KR20120114372A - 요각 프로파일을 포함하는 수직 트랜지스터 - Google Patents
요각 프로파일을 포함하는 수직 트랜지스터 Download PDFInfo
- Publication number
- KR20120114372A KR20120114372A KR1020127022265A KR20127022265A KR20120114372A KR 20120114372 A KR20120114372 A KR 20120114372A KR 1020127022265 A KR1020127022265 A KR 1020127022265A KR 20127022265 A KR20127022265 A KR 20127022265A KR 20120114372 A KR20120114372 A KR 20120114372A
- Authority
- KR
- South Korea
- Prior art keywords
- layer
- material layer
- substrate
- conductive material
- electrically conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
- H10D30/026—Manufacture or treatment of FETs having insulated gates [IGFET] having laterally-coplanar source and drain regions, a gate at the sides of the bulk channel, and both horizontal and vertical current flow
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
- H03K17/51—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used
- H03K17/56—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used by the use, as active elements, of semiconductor devices
- H03K17/687—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used by the use, as active elements, of semiconductor devices the devices being field-effect transistors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6728—Vertical TFTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/674—Thin-film transistors [TFT] characterised by the active materials
- H10D30/675—Group III-V materials, Group II-VI materials, Group IV-VI materials, selenium or tellurium
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/674—Thin-film transistors [TFT] characterised by the active materials
- H10D30/6755—Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
Landscapes
- Thin Film Transistor (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/713,264 | 2010-02-26 | ||
| US12/713,264 US8803203B2 (en) | 2010-02-26 | 2010-02-26 | Transistor including reentrant profile |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20120114372A true KR20120114372A (ko) | 2012-10-16 |
Family
ID=43875263
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020127022265A Withdrawn KR20120114372A (ko) | 2010-02-26 | 2011-02-10 | 요각 프로파일을 포함하는 수직 트랜지스터 |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US8803203B2 (enExample) |
| EP (1) | EP2539924B1 (enExample) |
| JP (1) | JP2013520839A (enExample) |
| KR (1) | KR20120114372A (enExample) |
| CN (1) | CN102782821B (enExample) |
| BR (1) | BR112012019907A2 (enExample) |
| WO (1) | WO2011106165A1 (enExample) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2661776A2 (en) * | 2011-01-07 | 2013-11-13 | Eastman Kodak Company | Transistor including multiple reentrant profiles |
| US8492769B2 (en) * | 2011-01-07 | 2013-07-23 | Eastman Kodak Company | Transistor including multi-layer reentrant profile |
| US8962989B2 (en) | 2011-02-03 | 2015-02-24 | Solar Junction Corporation | Flexible hermetic semiconductor solar cell package with non-hermetic option |
| US8273654B1 (en) * | 2011-09-29 | 2012-09-25 | Eastman Kodak Company | Producing a vertical transistor including reentrant profile |
| JP6018607B2 (ja) * | 2013-07-12 | 2016-11-02 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| US9117914B1 (en) * | 2014-03-06 | 2015-08-25 | Eastman Kodak Company | VTFT with polymer core |
| US9147770B1 (en) * | 2014-03-06 | 2015-09-29 | Eastman Kodak Company | VTFT with extended electrode |
| US9123815B1 (en) * | 2014-03-06 | 2015-09-01 | Eastman Kodak Company | VTFTs including offset electrodes |
| US20150287831A1 (en) * | 2014-04-08 | 2015-10-08 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and electronic device including semiconductor device |
| US9691997B2 (en) * | 2014-06-11 | 2017-06-27 | Eastman Kodak Company | Devices having dielectric layers with thiosulfate-containing polymers |
Family Cites Families (38)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63170971A (ja) | 1987-01-09 | 1988-07-14 | Nec Corp | 半導体装置 |
| EP0344292B1 (en) | 1987-12-02 | 1997-04-23 | Advanced Micro Devices, Inc. | A process of fabricating self-aligned semiconductor devices |
| JPH02140863A (ja) | 1988-11-22 | 1990-05-30 | Nec Corp | 分散型エディタにおける端末側エディタのテキスト送信方式 |
| JPH02140863U (enExample) | 1989-04-26 | 1990-11-26 | ||
| JPH05144744A (ja) | 1991-11-18 | 1993-06-11 | Nippon Telegr & Teleph Corp <Ntt> | 半導体薄膜形成方法 |
| KR970007965B1 (en) | 1994-05-12 | 1997-05-19 | Lg Semicon Co Ltd | Structure and fabrication method of tft |
| KR0132490B1 (ko) * | 1994-07-21 | 1998-04-16 | 문정환 | 박막트랜지스터 제조방법 |
| JPH08153878A (ja) * | 1994-11-29 | 1996-06-11 | Sony Corp | 薄膜トランジスタ及びその製造方法 |
| US5641694A (en) * | 1994-12-22 | 1997-06-24 | International Business Machines Corporation | Method of fabricating vertical epitaxial SOI transistor |
| KR0165398B1 (ko) * | 1995-05-26 | 1998-12-15 | 윤종용 | 버티칼 트랜지스터의 제조방법 |
| US5780911A (en) * | 1995-11-29 | 1998-07-14 | Lg Semicon Co., Ltd. | Thin film transistor and method for fabricating the same |
| GB0024294D0 (en) * | 2000-10-04 | 2000-11-15 | Univ Cambridge Tech | Solid state embossing of polymer devices |
| DE10234735A1 (de) * | 2002-07-30 | 2004-02-12 | Infineon Technologies Ag | Verfahren zum vertikalen Strukturieren von Substraten in der Halbleiterprozesstechnik mittels inkonformer Abscheidung |
| US6924517B2 (en) * | 2003-08-26 | 2005-08-02 | International Business Machines Corporation | Thin channel FET with recessed source/drains and extensions |
| FR2861501B1 (fr) * | 2003-10-22 | 2006-01-13 | Commissariat Energie Atomique | Dispositif microelectronique a effet de champ apte a former un ou plusiseurs canaux de transistors |
| JP3983222B2 (ja) | 2004-01-13 | 2007-09-26 | Necエレクトロニクス株式会社 | 半導体装置及びその製造方法 |
| US7629633B2 (en) * | 2004-05-20 | 2009-12-08 | Isaac Wing Tak Chan | Vertical thin film transistor with short-channel effect suppression |
| US6972461B1 (en) * | 2004-06-30 | 2005-12-06 | International Business Machines Corporation | Channel MOSFET with strained silicon channel on strained SiGe |
| JP4568286B2 (ja) * | 2004-10-04 | 2010-10-27 | パナソニック株式会社 | 縦型電界効果トランジスタおよびその製造方法 |
| JP2006269599A (ja) * | 2005-03-23 | 2006-10-05 | Sony Corp | パターン形成方法、有機電界効果型トランジスタの製造方法、及び、フレキシブルプリント回路板の製造方法 |
| TWI278068B (en) * | 2005-11-03 | 2007-04-01 | Nanya Technology Corp | Growth controlled vertical transistor |
| US7413982B2 (en) * | 2006-03-29 | 2008-08-19 | Eastman Kodak Company | Process for atomic layer deposition |
| US7456429B2 (en) * | 2006-03-29 | 2008-11-25 | Eastman Kodak Company | Apparatus for atomic layer deposition |
| JP2007284766A (ja) | 2006-04-19 | 2007-11-01 | Shimadzu Corp | 縦型プラズマcvd装置 |
| US7410856B2 (en) * | 2006-09-14 | 2008-08-12 | Micron Technology, Inc. | Methods of forming vertical transistors |
| JP2008091379A (ja) * | 2006-09-29 | 2008-04-17 | Sanyo Electric Co Ltd | 電界効果トランジスタ及びその製造方法 |
| JP2008103636A (ja) | 2006-10-20 | 2008-05-01 | Sumitomo Electric Ind Ltd | 縦型トランジスタ、および縦型トランジスタを作製する方法 |
| JP2008160004A (ja) * | 2006-12-26 | 2008-07-10 | Toshiba Corp | 半導体記憶装置及びその製造方法 |
| US7789961B2 (en) * | 2007-01-08 | 2010-09-07 | Eastman Kodak Company | Delivery device comprising gas diffuser for thin film deposition |
| US11136667B2 (en) * | 2007-01-08 | 2021-10-05 | Eastman Kodak Company | Deposition system and method using a delivery head separated from a substrate by gas pressure |
| JP2008277375A (ja) | 2007-04-26 | 2008-11-13 | Sanyo Electric Co Ltd | 電界効果トランジスタ及びその製造方法 |
| US20090001470A1 (en) * | 2007-06-26 | 2009-01-01 | Anderson Brent A | Method for forming acute-angle spacer for non-orthogonal finfet and the resulting structure |
| KR100889607B1 (ko) | 2007-08-13 | 2009-03-20 | 성균관대학교산학협력단 | 더미 드레인층을 이용한 수직 실린더형 트랜지스터의제조방법 및 이에 의해 제조된 수직 실린더형 트랜지스터 |
| KR100896631B1 (ko) | 2007-08-13 | 2009-05-08 | 성균관대학교산학협력단 | 수직 실린더형 트랜지스터의 제조방법 및 이에 의해 제조된수직 실린더형 트랜지스터 |
| JP2009130165A (ja) * | 2007-11-26 | 2009-06-11 | Sanyo Electric Co Ltd | Cmos半導体装置 |
| KR100960928B1 (ko) * | 2008-01-02 | 2010-06-07 | 주식회사 하이닉스반도체 | 수직형 트랜지스터 및 그의 형성방법 |
| JP2010040580A (ja) | 2008-07-31 | 2010-02-18 | Sanyo Electric Co Ltd | 有機薄膜デバイスの製造方法及び有機薄膜デバイス |
| US8637355B2 (en) * | 2011-08-26 | 2014-01-28 | Eastman Kodak Company | Actuating transistor including single layer reentrant profile |
-
2010
- 2010-02-26 US US12/713,264 patent/US8803203B2/en active Active
-
2011
- 2011-02-10 BR BR112012019907A patent/BR112012019907A2/pt not_active IP Right Cessation
- 2011-02-10 EP EP11704703.5A patent/EP2539924B1/en active Active
- 2011-02-10 WO PCT/US2011/024310 patent/WO2011106165A1/en not_active Ceased
- 2011-02-10 CN CN201180010647.7A patent/CN102782821B/zh not_active Expired - Fee Related
- 2011-02-10 KR KR1020127022265A patent/KR20120114372A/ko not_active Withdrawn
- 2011-02-10 JP JP2012555025A patent/JP2013520839A/ja active Pending
-
2014
- 2014-05-29 US US14/289,678 patent/US9337828B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| BR112012019907A2 (pt) | 2016-05-10 |
| US20140266402A1 (en) | 2014-09-18 |
| EP2539924A1 (en) | 2013-01-02 |
| WO2011106165A1 (en) | 2011-09-01 |
| CN102782821A (zh) | 2012-11-14 |
| US20110210783A1 (en) | 2011-09-01 |
| JP2013520839A (ja) | 2013-06-06 |
| CN102782821B (zh) | 2016-01-13 |
| EP2539924B1 (en) | 2019-12-11 |
| US8803203B2 (en) | 2014-08-12 |
| US9337828B2 (en) | 2016-05-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7923313B1 (en) | Method of making transistor including reentrant profile | |
| US7985684B1 (en) | Actuating transistor including reduced channel length | |
| KR20120114372A (ko) | 요각 프로파일을 포함하는 수직 트랜지스터 | |
| US8617942B2 (en) | Producing transistor including single layer reentrant profile | |
| US20130082746A1 (en) | Vertical transistor having reduced parasitic capacitance | |
| US8946070B2 (en) | Four terminal transistor fabrication | |
| US8409937B2 (en) | Producing transistor including multi-layer reentrant profile | |
| US8383469B2 (en) | Producing transistor including reduced channel length | |
| CN103314445B (zh) | 包含多重凹入外形的晶体管 | |
| US20140374762A1 (en) | Circuit including four terminal transistor | |
| US20140374806A1 (en) | Four terminal transistor | |
| US8674748B2 (en) | Actuating transistor including multi-layer reentrant profile | |
| US8492769B2 (en) | Transistor including multi-layer reentrant profile | |
| US8338291B2 (en) | Producing transistor including multiple reentrant profiles | |
| US8847226B2 (en) | Transistor including multiple reentrant profiles | |
| US8304347B2 (en) | Actuating transistor including multiple reentrant profiles | |
| US8847232B2 (en) | Transistor including reduced channel length | |
| US8592909B2 (en) | Transistor including single layer reentrant profile | |
| WO2012094109A1 (en) | Transistor including reduced channel length |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
Patent event date: 20120824 Patent event code: PA01051R01D Comment text: International Patent Application |
|
| PG1501 | Laying open of application | ||
| PC1203 | Withdrawal of no request for examination | ||
| WITN | Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid |