JP4372984B2 - Coating apparatus and coating method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a coating apparatus that coats a resist solution on a glass substrate used in, for example, a liquid crystal display (LCD).
[0002]
[Prior art]
In the LCD manufacturing process, the same photolithography technique as that used for manufacturing semiconductor devices is used to form an ITO (Indium Tin Oxide) thin film or electrode pattern on a glass substrate for LCD. In the photolithography technique, a photoresist is applied to a glass substrate, which is exposed and further developed.
[0003]
As a method for applying the resist solution, there is a method in which a resist solution supply nozzle is scanned from one end of the substrate to the other in the vertical and horizontal directions so that the resist solution is applied to the glass substrate in a thin line shape. In this coating method, the resist solution supply nozzle has a single discharge hole, and the resist solution supply nozzle has a plurality of discharge holes at regular intervals, and the resist is discharged simultaneously from the plurality of discharge holes. There is. According to the method using a plurality of discharge holes, the number of times of scanning on the glass substrate of the supply nozzle can be reduced as compared with the method of a single discharge hole, so that the tact time of the coating process can be shortened.
[0004]
However, even in the case of the nozzles of the plurality of discharge holes, since the coating is performed by scanning from end to end of the glass substrate, there is a time difference between the coating start side and the coating end side on the glass substrate. The drying time of the resist is different at both ends of the application start side and the application end side of the glass substrate. Therefore, in a state where the drying times of the resists at both ends of the substrate are different, for example, in the next step, a reduced-pressure drying process or the like is performed to prevent the occurrence of transfer traces, and the resist film thickness is uneven at both ends of the glass substrate. turn into.
[0005]
In addition, application with a nozzle with multiple discharge holes has a larger amount of resist discharge per unit time than with a nozzle with a single discharge hole, so when the nozzle scans around the periphery of the glass substrate, As a result, the resist was wasted.
[0006]
The present invention has been made in view of the above circumstances, and when applying by a nozzle having a plurality of discharge holes, the drying time of the resist solution is made symmetrical on the substrate to ensure the uniformity of the substrate resist film thickness. Objective.
[0007]
Another object of the present invention is to save the resist solution.
[0008]
To achieve the above object, the present invention comprises a holding unit for holding a substrate, and two processing liquid supply means for supplying a processing liquid to the surface of the substrate while moving in a vertical and horizontal direction with respect to the substrate. And the supply of the processing liquid to the substrate surface is performed by a plurality of movements of each of the processing liquid supply means in any one of the vertical and horizontal directions, and the movement of the two processing liquid supply means is Each of the processing liquid supply means moves so as to be symmetric with respect to the center line on each of the substrate surfaces divided into two by the center line of the substrate surface parallel to the one direction. The movement that becomes is to move simultaneously on both of the bisected substrate surfaces.
[0009]
The present invention comprises a step of holding a substrate in a holding portion, and a step of supplying a processing liquid to the surface of the substrate while moving two processing liquid supply means in the vertical and horizontal directions with respect to the substrate, The step of supplying the processing liquid to the substrate surface is performed by a plurality of movements of each of the processing liquid supply means in any one of the vertical and horizontal directions, and the movement of the two processing liquid supply means is performed in the one direction. One of the processing liquid supply means is moved to be symmetrical with respect to the center line, and is symmetrical with respect to each of the substrate surfaces divided into two by the center line of the substrate surface parallel to the direction. The movement is performed simultaneously on both of the bisected substrate surfaces.
[0010]
As a result, the treatment liquid is supplied to the substrate surface alternately and symmetrically on both sides of the substrate surface divided by the center line of the substrate surface, and the drying time of the treatment solution is symmetrical on the substrate. it is possible to, it is possible to ensure the uniformity of the film thickness.
[0011]
The present invention further includes means for changing the discharge amount of the processing liquid, so that when the processing liquid supply means moves outside the substrate, the discharge amount of the processing liquid is reduced or the discharge is stopped. As a result, wasteful discharge of the processing liquid can be suppressed and the processing liquid can be saved.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[0013]
FIG. 1 is a plan view showing a resist coating / development processing system for an LCD substrate to which the present invention is applied.
[0014]
This coating / development processing system includes a cassette station 1 on which a cassette C that accommodates a plurality of substrates G is placed, and a processing including a plurality of processing units for performing a series of processes including resist coating and development on the substrates G. And an interface unit 3 for transferring the substrate G between the exposure unit (not shown), and the cassette station 1 and the interface unit 3 are disposed at both ends of the processing unit 2, respectively. Yes.
[0015]
The cassette station 1 includes a transport mechanism 10 for transporting the LCD substrate between the cassette C and the processing unit 2. Then, the cassette C is loaded and unloaded at the cassette station 1. Further, the transport mechanism 10 includes a transport arm 11 that can move on a transport path 10 a provided along the cassette arrangement direction, and the transport arm 11 can transport the substrate G between the cassette C and the processing unit 2. Done.
[0016]
The processing section 2 is divided into a front stage section 2a, a middle stage section 2b, and a rear stage section 2c. Each of the processing sections 2 has transport paths 12, 13, and 14 at the center, and each processing unit is disposed on both sides of these transport paths. Yes. And between these, the relay parts 15 and 16 are provided.
[0017]
The front section 2a includes a main transport device 17 that can move along the transport path 12, and two cleaning devices (SCR) 21a and 21b are disposed on one side of the transport path 12, and the transport path On the other side of 12, an ultraviolet irradiation / cooling unit 25 in which an ultraviolet irradiation device (UV) and a cooling device (COL) are vertically stacked, and a heat processing unit in which two heat processing devices (HP) are vertically stacked 26, and a cooling unit 27 in which two cooling devices (COL) are stacked one above the other.
[0018]
Further, the middle stage portion 2b includes a main transfer device 18 that is movable along the transfer path 13, and a resist coating device (CT) 22 according to the present invention is disposed on one side of the transfer path 13, and this A vacuum drying device (VD) 40 is disposed adjacent to the resist coating device (CT) 22, and is further adjacent to the vacuum drying device (VD) 40 around the edge portion of the substrate G and the peripheral portion on the back side of the substrate G. An edge remover 23 (ER) for removing the attached and removed resist is disposed. On the other side of the conveyance path 13, a heat treatment unit 28 in which two heating devices (HP) are vertically stacked, and a heat treatment in which a heat treatment device (HP) and a cooling processing device (COL) are vertically stacked. A cooling unit 29 and an adhesion processing / cooling unit 30 in which an adhesion processing device (AD) and a cooling device (COL) for performing a hydrophobic treatment are vertically stacked are disposed.
[0019]
Further, the rear stage portion 2 c includes a main transport device 19 that can move along the transport path 14, and three development processing devices (DEV) 24 a, 24 b, and 24 c are disposed on one side of the transport path 14. On the other side of the conveyance path 14, a heat treatment unit 31 in which two heat treatment devices (HP) are stacked one above the other, and a heat treatment device (HP) and a cooling device (COL) are stacked one above the other. Two heat treatment / cooling units 32 and 33 are arranged.
[0020]
The main transport devices 17, 18, and 19 each include a two-direction X-axis drive mechanism, a Y-axis drive mechanism, and a vertical Z-axis drive mechanism in a horizontal plane, and further rotate around the Z-axis. A drive mechanism is provided, and arms 17a, 18a, 19a for supporting the substrate G are provided. These arms 17a, 18a and 19a enable the substrate G to be transferred to each processing unit.
[0021]
The processing unit 2 has only coating system units such as the cleaning processing devices 21a and 21b, the resist coating device (CT) 22, and the development processing devices 24a, 24b, and 24c on one side of the conveyance path. In this structure, only the heat treatment unit such as the heat treatment unit or the cooling treatment unit is arranged on the other side.
[0022]
In addition, a chemical solution supply device 34 is disposed in each of the relay units 15 and 16 on the coating system unit arrangement side, and a space 35 that can be maintained is provided.
[0023]
The interface unit 3 includes an extension 36 that temporarily holds a substrate when the substrate is transferred to and from the processing unit 2, two buffer stages 37 that are provided on both sides of the substrate and that are provided with buffer cassettes, and these And a transfer mechanism 38 that carries in and out the substrate G between the exposure apparatus (not shown). The transport mechanism 38 includes a transport arm 39 that can move on a transport path 38 a provided along the direction in which the extensions 36 and the buffer stage 37 are arranged. The transport arm 39 allows the substrate G to move between the processing unit 2 and the exposure apparatus. Is carried out.
[0024]
2 and 3 show a resist coating apparatus (CT) 22. As shown in these figures, a bottomed cylindrical frame 71a is disposed in the center of the resist coating apparatus (CT) 22, and a holding portion for fixing and holding the glass substrate G in the frame 71a. A substrate suction table 58 is arranged. In addition, an opening 71c for taking in and out the glass substrate G is provided on the upper portion of the frame 71a.
[0025]
A vacuum suction device 72 for holding the glass substrate G by vacuum suction is connected to the substrate suction table 58. The substrate suction table 58 can be moved up and down by a lifting cylinder 73 via a rod 75. The operation of the elevating cylinder 73 is controlled by the CPU 74. Specifically, the lower side of the rod 75 is disposed in a cylinder (not shown), and the rod 75 can move in the vertical direction by driving the lifting cylinder 73 via the vacuum seal portion 76 in the cylinder. ing.
[0026]
Conveying rails 66 and 66 are arranged on both sides of the frame 71 a, and the scanning mechanism 100 is provided between the conveying rails 66 and 66. The scanning mechanism 100 is spanned between the transport rails 66 and 66, and is attached to the first slider 67, which moves in the Y direction along the transport rails 66 and 66, and the first slider 67. And a second slider 43 to which a resist solution supply nozzle 46 as a processing solution supply means is fixed. The resist solution supply nozzle 46 is connected to a supply pipe 42 from a tank 50 that stores the resist solution, and a bellows pump 49 for discharging the resist solution is connected between the resist solution supply nozzle 46 and the tank 50. Yes. On the lower surface side of the resist liquid supply nozzle 46, for example, a plurality of discharge holes (not shown) are provided.
[0027]
In the vicinity of one running end of the transport rail 66, the first slider 67 is moved along the transport rail 66 and the second slider 43 is moved along the first slider 67 according to a command from the CPU 74. A drive unit 48 is provided. Further, the CPU 74 controls the operation amount of the bellows pump 49 according to the moving distance of the sliders 67 and 43, that is, the moving position of the resist solution supply nozzle 46 on the glass substrate G, thereby making the discharge amount of the resist solution variable. .
[0028]
The operation of the resist coating / development processing system configured as described above will be described.
[0029]
With reference to FIG. 1, the substrate G in the cassette C is transported to the processing unit 2 by the transport arm 11. In the processing unit 2, first, the surface modification / cleaning process is performed by the ultraviolet irradiation device (UV) of the ultraviolet irradiation / cooling unit 25 of the front-stage unit 2 a, and then cooled by the cooling device (COL) of the unit, After scrubber cleaning is performed by the cleaning units (SCR) 21a and 21b, and after being heated and dried by one of the heat treatment apparatuses (HP) disposed in the front stage 2a, any one of the cooling units (COL) of the cooling unit 27 Cooled by.
[0030]
Thereafter, the substrate G is transported to the middle stage 2b, where it is hydrophobized (HMDS process) by an upper-stage adhesion processing device (AD) of the unit 30 in order to improve the fixability of the resist, and the lower-stage cooling device (COL). Then, it is carried into a resist coating device (CT) 22 after cooling.
[0031]
In the resist coating device (CT) 22, first, the glass substrate G is transferred onto the substrate suction table 58 by the main transport device 18 in a state where the substrate suction table 58 is raised above the opening 71c of the frame 71a. It is mounted and held by vacuum suction. Next, the substrate suction table 58 is lowered by driving the lifting cylinder 73, and the glass substrate G passes through the opening 71c and is carried into the frame 71a.
[0032]
Subsequently, the drive unit 48 moves the first slider 67 in the Y direction along the transport rail 66 according to the command of the CPU 74 according to the size of the glass substrate G, and moves the second slider 43 to the first slider. 67 in the X direction. As a result, the coating liquid supply nozzle 46 fixed to the second slider moves to, for example, a predetermined discharge start point S1 located outside the corner of the one side G1 in the substrate G as shown in FIG. .
[0033]
Then, the coating solution supply nozzle 46 moves in the Y direction from the discharge start point S1 toward G3, which is the opposite side of the side G1, and discharges the first row of resists R as shown in FIG. 4B. Here, for ease of illustration, the resist R ejected from the coating liquid supply nozzle 46 is indicated by five solid lines. However, since 20 ejection holes are provided, for example, 20 resists are actually finer. It becomes the line. Subsequently, when moving to a predetermined position S2 outside the side G3, the resist discharge is stopped, and as shown in FIG. 5A, the X is moved from the position S2 to the predetermined position S3 outside the corner of the substrate G toward the side G4. Move in the direction. Then, the discharge is started again from the position S3, and as shown in FIG. 5B, the second row of the resist R2 is discharged while moving in the Y direction from the position S3 toward the side G1. When reaching a predetermined position S4 outside the corner, the discharge is stopped here, and then, from this position S4, the nozzle 46 is moved in the X direction from the discharge start point S1 to a position S5 from the side G4 by the width of the nozzle 46. Then, the resist R3 in the third row is discharged while moving in the Y direction from the position S5 toward the side G3 again. The above operation is repeated, that is, the resist is supplied from the both ends of the substrate G to the central portion, and the resist is applied to the entire surface of the glass substrate G.
[0034]
FIG. 6 schematically shows a locus on the substrate G of the nozzle 46 described above. In this way, the application order is from the discharge start points S1 to S2 (first column), S2 to S3, S3 to S4 (second column),..., Sn-1 to the discharge end point Sn (nth column), Since the coating is performed from the both ends G2 and G4 of the substrate G toward the central portion, the drying times of the coating rows of the both ends G2 and G4 are substantially the same. Furthermore the drying time of the coating column in FIG, since a symmetrical around the coating column in the substrate center line M shown in broken lines, will receive treatment for the next step while the dry state, the film Thickness uniformity can be ensured. Furthermore, since the discharge of the resist solution is stopped when the nozzle 46 moves outside the substrate G, it is possible to save the resist.
[0035]
Conventionally, depending on the type of resist, the viscosity of the resist solution is low, the film thickness decreases from the central row of the substrate G toward both ends G2 and G4, and the resist solution droops outward from both ends G2 and G4. Although a phenomenon may occur, according to the present embodiment, the drying time becomes longer from the center row of the substrate G toward both ends, so that the resist solution solidifies toward both ends, and the resist solution from both ends. There is no risk of dripping.
[0036]
Further, the discharge end point Sn of the substrate center row shown in FIG. 6 may be applied as the discharge start point S1 as shown in FIG. 7 in the reverse order of the application order of the above embodiment. That is, the resist is discharged while moving in the Y direction from the predetermined discharge start point S1 outside the substrate in the center row toward the side G3. When the resist is moved to the predetermined position S2 outside the side G3, the resist discharge is stopped. The nozzle 46 moves from the position S2 toward the side G2 in the X direction by the width of the nozzle 46, and then discharges while moving in the Y direction from the position S3 toward the side G1 to the position S4 outside the side G1. To go. Then, the discharge is stopped from S4, the ink is moved to the position S5 corresponding to twice the width of the nozzle 46 in the X direction, and discharged while moving in the Y direction again. Thereby, similarly to the coating sequence shown in FIG. 6, the drying times of the coating rows at both ends G2 and G4 become substantially the same, and the film thickness can be made uniform. In particular, depending on the type of resist, the viscosity of the resist solution is high and the phenomenon that the resist swells at both ends due to surface tension may occur. According to the present embodiment, both ends from the central row of the substrate G Since the drying time becomes shorter toward G2 and G4, there is no possibility that the resist will rise at both ends, and the uniformity of the film thickness can be ensured. Also in this embodiment, since the discharge of the resist solution is stopped when the nozzle 46 moves outside the substrate G, it is possible to save the resist by eliminating unnecessary resist supply.
[0037]
After the processing liquid is applied by the resist coating apparatus (CT) 22, the rod 75 is raised, the vacuum suction of the glass substrate G is released, and between the resist coating apparatus (CT) 22 and the edge remover (ER) 23. Then, the substrate G is transferred to a vacuum drying apparatus (VD) 40, which is the next process, and dried by an arm (not shown) that delivers the substrate G. Subsequently, the edge remover (ER) removes the resist adhering to the edge portion of the substrate G and the peripheral portion on the back side of the substrate G.
[0038]
Thereafter, the glass substrate G is pre-baked by one of the heat treatment apparatuses (HP) arranged in the middle stage portion 2b, cooled by the lower cooling apparatus (COL) of the unit 29 or 30, and is transferred from the relay section 16 to the main transport. The device 19 is transported to an exposure device (not shown) via the interface unit 3, and a predetermined pattern is exposed there. Then, the substrate G is again carried in through the interface unit 3, and if necessary post-exposure bake processing is performed by any one of the heat processing apparatuses (HP) of the rear stage unit 2c, and then a development processing unit (DEV) 24a. , 24b, and 24c.
[0039]
After the development processing is performed in any one of the development processing units (DEV) 24a, 24b, and 24c, the processed substrate G is subjected to post-baking processing in any one of the heat treatment apparatuses (HP) in the rear stage 2c. After that, it is cooled by a cooling device (COL) and is stored in a predetermined cassette on the cassette station 1 by the main transfer devices 19, 18, 17 and the transfer mechanism 10.
[0040]
FIG. 8 shows the resist coating apparatus of the second embodiment. The resist coating apparatus (CT) 41 is different from the constituent elements of the resist coating apparatus (CT) 22 of the first embodiment in that a plurality of ejections are performed. Two coating liquid supply nozzles 46 having holes are provided. The one coating liquid supply nozzle 46 a and the other coating liquid supply nozzle 46 b are respectively fixed to the second one slider 43 a and the second other slider 43 b that move in the X direction along the first slider 67. ing. One coating liquid supply nozzle 46a and the other coating liquid supply nozzle 46b are connected to a resist solution supply pipe 42, respectively. Since the other components are the same, the same reference numerals are given and the description thereof is omitted.
[0041]
In the resist coating device (CT) 41, the drive unit 48 first moves the first slider 67 in the Y direction along the transport rail 66, and the second one and the other sliders 43a and 43b It moves in the X direction along one slider 67. Accordingly, one coating liquid supply nozzle 46a fixed to the second one slider 43a is, for example, a predetermined position located outside one corner of one side G1 of the substrate G as shown in FIG. And the other application liquid supply nozzle 46b fixed to the second other slider 43b is located outside the other corner of the one side G1 of the substrate G and starts a predetermined discharge. Move to point S1b. Then, the one nozzle 46a and the other nozzle 46b respectively supply the first row of resist while simultaneously moving in the Y direction, and as shown in FIG. 9B, the predetermined positions S2a and the outer side of the side G3, When reaching S2b, the resist discharge amount is reduced under the control of the CPU 74, respectively. While maintaining the discharge amount, one nozzle 46a moves to the left in the X direction to S3a, and the other nozzle 46b also moves to the right in the X direction to S3b, respectively from S3a and S3b. The discharge amount is made the same as that in the first row again, and the resist in the second row is discharged while moving in the Y direction at the same time. Then, when reaching the outer sides S4a and S4b of the side G1, respectively, the discharge amount of the resist is reduced similarly to S2a to S3a and S2b to S3b, and the discharge amount from S5a and S5b is made the same as the first row and the second row, respectively. And move in the Y direction. By repeating this operation, resist coating is performed on the entire surface from the first column at both ends of the substrate G to the nth column of the center column.
[0042]
According to the second embodiment, since the coating is sequentially performed from the first row at both ends of the substrate G to the n-th row of the central row, the same effect as that of the first embodiment can be obtained, and the two nozzles 46a And 46b are applied simultaneously from both ends of the substrate G, so that the drying times at both ends of the substrate G are more accurately matched. Therefore, the uniformity of the film thickness is further improved and more than that of the first embodiment. Tact can be shortened.
[0043]
Further, since the discharge amount of the resist solution is reduced outside the substrate G, such as between S2a and S3a and between S4a and S5a, it is possible to save the resist solution. In addition, instead of reducing the discharge amount outside the substrate G, the discharge may be stopped as in the first embodiment.
[0044]
FIG. 10 is a diagram showing the application order reversed in the second embodiment. That is, the two nozzles 46a and 46b are discharged from the discharge start points S1a and S1b at a predetermined central portion, and are applied to the entire surface from the first row at the central portion of the substrate G to the nth row at both ends of the substrate G. In FIG. 11, two nozzles 46a and 46b respectively discharge from the discharge start points S1a and S1b at the outer ends of the side G1 to the outer end positions S2a and S2b of the side G3, respectively, and from the positions S2a and S2b, respectively, to the center of the substrate. It moves to position S3a and S3b of a row | line | column, and it discharges simultaneously to the position S4a and S4b outside the edge | side G1 from here, and repeats this, and it discharges, moving simultaneously to the predetermined discharge end point.
[0045]
The drying time of the resist applied to both ends of the substrate G is the same according to the application sequence shown in FIGS. 10 and 11, and the next process can be performed in this dry state, so that the film thickness can be made uniform. As in the first embodiment, this is effective particularly when precise control of the film thickness at both ends of the substrate G is required. Also in the above case, the discharge amount of resist is reduced or the discharge is stopped between S2a to S3a outside the substrate G. This can save the resist.
[0046]
12A and 12B show a coating method according to the third embodiment. In this embodiment, as shown in FIG. 12A, only one half of the width of the nozzle 46 is shown by one coating liquid supply nozzle 46 from the discharge start point S1 (FIG. 4A) in the first embodiment. It moves while discharging the resist from the position S1 ′ shifted in the middle right direction to the position S2 in the Y direction (first row), and then in the figure by half the width of the nozzle 46 from the position S3 in the first embodiment. It moves to the position S3 ′ shifted to the left, and discharges while moving in the Y direction (second row) from the position S3 to the position S4. Then, the position moves from the position S4 to a position S5 ′ corresponding to the discharge start point S1 in the first embodiment, and the resist in the first row is overcoated by half the width of the nozzle 46, and moved in the Y direction. Go (third column). Subsequently, in the second row as well, overprinting is performed in the Y direction toward the side G1, and the overcoating operation of only half the width is repeated to move from both ends of the substrate G toward the center row. Apply in order. In this case as well, the discharge amount is reduced or stopped when moving outside the substrate G, such as between S2 ′ and S3 ′.
[0047]
According to this embodiment, there is no possibility that a portion that is not applied between the applied resists in each row is generated, and the film can be applied with a uniform film thickness . In the present embodiment, the overcoating of the first row and the third row and the overcoating of the second row and the fourth row are not performed, and the nozzle width is equal to that in the first and second embodiments. Application may be performed, and the other columns may be overcoated. Thereby, the film thickness of the both ends G2 and G4 of a board | substrate can be made smaller than the film thickness of another site | part, and the rise of the film thickness of both ends can be suppressed. Therefore, the uniformity of the film thickness can be ensured. In this case, the coating amount at both ends (the coating amount in the first row and the second row) may be adjusted.
[0048]
The present invention is not limited to the embodiment described above.
[0049]
For example, in the second embodiment, two coating liquid supply nozzles are provided. However, the number of nozzles can be appropriately selected according to the size of the substrate by using four or more nozzles. May be.
[0050]
In the first and second embodiments, the resist discharge amount is changed only when the nozzle moves outside the substrate. For example, the film thickness is controlled so as to be changed at both ends of the substrate. You may make it perform.
[0051]
As described above, according to the present invention, in the resist coating process using the nozzles having a plurality of ejection holes, the uniformity of the resist film thickness is ensured, in particular, the film thickness is uniform at both ends of the substrate, and the resist solution is saved. Can be achieved.
[Brief description of the drawings]
FIG. 1 is a plan view showing an LCD substrate coating / development processing system to which the present invention is applied.
FIG. 2 is a schematic plan view of a resist coating apparatus (CT) according to the first embodiment of the present invention.
3 is a partial cross-sectional view showing a schematic configuration of a resist coating apparatus (CT) shown in FIG. 2;
FIG. 4 is a plan view for explaining a resist application sequence according to the first embodiment of the present invention;
FIG. 5 is a plan view for explaining the application order.
FIG. 6 is a plan view for explaining the application order.
FIG. 7 is a plan view for explaining the coating sequence, showing coating from both ends of the substrate to the center.
FIG. 8 is a schematic plan view of a resist coating apparatus (CT) according to a second embodiment of the present invention.
FIG. 9 is a diagram for explaining a coating sequence of resists according to a second embodiment of the present invention, and is a plan view showing coating from both ends of a substrate to a central portion.
FIG. 10 is a diagram for explaining the application sequence, and is a plan view showing application from the center of the substrate to both ends.
FIG. 11 is a plan view for explaining the application order.
FIG. 12 is a plan view illustrating overcoating for explaining a resist coating method according to a third embodiment of the present invention.
[Explanation of symbols]
G ... Glass substrates G1 to G4 ... Side 22 ... Resist coating device 41 ... Resist coating device 46 ... Coating solution supply nozzle 46a ... One coating solution supply nozzle 46b ... The other coating solution supply nozzle 58 ... Substrate adsorption table 74 ... CPU
76 ... Vacuum seal part

Claims (6)

A holding unit for holding the substrate;
Two processing liquid supply means for supplying a processing liquid to the surface of the substrate while moving in the vertical and horizontal directions with respect to the substrate;
Comprising
The supply of the processing liquid to the substrate surface is performed by a plurality of movements of each of the processing liquid supply means in any one of the vertical and horizontal directions,
The two processing liquid supply means are moved by one processing liquid supply means for each of the substrate surfaces divided into two by the center line of the substrate surface parallel to the one direction. Move to be symmetrical with each other,
The symmetric movement is performed simultaneously on both of the bisected substrate surfaces. The coating apparatus according to claim 1 ,
The coating apparatus further comprising means for varying the discharge amount of the processing liquid. The coating apparatus according to claim 1 or 2 ,
The coating apparatus, wherein the processing liquid supply means has a plurality of holes for discharging the processing liquid. A step of holding the substrate in the holding unit;
Supplying the processing liquid to the surface of the substrate while moving the two processing liquid supply means in the vertical and horizontal directions with respect to the substrate;
Comprising
The step of supplying the processing liquid to the substrate surface is performed by a plurality of movements of each of the processing liquid supply means in any one of the vertical and horizontal directions,
The two processing liquid supply means are moved by one processing liquid supply means for each of the substrate surfaces divided into two by the center line of the substrate surface parallel to the one direction. Moved so that they are symmetrical with each other,
The symmetric movement is performed simultaneously on both of the two divided substrate surfaces. It is the application | coating method of Claim 4 , Comprising:
The coating method further comprising a step of changing a discharge amount of the treatment liquid. The coating method according to claim 4 or 5 , wherein
The coating method, wherein the processing liquid supply means has a plurality of holes for discharging the processing liquid, and discharges the processing liquid simultaneously from the plurality of holes.

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