the processing liquid can be made symmetrical on the substrate. As a result, even in the next step, the film thickness can be maintained uniform.

According to one aspect of the present invention, the nozzle has a length shorter than about half the length of one side of the substrate and has a plurality of discharge holes for discharging the processing liquid along the length direction. By supplying the processing liquid by the nozzles having such a plurality of discharge holes, the tact can be shortened as compared with the conventional single-hole nozzle, contributing to the improvement of symmetry in the drying time of the processing liquid. Further, for example, by using a nozzle having a length of about half of one side of the substrate, the tact can be further shortened because the processing liquid is supplied to the entire surface of the substrate only by reciprocating the nozzle on the substrate. Contributes to the improvement of symmetry in drying time.

According to one aspect of the present invention, the supply of the processing liquid to the first region and the second region is performed while moving the nozzle in parallel with one side of the substrate, and is processed from both ends of the substrate to the center side. And means for controlling to supply the liquid. Thereby, the drying time of a process liquid can be made symmetrical on a board | substrate. Therefore, even if the treatment is performed in the next step, it is possible to maintain the uniformity of the film thickness. For example, in the past, depending on the type of the processing liquid, the viscosity of the processing liquid was low, so that the film thickness became thin as it went from the center of the substrate to both ends, so that the processing liquid flowed outward from both ends thereof. According to the present invention, since the drying time becomes longer as it goes from the center of the substrate to both ends, there is no fear that the processing liquid flows from both ends.

According to one aspect of the present invention, the supply of the processing liquid is performed while moving the nozzle in parallel to one side of the substrate, and means for controlling the supply of the processing liquid from the center side of the substrate to both ends. It is further provided. Thereby, the drying time of a process liquid can be made symmetrical on a board | substrate. Therefore, even if the treatment is performed in the next step, it is possible to maintain the uniformity of the film thickness. For example, in the past, depending on the type of treatment liquid, there was a case in which the viscosity of the liquid was high in the treatment liquid and the treatment liquid became thick at both ends due to the surface tension. Since the drying time is shortened toward both ends, there is no fear that the treatment liquid will dry and become thick at both ends, thereby ensuring uniformity of the film thickness.

According to one aspect of the present invention, there is further provided a means for controlling to reduce the discharge amount of the processing liquid from the nozzle outside the substrate or to stop the discharge. As a result, it is possible to save the processing liquid by reducing the unnecessary processing liquid discharged to the outside of the substrate.

A 3rd viewpoint of this invention is provided with the 1st nozzle which supplies a process liquid to a 1st area | region on a board | substrate, and the 2nd nozzle which supplies a process liquid to the 2nd area | region on a board | substrate which is linearly symmetrical with the said 1st area | region.

According to such a structure, since the two nozzles apply | coat simultaneously from both ends of a board | substrate simultaneously, for example, the drying time in the both ends of a board | substrate matches more accurately, and the uniformity of a film thickness can be improved further and a tact can be shortened further. . This contributes to the improvement of symmetry in the drying time of the treatment liquid.

EMBODIMENT OF THE INVENTION Hereinafter, the Example of this invention is described based on drawing.

1 is a plan view showing a resist coating and developing processing system for an LCD substrate to which the present invention is applied.

This coating and developing processing system includes a cassette station 1 for placing a cassette C containing a plurality of substrates G, and a series of processes including resist coating and developing on the substrate G. And an interface unit 3 for conveying the substrate G between the processing unit 2 having a plurality of processing units for exposing it, and an exposure apparatus (not shown in the drawing), and both ends of the processing unit 2. The cassette station 1 and the interface unit 3 are respectively arranged in (iii).

The cassette station 1 is provided with a conveyance mechanism 10 for conveying the LCD substrate between the cassette C and the processing unit 2. Then, the cassette C is carried in and out of the cassette station 1. Moreover, the conveyance mechanism 10 is equipped with the conveyance arm 11 which can move on the conveyance path 10a provided along the arrangement direction of a cassette, The cassette C and the processing part 2 by this conveyance arm 11 The substrate G is transported in between.

The processing part 2 is divided into a front end part 2a, a middle part part 2b, and a rear end part 2c, and the conveyance paths 12, 13, and 14 are centered, respectively. ), And each processing unit is provided on both sides of these conveying paths. The relays 15 and 16 are provided between them.

The front end part 2a is equipped with the main conveying apparatus 17 which can move along the conveyance path 12, and one washing | cleaning unit (SCR) 21a, 21b is provided in one side of the conveyance path 12. As shown in FIG. The ultraviolet irradiation / cooling unit 25 in which the ultraviolet irradiation unit UV and the cooling unit COL are piled up and down on the other side of the conveyance path 12 and two heat treatments The heat treatment unit 26 in which the apparatus HP is piled up and down, and the cooling unit 27 in which two cooling apparatuses COL are piled up and down are arrange | positioned.

Moreover, the interruption | blocking part 2b is equipped with the main conveying apparatus 18 which can move along the conveyance path 13, The resist coating process unit (CT) 22 which concerns on this invention is provided in one side of the conveyance path 13; And a resist-drying apparatus (VD) 40 is disposed adjacent to the resist coating device (CT) 22, and the resist attached to the edge portion of the substrate G or the rear edge of the substrate G is removed. The edge remover (ER) 23 to which a process is performed is arrange | positioned adjacent to this pressure reduction drying apparatus (VD) 40. As shown in FIG. On the other side of the conveying path 13, a heat treatment unit 28 in which two heating apparatuses HP are stacked up and down, and a heat treatment / cooling unit in which the heating treatment apparatus HP and the cooling treatment apparatus COL are stacked up and down. (29) and the adhesion strengthening treatment / cooling unit 30, in which the adhesion strengthening treatment apparatus AD and the cooling apparatus COL, which are subjected to hydrophobic treatment, are stacked up and down, are disposed.                     

In addition, the rear end 2c is provided with a main conveying apparatus 19 which can move along the conveying path 14, and one of the conveying paths 14 has three developing processing units (DEVs) 24a, 24b, and 24c. Is disposed, and on the other side of the conveying path 14, the heat treatment unit 31 and the heat treatment apparatus HP and the cooling apparatus COL, in which two heat treatment apparatuses HP are stacked up and down, are stacked up and down. Two heat treatment / cooling units 32 and 33 are arranged.

The main transport apparatuses 17, 18, and 19 each have an X-axis drive mechanism, a Y-axis drive mechanism, and a Z-axis drive mechanism in the vertical direction, respectively, in a horizontal plane, and are rotated about the Z axis. The drive mechanism is provided, and the arms 17a, 18a, 19a which support the board | substrate G are provided, respectively. These arms 17a, 18a, and 19a make it possible to transport the substrate G to each processing unit.

Moreover, the processing part 2 arrange | positions only coating system units, such as the washing | cleaning processing apparatus 21a, 21b, the resist coating apparatus (CT) 22, and the developing processing apparatus 24a, 24b, 24c on one side with a conveyance path between them. It has a structure which arrange | positions only heat processing system units, such as a heat processing unit and a cooling processing unit, on the other side.

In the relay portions 15 and 16, the chemical liquid supply unit 34 is disposed on the side of the side where the coating system unit is disposed, and a space 35 for maintenance is provided, respectively. It is.

The interface unit 3 includes an extension 36 which temporarily supports the substrate when transferring the substrate between the processing unit 2, and two buffer stages 37 which are provided at both sides thereof to arrange the buffer cassette. And a conveyance mechanism 38 for carrying in and out of the substrate G between these and the exposure apparatus (not shown). The conveyance mechanism 38 is equipped with the conveyance arm 39 which can move on the conveyance path 38a provided along the extension 36 and the buffer stage 37 in the arrangement direction, and the conveyance arm 39 processes the process part. The conveyance of the board | substrate G is performed between (2) and an exposure apparatus.

2 and 3 show a resist coating device (CT) 22. As shown in these figures, a cylindrical frame 71a having a bottom is disposed at the center of the resist coating apparatus CT 22, and the glass substrate G is disposed in the frame 71a. Substrate adsorption table 58 which is a support part for fixing and supporting this is arrange | positioned. Moreover, the opening part 71c for putting in and out the glass substrate G is formed in the upper part of this frame 71a.

The substrate adsorption table 58 is connected with a vacuum adsorption device 72 for adsorbing and supporting the glass substrate G in a vacuum. Moreover, this board | substrate adsorption table 58 is made to be able to raise and lower by the lifting cylinder 73 via the rod 75. Moreover, the operation | movement of this lifting cylinder 73 is controlled by CPU74. Specifically, the lower side of the rod 75 is provided in a cylinder not shown in the drawing, in which the rod 75 moves up and down the cylinder 73 via a vaccum seal 76. It can be moved up and down by the drive of.

Carrying rails 66 and 66 are disposed on both sides of the frame 71a, and scanning mechanisms 100 are provided between the conveying rails 66 and 66. As shown in FIG. The scanning mechanism 100 includes a first slider 67 that moves between the conveyance rails 66 and 66 and moves along the conveyance rails 66 and 66 in the Y direction, and the first slider 67. It is provided with the 2nd slider 43 which is laid and can move to the X direction along the longitudinal direction of the 1st slider 67, and the nozzle 46 which discharges a resist is fixed. The nozzle 46 is connected by a supply pipe 42 from the tank 50 storing the resist liquid, and a bellows pump 49 for discharging the resist liquid between the nozzle 46 and the tank 50. Is connected. The bottom surface side of the nozzle 46 is provided with 20 discharge holes which are not shown in figure, for example.

In the conveyance rail 66, the 1st slider 67 is moved along this conveyance rail 66 by the instruction | command of CPU74 near the 1st travel end, and the 2nd slider 43 ) Is provided with a drive unit 48 for moving along the first slider 67. In addition, the CPU 74 controls the operation amount of the bellows pump 49 according to the movement distance of each slider 67 and 43, that is, the movement position of the nozzle 46 on the glass substrate G, thereby discharging the resist liquid. Is variable.

The operation of the resist coating and developing processing system configured as described above will be described.                     

Referring to FIG. 1, the substrate G in the cassette C is conveyed to the processing unit 2 by the transfer arm 11. In the processing section 2, the surface modification and cleaning treatment is first performed by the ultraviolet irradiation device UV of the ultraviolet irradiation / cooling unit 25 of the front end 2a. After cooling in the cooling device (COL), scrubber cleaning is performed in the cleaning units (SCRs) 21a and 21b, and after being heated and dried in any one of the heat treatment devices HP disposed at the front end portion 2a. The cooling unit COL of any one of the cooling units 27 is cooled.

Subsequently, the substrate G is conveyed to the stop portion 2b to be hydrophobized (HMDS treatment) in the adhesion strengthening apparatus AD at the upper end of the unit 30 in order to increase the fixing ability of the resist. After cooling in the cooling device COL, it is carried into the resist coating device CT 22.

In this resist coating apparatus (CT) 22, the board | substrate adsorption table 58 is carried out by the main conveying apparatus 18 in the state in which the board | substrate adsorption table 58 is rising upward rather than the opening part 71c of the frame 71a. ), The glass substrate G is first moved and placed, and is adsorbed and supported by vacuum. Subsequently, the substrate adsorption table 58 is lowered by the driving of the lifting cylinder 73, and the glass substrate G passes through the opening 71c and is carried into the frame 71a.

Subsequently, the drive unit 48 moves the first slider 67 along the conveyance rail 66 in the Y direction according to the command of the CPU 74 according to the size of the glass substrate G, and at the same time, the second slider. Move 43 to the X direction along the first slider 67. As a result, the nozzle 46 fixed to the second slider is shown in Fig. 4A, for example, the predetermined discharge start point S1 located outside the edge of one side G1 in the substrate G. To go.

Then, the nozzle 46 moves in the Y direction from the discharge start point S1 toward the side G3 facing the side G1 to discharge the resist R in the first row as shown in FIG. 4 (b). do. Although the resist R discharged from the nozzle 46 is shown by five solid lines in order to make it easy to show in the figure here, since 20 discharge holes are provided, for example, it becomes 20 thinner lines actually. Subsequently, when it moves to the predetermined position S2 located outside the side G3, resist discharge is stopped, and as shown in FIG. 5 (a), the substrate G is moved from the position S2 toward the side G4. It moves to the X direction to the predetermined position S3 located in the outer side of the corner. Then, the discharge is started again from the position S3 and the resist R2 of the second row is discharged while moving in the Y direction from the position S3 toward the side G1 as shown in FIG. 5 (b). When reaching the predetermined position S4 located outside the corner of G1, the discharge is stopped here, and from this position S4, the edge G4 is changed by the width of the nozzle 46 at the discharge start point S1. The resist R3 of the third row is discharged while moving in the X-direction to the position S5 moved to the side of S) and moving in the Y-direction from the position S5 to the side G3 again. The above operation is repeated, that is, the resist is supplied while moving from both ends of the substrate G to the center portion, and the resist is applied to the entire surface of the glass substrate G.

FIG. 6 schematically shows the trajectory of the nozzle 46 on the substrate G as described above. In this way, the application sequence is the discharge start point S1 to S2 (first row), S2 to S3, S3 to S4 (second row), and the discharge end point Sn (nth row) from Sn-1 and the substrate G. Since the coating is applied from both ends G2 and G4 toward the center, the drying time of the heat of application is substantially the same at both ends G2 and G4. In addition, since the drying time of each coating heat is symmetric about the coating heat of the board | substrate center line M shown by the dotted line in the figure, the process of the next process is advanced as it is in this dry state, and the uniformity of a film thickness can be ensured. Can be. In addition, when the nozzle 46 moves outside of the substrate G, the resist liquid discharge is stopped, so that the resist can be saved.

Also, conventionally, depending on the type of resist, the viscosity of the resist liquid is low, so that the film thickness becomes thinner from the center row of the substrate G toward both ends G2 and G4. In some cases, a phenomenon that flows outward from both ends G2 and G4 occurs, but according to this embodiment, the drying time becomes longer as it goes from the center row of the substrate G to both ends, so that the resist liquid flows from both ends. There is no.

In addition, the discharge end point Sn of the substrate center row shown in FIG. 6 may be applied in a reverse order to the application procedure of the above embodiment as the discharge start point S1 as shown in FIG. 7. That is, when the resist is discharged while moving in the Y direction from the predetermined discharge start point S1 outside the substrate toward the side G3 in the center column and moved to the predetermined position S2 outside the side G3, resist discharge is stopped. It moves from this position S2 toward the side G2 toward the side G2 by the width of the nozzle 46, and continues from the position S3 toward the side G1 to the position S4 outside the side G1. Discharge while moving in the direction. The discharge is stopped at S4 and discharged while moving in the X direction to the position S5 corresponding to twice the width of the nozzle 46 and moving in the Y direction again. By doing in this way, the drying time of application | coating heat in both end parts G2 and G4 is substantially the same similarly to the application | coating procedure shown in FIG. 6, and can make film thickness uniform.

Particularly in the past, depending on the type of resist, a phenomenon in which the resist liquid is high and the resist becomes thick at both ends may occur due to the surface tension, but according to the present embodiment, both ends (G2) and Since the drying time is shortened toward (G4), there is no fear that the resist is dried and thick at both ends, so that uniformity of the film thickness can be ensured. Also in this embodiment, when the nozzle 46 moves outside of the substrate G, the resist liquid discharge is stopped. Therefore, the resist liquid can be saved without supplying the unnecessary resist liquid.

After the treatment liquid is applied by the resist coating device (CT) 22, the rod 75 is raised to release the vacuum suction of the glass substrate G, and the edge remover (CT) is removed from the resist coating device (CT) 22. ER) 23 is conveyed to the next pressure reduction drying apparatus (VD) 40 which is a next process by the arm not shown in the figure which conveys the board | substrate G, and is dried. Subsequently, the edge remover ER removes the resist attached to the edge portion of the substrate G or the rear edge of the substrate G.

After this, the glass substrate G is prebaked in any one of the heat treatment devices HP disposed at the stop 2b, and cooled in the cooling device COL at the bottom of the unit 29 or 30, It is conveyed from the relay part 16 to the exposure apparatus which is not shown in figure by the main conveying apparatus 19 through the interface part 3, and a predetermined pattern is exposed here. Subsequently, the substrate G is brought in again through the interface unit 3, and if necessary, the post-exposure bake treatment is carried out by one of the heat treatment apparatuses HP at the rear end portion 2c, and then the development unit DEV is carried out. Is developed in any one of () 24a, 24b, and 24c.

After the developing treatment is performed on any one of the developing units (DEVs) 24a, 24b, and 24c, the processed substrate G is post-baked by any one of the heat treating apparatuses HP at the rear end 2c. After is carried out, it is cooled in the cooling device COL and is accommodated in a predetermined cassette on the cassette station 1 by the main transport devices 19, 18, 17 and the transport mechanism 10.

8 shows the resist coating apparatus of the second embodiment, which differs from the components of the resist coating apparatus (CT) 22 of the first embodiment in the resist coating apparatus (CT) 41. Is provided with two nozzles 46 provided with each other. These one nozzle 46a and the other nozzle 46b move along the 1st slider 67 in the 1st slider 43a and the other 2nd slider 43b. Is fixed to each). Moreover, one nozzle 46a and the other nozzle 46b are connected to the resist liquid supply pipe 42, respectively. Since other components are the same, the same reference numerals are used and description thereof will be omitted.

In this resist coating device (CT) 41, the first slider 67 is first moved along the conveyance rail 66 in the Y direction by the drive unit 48, and at the same time, one and the other second sliders 43a are provided. And 43b move in the X direction along the first slider 67. As a result, as shown in Fig. 9A, one nozzle 46a fixed to one first slider 43a is, for example, the outer side of one corner of one side G1 in the substrate G. The other nozzle 46b fixed to the other 2nd slider 43b moves to the predetermined discharge start point S1a located in the inside, and the predetermined discharge is located outside the other corner of one side G1. Move to the starting point S1b. One nozzle 46a and the other nozzle 46b respectively move in the Y direction simultaneously to supply the resist of the first row, and as shown in Fig. 9 (b), located outside the side G3. When the predetermined positions S2a and S2b are reached, the amount of resist discharge is reduced by the control of the CPU 74, respectively. While maintaining the discharge amount, one nozzle 46a moves to the left direction S3a in the X direction in the drawing, while the other nozzle 46b also moves in the X direction right in the drawing (S3b). ), And discharge the resist in the second row while simultaneously moving in the Y direction with the respective discharge amounts in the S3a and S3b being the same as the first column again. When reaching to the outer side S4a and S4b of the side G1, respectively, the resist discharge amount is reduced as in S2a to S3a and S2b to S3b, and the respective discharge amounts from S5a and S5b are the same as in the first and second rows, and Y Move in the direction of By repeating this operation, the resist is applied to the entire surface from the first row across the substrate G to the n-th row, which is the central row.

According to this second embodiment, since the coating is applied sequentially from the first row across the substrate G to the nth row, which is the central row, the same effect as in the first embodiment is obtained, and at the same time, two nozzles 46a are obtained. ) And (46b) simultaneously apply from both ends of the substrate (G), so that the drying time at both ends of the substrate (G) is more accurately matched, so that the uniformity of the film thickness is further improved, and the tact ( tact) can be shortened.

In addition, since the discharge amount of the resist liquid is reduced outside the substrate G such as between S2a to S3a and S4a to S5a, the resist liquid can be saved. The discharge may be stopped in the same manner as in the first embodiment without reducing the discharge amount on the outside of the substrate G.

Fig. 10 is a diagram showing the application procedure reversed in the second embodiment described above. That is, two nozzles 46a and 46b are discharged at predetermined center discharge start points S1a and S1b, so that the entirety from the first row of the center of the substrate G to the nth row of both ends of the substrate G is obtained. Apply to cotton. Fig. 11 shows the discharge end points S1a and S1b from the outer ends of the sides G1, respectively, by the two nozzles 46a and 46b, respectively, from the outer ends S2a and S2b of the sides G3 simultaneously. Discharge and move from the positions S2a and S2b to the positions S3a and S3b of the substrate center row, respectively, and discharge them to the outer positions S4a and S4b of the side G1, respectively, It discharges repeatedly, simultaneously moving to a predetermined discharge end point.

The drying time of the resist applied to the both ends of the substrate G becomes the same by the application procedure shown in Figs. 10 and 11, and the film thickness can be made uniform because the processing of the next step proceeds in this dry state. This is effective, as in the first embodiment, especially when the film thickness across the substrate G needs to be precisely controlled. Also in the above case, between the S2a and the S3a outside the substrate G, the discharge amount of the resist is reduced or the discharge is stopped. As a result, the resist can be saved.

12 (a) and 12 (b) show a resist supply method according to the third embodiment. In this embodiment, as shown in Fig. 12A, by one nozzle 46, the nozzle 46 is half the width of the nozzle 46 from the discharge start point S1 (Fig. 4A) in the first embodiment. In the drawing, the resist is moved from the position S1 'shifted to the right direction to the position S2' while discharging the resist in the Y direction (first row), and is then half the width of the nozzle 46 than the position S3 in the first embodiment. In the figure, it moves to the position S3 'which shifted to the left direction, and it discharges, moving from the position S3' to the position S4 'in the Y direction (2nd column). Then, it moves from the position S4 'to the position S5' corresponding to the discharge start point S1 in the first embodiment and moves in the Y direction while only half of the width of the nozzle 46 is applied to the first row resist. . Subsequently, in the second row, the film is moved in the Y direction toward the side G1 while being coated and applied in the same manner, and the operation of overlapping and applying only half of the width is applied sequentially from both ends of the substrate G toward the center row. Also in this case, when moving from the outside of the substrate G such as S2 'to S3', the discharge amount is reduced or stopped.

According to this embodiment, there is no possibility that uncoated portions may occur between the resists applied in each row, and the film thickness can be uniformly applied. In the present embodiment, the first row, the third row, and the second row and the fourth row are not overlapped and coated, and the coating is performed in the same manner as the first and second embodiments, and the other rows are stacked and coated. May be used. Thereby, the film thickness of both ends G2 and G4 of a board | substrate can be made thinner than the film thickness of another site | part, and it can suppress that the film thickness of both ends becomes thick. Therefore, uniformity of the film thickness can be secured. In this case, the coating amounts (coating amounts of the first row and the second row) at both ends may be adjusted.

Next, with reference to FIG. 13, the resist supply method which concerns on 4th Example is demonstrated. In the present embodiment, when the glass substrate G is large and the product region is four surfaces, for example, G1, G2, G3, and G4, instead of the nozzles 46 in the above embodiments, the short sides of the substrate ( Ga) An elongated nozzle 51 having a length of about half the length and similarly formed with a plurality of resist discharge holes not shown in the drawing is provided, and the nozzle 51 provides a substrate in the order of? → ② → ③ → ④. (G) Resist is supplied to the whole surface.

In this way, the resist is supplied in one reciprocation by the long nozzle 51 having the length of about half of the short side Ga, so that in the regions G1 and G4 and the regions G2 and G3, The drying time can be made about the same. Moreover, by using such a long nozzle 51, the supply processing time of a resist is shortened and it contributes to the improvement of symmetry in the drying time of a process liquid.

Next, with reference to FIG. 14, the resist supply method which concerns on 5th Example is demonstrated. In this embodiment, when the glass substrate G is large and the product region is four surfaces, for example, G1, G2, G3 and G4, the glass substrate G has almost half the length of the long side Ga of the substrate. Two long nozzles 52 are formed in which a plurality of resist discharge holes are not shown, and resists are supplied to the entire surface of the substrate G by one scan by the nozzles 52.

Also in this embodiment, the drying time can be the same in the regions G1 and G2 and in the regions G3 and G4. Moreover, by supplying a resist at the same time by these two long nozzles 52, the supply processing time of a resist can of course be shortened.

Although the long nozzles 51 and 52 were used in FIG. 13 and FIG. 14, when the length is equal to the length of one side in the board | substrate G, since the manufacturing precision of a nozzle may fall, there exists a limit to the length of a nozzle.

The present invention is not limited to the embodiment described above, but various modifications are possible.

For example, in the second embodiment, two nozzles are provided, but four or more nozzles may be provided so that the number of nozzles can be appropriately selected according to the size of the substrate.

In addition, in the first and second embodiments, the resist discharge amount is changed only when the nozzle moves outside the substrate. However, for example, the film thickness may be controlled by changing both ends on the substrate.

As described above, according to the present invention, in the resist coating process by the plurality of discharge hole nozzles, the uniformity of the resist film thickness can be ensured, and in particular, the film thickness can be made uniform at both ends of the substrate, and the resist liquid can be saved. have.

Claims (12)

Supplying the processing liquid to the first region on the substrate while moving the nozzle for discharging the processing liquid on the substrate; And a process of supplying a processing liquid while moving the nozzle on the substrate to a second region on the substrate which is in line symmetry with the first region. The method of claim 1, The supply of the processing liquid to the first region and the second region has a length shorter than about half the length of one side of the substrate, and at the nozzle having a plurality of discharge holes for discharging the processing liquid along the longitudinal direction. Process liquid supply method characterized in that made. The method of claim 2, The processing liquid is supplied to the first region and the second region while the nozzle is moved in parallel with one side of the substrate, and the processing liquid is supplied from both end sides of the substrate to the center side. Supply method. The method of claim 2, The processing liquid is supplied to the first region and the second region while the nozzle is moved in parallel with one side of the substrate, and the processing liquid is supplied from the center side of the substrate to both ends. Supply method. The method of claim 1, And a discharge amount of the processing liquid is reduced from the nozzle outside the substrate or the discharge is stopped. Supplying the processing liquid to the first region on the substrate while moving the nozzle for discharging the processing liquid on the substrate; Providing a processing liquid while moving the nozzle on the substrate to a second region on the substrate which is in line symmetry with the first region, The supply of the processing liquid to the first area and the second area has a length shorter than half of one side of the substrate, and a plurality of discharge holes for discharging the processing liquid along the length direction. A processing liquid supplying method characterized by simultaneously discharging processing liquid by a first nozzle and a second nozzle. A nozzle for discharging the processing liquid onto the substrate; A moving mechanism for moving the nozzle on the substrate; And a control unit which controls the nozzle to move the nozzle by the moving mechanism to supply the processing liquid to the first region on the substrate and to supply the processing liquid to the second region on the substrate which is in line with the first region. Treatment liquid supply apparatus. The method of claim 7, wherein And the nozzle has a length shorter than half the length of one side of the substrate, and has a plurality of discharge holes for discharging the processing liquid along the longitudinal direction. The method of claim 8, Supply of the processing liquid to the first region and the second region is performed while moving the nozzle in parallel to one side of the substrate, and further provided with means for controlling the processing liquid to be supplied from both ends of the substrate to the center side. Treatment fluid supply device, characterized in that The method of claim 8, Supply of the processing liquid is performed while moving the nozzle in parallel to one side of the substrate, further comprising a means for controlling the supply of the processing liquid from the center side of the substrate to both ends side; . The method of claim 7, wherein And a means for controlling to reduce the discharge amount of the processing liquid from the nozzle outside the substrate or to stop the discharge of the processing liquid. A first nozzle for supplying a processing liquid while moving on the substrate to a first region on the substrate; And a second nozzle for supplying a processing liquid while moving on the substrate to a second region on the substrate which is in line symmetry with the first region.

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