KR20120132241A - In-line type heat treatment apparatus and method for transporting substrate of the same - Google Patents

Abstract

PURPOSE: An inline type thermal processing device and a substrate transferring method thereof are provided to improve the reliability and productivity of a product and minimize damage to a substrate due to particles. CONSTITUTION: A loading unit(100) includes a furnace(110). A heater(213) is independently installed in the furnace and heats a substrate(50). A transfer unit transfers the substrate to a furnace(210) of a temperature raising unit(200). The temperature raising unit heats the substrate and transfers the substrate to a processing unit(300). A cooling unit(400) cools the substrate transferred from the processing unit at a preset temperature. An unloading unit(500) is equal or similar to the loading unit.

Description

In-line heat treatment device and substrate transfer method {IN-LINE TYPE HEAT TREATMENT APPARATUS AND METHOD FOR TRANSPORTING SUBSTRATE OF THE SAME}

The present invention relates to an in-line heat treatment apparatus for lifting a substrate fed into a furnace and transferring the substrate.

The annealing apparatus used in the manufacture of a flat panel display is a heat treatment apparatus that crystallizes or phase changes a deposited film to improve the properties of the film deposited on a substrate.

A thin film transistor, which is a semiconductor layer used in a flat panel display device, deposits amorphous silicon on a substrate such as glass or quartz using a deposition apparatus, dehydrogenates the amorphous silicon layer, and then forms arsenic for forming a channel. ), Dopants such as phosphorus (Phosphorus) or boron (Boron). Then, a crystallization process is performed to crystallize the amorphous silicon layer having a low electron mobility into a polycrystalline silicon layer having a crystalline structure having a high electron mobility.

In order to crystallize an amorphous silicon layer into a polycrystalline silicon layer, there is a common feature that an energy of heat must be applied to the amorphous silicon layer.

A general method of applying heat to the amorphous silicon layer is to put a substrate in the furnace (Furnace), and heat the amorphous silicon layer by a heating means such as a heater installed in the furnace.

The conventional heat treatment apparatus performs a heat treatment process for heating and cooling a substrate using one heating furnace. However, the conventional heat treatment apparatus using a single heating furnace has a disadvantage in that the productivity takes a long time to manufacture the substrate as a product.

In order to solve the above disadvantages, in-line heat treatment apparatuses for continuously arranging a plurality of heating furnaces and transferring the substrates sequentially to the respective heating furnaces to heat-treat the substrates have been developed and used.

Conventional in-line heat treatment apparatus transfers a board | substrate using the roller rotatably installed. In detail, a plurality of rollers are rotatably provided in each heating furnace, and a substrate is mounted on the rollers. Thus, when the roller rotates, the substrate is transferred.

In the conventional in-line heat treatment apparatus as described above, particles are generated by scratching the roller and the substrate by the frictional force acting between the roller and the substrate in contact with each other. Then, the particles are attached to the substrate may damage the substrate, there was a disadvantage that the reliability of the product is lowered.

In addition, since the wear rate of each of the plurality of rollers provided in each heating furnace is different from each other, when the rollers are used for a long time, the respective rollers have a deviation in diameter. Then, a deviation occurs in the conveying speed at which each of the rollers conveys the substrate, and the substrate is twisted and conveyed on the conveying path. Then, in the heat treatment process, there is a disadvantage that the productivity is lowered, such as an error occurs.

The present invention has been made to solve the problems of the prior art as described above, the object of the present invention is to lift the substrate so that the particles (particle) does not occur, by in-line heat treatment that can improve the reliability and productivity of the product An apparatus and a substrate transfer method are provided.

In-line heat treatment apparatus according to the present invention for achieving the above object, a plurality of heating furnaces (Furnace) which are continuously disposed and each provides a space for heat treatment of the substrate; A plurality of heaters each independently installed in each of the heating furnaces to heat the substrate; And transfer means installed in each of the heating furnaces and mounted and supported by the loaded substrate, and lifting the mounted substrates and transferring them to other adjacent heating furnaces.

In addition, the substrate transfer method of the in-line heat treatment apparatus according to the present invention for achieving the above object, a plurality of heating furnaces (Furnace), each of which is continuously arranged and provides a space for heat treatment of the substrate, inside each of the heating furnaces A substrate transfer method of an in-line heat treatment apparatus, comprising: a heater installed to heat the substrate, and a transfer unit installed in each of the heating furnaces to support the substrate and to transfer the input substrate to another adjacent heating furnace. The transfer means lifts the substrate and transfers it to another adjacent heating furnace.

In the in-line heat treatment apparatus and substrate transfer method thereof according to the present invention, the substrate is lifted and transferred by a transfer means for transferring the substrate. Therefore, there is no friction between the substrate and the components for transporting the substrate, so that particles are prevented from being generated by the friction. Therefore, since there is no damage of the substrate by the particles, there is an effect that the reliability of the product is improved.

In addition, since the parts for transferring the substrate are not worn by friction, the substrate can be transferred accurately. Therefore, an error does not occur during the heat treatment process of the substrate, thereby improving the productivity.

1 is a front view showing a schematic configuration of an inline heat treatment apparatus according to an embodiment of the present invention.
FIG. 2 is an enlarged view of a heating furnace of the temperature increasing unit shown in FIG. 1.
Figure 3 is a side view of Figure 2;
4 is a perspective view of the conveying means shown in FIGS. 2 and 3.
5 to 13 is a perspective view showing the operation of the conveying means shown in FIG.

DETAILED DESCRIPTION OF THE INVENTION The following detailed description of the invention refers to the accompanying drawings that illustrate specific embodiments in which the invention may be practiced. These embodiments are described in sufficient detail to enable those skilled in the art to practice the invention. It should be understood that the various embodiments of the present invention are mutually exclusive, but need not be mutually exclusive. For example, certain shapes, structures, and specific features described herein may be embodied in other embodiments without departing from the spirit and scope of the invention in connection with one embodiment. It is also to be understood that the position or arrangement of the individual components within each disclosed embodiment may be varied without departing from the spirit and scope of the invention. The following detailed description, therefore, is not to be taken in a limiting sense, and the scope of the present invention is defined only by the appended claims, along with the full scope of equivalents to which such claims are entitled. The length, area, thickness, and shape of the embodiments shown in the drawings may be exaggerated for convenience.

Hereinafter, an inline heat treatment apparatus and a substrate transfer method thereof according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

1 is a front view showing a schematic configuration of an inline heat treatment apparatus according to an embodiment of the present invention.

As shown, the in-line heat treatment apparatus according to the present embodiment includes a loading part 100, a temperature rising part 200, a process part 300, a cooling part 400 and an unloading part 500, the loading part The 100, the temperature increasing part 200, the processing part 300, the cooling part 400, and the unloading part 500 are sequentially arranged in sequence.

Loading unit 100 includes a furnace (Furnace) 110, the transport to support the substrate 50 inside the furnace 110 to transfer to the heating furnace 210 of the adjacent heating unit 200 Have the means.

The substrate 50 is mounted and supported by the transfer means. That is, the substrate 50 is supported by a robot arm (not shown), loaded into the loading unit 100, and mounted on the transfer means. A support plate (not shown) may be interposed between the substrate 50 and the transfer means. In the case of using the support plate, the support plate may be mounted on the support plate while the support plate is mounted on the transport means, or the support plate may be mounted on the transport means while the substrate 50 is mounted on the support plate. Can be. The transfer means will be described later.

The substrate 50 may be uniformly preheated at, for example, about 150 ° C. in the loading part 100, and then transferred to the temperature raising part 200. To this end, a heater (not shown) may be installed in the heating furnace 110.

The temperature rising unit 200 will be described with reference to FIGS. 1 to 3. FIG. 2 is an enlarged view of a heating furnace of the temperature increasing unit shown in FIG. 1, and FIG. 3 is a side view of FIG. 2.

As shown in the drawing, the temperature raising part 200 heats the substrate 50 to a predetermined temperature and transfers it to the process part 300. The temperature raising part 200 includes at least two heating furnaces 210, 250, and 270 which are independently temperature controlled. The number of heating furnaces 210, 250, and 270 of the temperature raising part 200 is appropriately provided in consideration of the heat treatment temperature of the substrate 50.

For example, when the heat processing temperature of the board | substrate 50 is about 600 degreeC, three heating furnaces 210, 250, 270 of the temperature raising part 200 are provided. Thus, the temperature of the first furnace 210 is maintained around 150 ℃ in consideration of the preheating temperature of the loading unit 100, the temperature of the second furnace 250 and the third furnace 270 is 450 ℃, respectively. It is preferable to be maintained at around and around 600 ° C.

The substrate 50 may be deformed even when the heating temperature is rapidly increased at low temperatures, but may be deformed when the heating temperature is rapidly increased at high temperatures. Therefore, it is preferable to set the heating furnaces 210, 250, and 270 of the temperature raising part 200 so that the heating temperature is quickly increased at low temperature, and the heating temperature is gradually increased at high temperature.

Inside the first heating furnace 210 of the temperature rising unit 200 is provided with a transfer means for transferring the substrate 50 and a plurality of heaters 213 independently installed to heat the substrate 50.

The transfer means of the in-line heat treatment apparatus according to the present embodiment lifts the substrate 50 while supporting the mounted substrate 50 and transfers the substrate 50 to the adjacent second heating furnace 250. Then, since no friction force is generated between the transfer means and the substrate 50, particles are not generated due to wear of the transfer means or the substrate 50.

The transfer means will be described with reference to FIGS. 2 to 4. 4 is a perspective view of the conveying means shown in FIGS. 2 and 3.

As shown, the transfer means has a transfer plate 220 and the support member 230.

The transfer plate 220 is installed to be capable of lifting and lowering vertically with respect to the transfer direction of the substrate 50 and to move forward or backward in parallel with the transfer direction of the substrate 50. The support member 230 is provided in plural, the lower end is coupled to the transfer plate 220 at a predetermined interval, and the substrate 50 is supported at the upper end. The support member 230 moves together with the transfer plate 220.

In more detail, the transfer plate 220 may have a first transfer plate 221 adjacent to each other and a plurality of first transfer plates 221 disposed parallel to the transfer direction of the substrate 50 with a distance therebetween. The plurality of second transfer plates 225 are disposed between the first transfer plates 221 in parallel with the transfer direction of the substrate 50.

The first transfer plate 221 transfers the substrate 50 while rising → moving forward → lowering → moving backward, and the second transfer plate 225 also transfers the substrate 50 while rising → moving forward → lowering → moving backward. At this time, the first transfer plate 221 and the second transfer plate 225 are moved independently. The plurality of first transfer plates 221 move in the same manner, and the plurality of second transfer plates 225 move in the same manner. To this end, the plurality of first transfer plate 221 is integrally connected to each other by the connecting member 222, the plurality of second transfer plate 225 is integrally connected by the connecting member 226.

The support member 230 has a plurality of first support members 231 installed on the first transfer plate 221 and a plurality of second support members 235 respectively installed on the second transfer plate 225. In addition, the first and second support members 231 and 235 may include a pair of first and second vertical bars 231a and 235a having lower ends coupled to the first and second transfer plates 221 and 225, respectively. Each of the first and second vertical bars 231a and 235a is integrally formed with the first and second horizontal bars 231b and 235b on which the substrate 50 is mounted and supported.

Since the substrate 50 is in contact with the first and second horizontal bars 231b and 235b, the surfaces of the first and second horizontal bars 231b and 235b in contact with the substrate 50 may be rounded. . Then, scratches are prevented from occurring on the substrate 50 by the first and second horizontal bars 231b and 235b.

The heaters 213 are formed in a tube shape and are disposed in a shape that intersects the transfer direction of the substrate 50 while having a mutual distance therebetween, and are independently controlled.

In addition, the first and second support members 231 and 235 are positioned between the heater 213 and the heater 213 adjacent to each other, and move forward or at a distance between the heater 213 and the heater 213 adjacent to each other. To exercise backwards.

Reference numerals 241, 243, 245 and 247 shown in FIGS. 2 to 3 are cylinders. The cylinders 241 and 243 move up and down the first and second transfer plates 221 and 225 respectively, and the cylinders 245 and 247 move the first and second transfer plates 221 and 225 forward or backward, respectively. Let's do it. In this case, the lower surfaces of the cylinders 241 and 243 are in contact with and supported by the lower surface of the heating furnace 210 to move forward or backward with the first and second transfer plates 221 and 225, respectively. Lifting the 221, 225, respectively, and the lower surface of the cylinder (245, 247) is supported in contact with the side of the heating furnace 210, and the first and the first while the lifting motion with the first and first transfer plate (221, 225), respectively 2 The transfer plates 221 and 225 are moved forward or backward, respectively.

The movement of the first and second transfer plates 221 and 225 may be implemented in various forms using a belt, a chain, or a crank for transmitting power of the motor and the motor.

An operation of the transfer plate 220 and the support member 230, which are the transfer means according to the present embodiment, will be described with reference to FIGS. 4 and 5 to 13. 5 to 13 are perspective views showing the operation of the conveying means shown in FIG.

As shown in FIG. 4, the first and second transfer plates 221 and 225 are positioned at the same position, and the substrate 50 is mounted and supported on the first and second support members 231 and 235. Assume the original state.

In the state shown in FIG. 4, when the substrate 50 is to be transferred, the first transfer plate 221 is raised by operating the cylinder 241 (see FIGS. 2 and 3). Then, as shown in FIG. 5, since the first support member 231 is raised by the first transfer plate 221, the substrate 50 supported by the first support member 231 also rises.

Then, when the first conveying plate 221 is moved by operating the cylinder 245 (see FIG. 2), as shown in FIG. 6, the substrate 50 is also advanced and conveyed in the right direction. At this time, it is natural that the first transfer plate 221 advances a distance shorter than an interval between the heater 213 (see FIG. 2) and the heater 213 adjacent to each other.

In the state shown in FIG. 6, when the cylinder 241 is operated to lower the first transfer plate 221 to the bottom dead center, as shown in FIG. 7, the substrate 50 is attached to the first support member 231. In the supported state, the second support member 235 is mounted and supported at the same time. When the substrate 50 is mounted on the second support member 235, the cylinder 243 (see FIG. 2) is operated to raise the second transfer plate 225 as shown in FIG. 8.

At this time, when the second transfer plate 225 is slightly raised and the substrate 50 is supported only by the second support member 235, as shown in FIG. 8, the cylinder 245 is operated to operate the first transfer plate. Reverse 221. Then, the second transfer plate 225 is raised to the top dead center. Then, the state shown in FIG. 9 is obtained.

As shown in FIG. 7, the reason why the second transfer plate 225 is first lifted in the state where the substrate 50 is simultaneously supported by the first and second support members 231 and 235 is because of the substrate 50 and the substrate 50. This is to prevent friction between the first support member 231, the substrate 50, and the second support member 235. That is, when the first transfer plate 221 retreats while the substrate 50 is simultaneously supported by the first and second support members 231 and 235, between the substrate 50 and the first support member 231, and A friction force is generated between the substrate 50 and the second support member 235. In order to prevent this, the second transfer plate 225 is first raised, and then the first transfer plate 221 is reversed.

In the state shown in FIG. 9, when the cylinder 247 (see FIG. 2) is operated to advance the second transfer plate 225, as shown in FIG. 10, the substrate 50 is also advanced to be transferred in the right direction. do. At this time, it is natural that the second transfer plate 225 advances a distance shorter than an interval between the heater 213 and the heater 213 adjacent to each other.

In the state shown in FIG. 10, when the cylinder 243 is operated to lower the second transfer plate 225 to the bottom dead center, as shown in FIG. 11, the substrate 50 is attached to the second support member 235. It is mounted and supported at the same time on the first support member 231 in a supported state. When the substrate 50 is mounted on the first support member 231, the cylinder 241 is operated to raise the first transfer plate 221 as shown in FIG. 12.

As the first transfer plate 221 rises slightly and the substrate 50 is supported only by the first support member 231 as shown in FIG. 12, the cylinder 247 is operated to operate the second transfer plate 225. Back). Then, the first transfer plate 221 is raised to the top dead center. Then, the state shown in FIG. 13 is obtained. FIG. 13 is the same state as FIG. 5.

As shown in FIG. 12, the reason why the first transfer plate 221 is first lifted while the substrate 50 is simultaneously supported by the first and second support members 231 and 235 is as described above. This is to prevent friction between the substrate 50, the first support member 231, and the substrate 50 and the second support member 235.

In the state shown in FIG. 13, when the cylinder 241 is operated to advance the first transfer plate 221, as shown in FIG. 6, the substrate 50 is also advanced and transferred in the right direction.

As described above, the substrate 50 is transferred because the first transfer plate 221 and the second transfer plate 225 are continuously moved in an alternating manner.

The lower surface is supported by the lower surface of the heating furnace 210, and the cylinders 241 and 243 for lifting the first and second transfer plates 221 and 225, respectively, are also advanced along with the first and second transfer plates 221 and 225. And the reversal of course, the lower surface is supported on the side of the heating furnace 210, the cylinder (245, 247) for advancing and retracting the first and second transfer plate (221, 225) also the first and second transfer plate It is natural to ascend with (221, 225).

The inline heat treatment apparatus and the substrate transfer method according to the present embodiment have no friction between the substrate 50 and the components for transferring the substrate 50, so that particles are not generated and the substrate 50 is transferred. The parts are prevented from wearing out.

The configuration of the first heating furnace 210 and the configuration of the second and third heating furnaces 250 and 270 of the heating unit 200 shown in FIG. 1 are the same or similar. In addition, the heater 213 and the transfer means installed in the first heating furnace 210 of the heating unit 200 may be installed in the loading unit 100.

As shown in FIG. 1, the process unit 300 includes a heating furnace 310, and heat-processes the substrate 50 transferred from the temperature raising unit 200 at a predetermined heat treatment temperature. The configuration of the heating furnace 310 of the process unit 300 is also the same as or similar to the configuration of the heating furnace 210 of the temperature raising unit 200.

The cooling unit 400 cools the substrate 50 transferred from the processing unit 300 to a predetermined temperature and then transfers the unloading unit 500. The cooling unit 400 includes at least two heating furnaces 410 and 430 that are independently controlled in temperature, and the number of the heating furnaces 410 and 430 of the cooling unit 400 determines the heat treatment temperature of the substrate 50. In consideration, the appropriate number is prepared. The configuration of the heating furnaces 410 and 430 of the cooling unit 400 is also the same as or similar to the configuration of the heating furnace 210 of the temperature raising unit 200. At this time, the cooling unit 400 may be provided with various cooling means for uniformly cooling the substrate 50.

The unloading unit 500 includes a heating furnace 510 and is configured to be the same as or similar to the loading unit 100. The substrate 50 transferred to the unloading unit 500 is uniformly cooled to, for example, 100 ° C. or less so as not to be deformed, and then transferred to the next step. In this case, the unloading unit 500 may be provided with a heater (not shown) capable of heating the upper surface of the substrate 50 to uniformly cool the substrate 50. The substrate 50 transferred to the unloading part 500 is discharged to the outside by the robot arm or the like.

In-line heat treatment apparatus and substrate transfer method according to the present embodiment, the heating furnace (110, 210) (210, 250) (250, 270) (270, 310) (310, 410) (410, 430) adjacent to each other When the substrate is transferred between 430 and 510, adjacent heating furnaces 110 and 210 (210 and 250) 250 and 270 and 270 and 310 are 310 and 410 and 410 and 430 and 430. The first transfer plates respectively installed at 510 move equally, and the second transfer plates move identically.

The drawings of the embodiments of the present invention described above are schematically illustrated so as to easily understand the parts belonging to the technical idea of the present invention by omitting detailed outline lines. It should be noted that the above-described embodiments are not intended to limit the technical spirit of the present invention and are merely a reference for understanding the technical scope of the present invention.

100: loading unit
200: heating unit
210: heating furnace
213: heater
220: transfer plate
221, 225: first and second transfer plates
230: support member
231 and 235: first and second support members
300: process unit
400: cooling unit
500: unloading part

Claims (18)

A plurality of heating furnaces (Furnace) disposed continuously and each providing a space in which the substrate is heat treated;
A plurality of heaters each independently installed in each of the heating furnaces to heat the substrate; And
And a conveying means installed in each of the heating furnaces and mounted and supported by the loaded substrate, and lifting the mounted substrates and transferring them to other adjacent heating furnaces. The method of claim 1,
The transfer means,
A conveying plate which is capable of lifting and lowering perpendicular to the conveying direction of the substrate and capable of moving forward or backward in parallel with the conveying direction of the substrate; And
One side is coupled to the transfer plate and the other side is the substrate is supported, inline heat treatment apparatus comprising a plurality of support members to move with the transfer plate. The method of claim 2,
The conveying plates are arranged with a mutual gap therebetween and are equally raised → forwarded → lowered → a plurality of first conveying plates that are reversed, and are disposed between the first conveying plate and the first conveying plate adjacent to each other and are raised equally → With a plurality of second conveying plates to move forward → lower → reverse,
The first transfer plate and the second transfer plate moves independently,
And the supporting member has a plurality of first supporting members respectively provided on the first conveying plate and a plurality of second supporting members respectively provided on the second conveying plate. The method of claim 3,
The first support member has a pair of first vertical bars having one end coupled to the first transfer plate and a first horizontal bar integrally formed at the other end of the first vertical bar, and supporting the substrate.
The second supporting member has a pair of second vertical bars coupled to the second transfer plate at one end thereof and integrally formed at the other end of the second vertical bar, and has a second horizontal bar supporting the substrate. Inline heat treatment device. 5. The method of claim 4,
And the portions of the first and second horizontal bars in contact with the substrate are rounded. The method of claim 5,
The heater is formed in the shape of a tube and are arranged in a shape that intersects the transfer direction of the substrate while having a mutual interval,
And the first and second support members are positioned between the heaters adjacent to each other and the heaters to move forward or backward in an interval between the heaters adjacent to each other and the heaters. The method according to claim 6,
When the substrate is transferred from one of the heating furnaces adjacent to each other to the other of the heating furnaces,
The first transfer plate installed in one of the heating furnaces and the first transfer plate installed in the other one of the heating furnaces move in the same manner,
And the second transfer plate installed in one of the heating furnaces and the second transfer plate installed in the other one of the heating furnaces move in the same manner. A plurality of furnaces arranged in succession, each providing a space where the substrate is heat-treated, a heater installed in each of the heating furnaces to heat the substrate, and installed in each of the heating furnaces to support the substrates And a substrate transfer method of an inline heat treatment apparatus including transfer means for transferring the injected substrate to another adjacent heating furnace,
And the transfer means lifts the substrate and transfers the substrate to another adjacent heating furnace. 9. The method of claim 8,
The substrate may include a transfer plate that is capable of lifting and lowering perpendicular to the transfer direction of the substrate and capable of moving forward or backward in parallel with the transfer direction of the substrate; And one side is coupled to the transfer plate and the other side is supported by the substrate, and is transported by the transfer means including a plurality of support members moving together with the transfer plate. 10. The method of claim 9,
And when the substrate is mounted and supported on the support member, the transfer plate moves up and forwards to transfer the substrate, and then descends and then moves backward. The method of claim 10,
The conveying plates are arranged with a mutual gap therebetween and are equally raised → forwarded → lowered → a plurality of first conveying plates that are reversed, and are disposed between the first conveying plate and the first conveying plate adjacent to each other and are raised equally → With a plurality of second conveying plates to move forward → lower → reverse,
The support member has a plurality of first support members respectively provided on the first conveyance plate and a plurality of second support members respectively provided on the second conveyance plate,
The substrate transfer method of the in-line heat treatment apparatus characterized in that the first transfer plate and the second transfer plate to transfer the substrate while independently moving. The method of claim 11,
A substrate transfer method of an inline heat treatment apparatus, characterized in that the movement of the first transfer plate and the movement of the second transfer plate are alternated. The method of claim 12,
When the substrate is mounted and supported on the first support member, the first transfer plate moves up → forwards to transfer the substrate and then descends,
When the first transfer plate is lowered to the bottom dead center, the substrate mounted on the first support member is mounted on the second support member.
When the substrate is mounted and supported on the second support member, the second transfer plate is moved up and down to transfer the substrate and then descend,
And when the second transfer plate is lowered to the bottom dead center, the substrate mounted and supported by the second support member is mounted and supported by the first support member. The method of claim 13,
When the first transfer plate is lowered and the substrate is simultaneously mounted on the first and second support members, the second transfer plate is raised and then the first transfer plate is reversed.
And when the second transfer plate is lowered and the substrate is simultaneously mounted on the first and second support members, the first transfer plate is raised and then the second transfer plate is reversed. 15. The method of claim 14,
When the substrate is transferred from one of the heating furnaces adjacent to each other to the other of the heating furnaces,
The first transfer plate installed in one of the heating furnaces and the first transfer plate installed in the other one of the heating furnaces move in the same manner,
The substrate transfer method of the in-line heat treatment apparatus, characterized in that the second transfer plate installed in any one of the heating furnace and the second transfer plate installed in the other one of the heating furnace moves in the same manner. The method of claim 11,
The first support member has a pair of first vertical bars having one end coupled to the first transfer plate and a first horizontal bar integrally formed at the other end of the first vertical bar, and supporting the substrate.
The second supporting member has a pair of second vertical bars coupled to the second transfer plate at one end thereof and integrally formed at the other end of the second vertical bar, and has a second horizontal bar supporting the substrate. Substrate transfer method of inline heat treatment apparatus. 17. The method of claim 16,
The area of the first and second horizontal bar in contact with the substrate is formed to be rounded substrate transfer method of the in-line heat treatment apparatus. The method of claim 11,
The heater is formed in the shape of a tube and are arranged in a shape that intersects the transfer direction of the substrate while having a mutual interval,
The first and second supporting members are positioned between the heaters adjacent to each other and the heaters, and the substrates of the inline heat treatment apparatus are moved up → forward → down → backwards at a distance between the heaters and the heaters adjacent to each other. Conveying method.

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