KR20120099282A - 오르가노실리콘 화합물, 이의 생성 방법, 및 이를 함유하는 경화성 실리콘 조성물 - Google Patents
오르가노실리콘 화합물, 이의 생성 방법, 및 이를 함유하는 경화성 실리콘 조성물 Download PDFInfo
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- KR20120099282A KR20120099282A KR1020127019022A KR20127019022A KR20120099282A KR 20120099282 A KR20120099282 A KR 20120099282A KR 1020127019022 A KR1020127019022 A KR 1020127019022A KR 20127019022 A KR20127019022 A KR 20127019022A KR 20120099282 A KR20120099282 A KR 20120099282A
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- carbon atoms
- hydrocarbon group
- unsaturated aliphatic
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- 150000002763 monocarboxylic acids Chemical class 0.000 description 1
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 description 1
- 238000000655 nuclear magnetic resonance spectrum Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229950000688 phenothiazine Drugs 0.000 description 1
- 150000002990 phenothiazines Chemical class 0.000 description 1
- 150000003003 phosphines Chemical class 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000002798 polar solvent Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 150000003377 silicon compounds Chemical class 0.000 description 1
- 230000002269 spontaneous effect Effects 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- RINCXYDBBGOEEQ-UHFFFAOYSA-N succinic anhydride Chemical class O=C1CCC(=O)O1 RINCXYDBBGOEEQ-UHFFFAOYSA-N 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 150000003852 triazoles Chemical class 0.000 description 1
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 1
- LFRDHGNFBLIJIY-UHFFFAOYSA-N trimethoxy(prop-2-enyl)silane Chemical compound CO[Si](OC)(OC)CC=C LFRDHGNFBLIJIY-UHFFFAOYSA-N 0.000 description 1
- PZJJKWKADRNWSW-UHFFFAOYSA-N trimethoxysilicon Chemical group CO[Si](OC)OC PZJJKWKADRNWSW-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
- C07F7/02—Silicon compounds
- C07F7/08—Compounds having one or more C—Si linkages
- C07F7/0803—Compounds with Si-C or Si-Si linkages
- C07F7/081—Compounds with Si-C or Si-Si linkages comprising at least one atom selected from the elements N, O, halogen, S, Se or Te
- C07F7/0812—Compounds with Si-C or Si-Si linkages comprising at least one atom selected from the elements N, O, halogen, S, Se or Te comprising a heterocyclic ring
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
- C07F7/02—Silicon compounds
- C07F7/08—Compounds having one or more C—Si linkages
- C07F7/0834—Compounds having one or more O-Si linkage
- C07F7/0838—Compounds with one or more Si-O-Si sequences
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
- C07F7/02—Silicon compounds
- C07F7/08—Compounds having one or more C—Si linkages
- C07F7/18—Compounds having one or more C—Si linkages as well as one or more C—O—Si linkages
- C07F7/1804—Compounds having Si-O-C linkages
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Silicon Polymers (AREA)
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009298549A JP5759101B2 (ja) | 2009-12-28 | 2009-12-28 | 有機ケイ素化合物およびその製造方法 |
| JPJP-P-2009-298549 | 2009-12-28 | ||
| JP2009298663A JP5508843B2 (ja) | 2009-12-28 | 2009-12-28 | 硬化性シリコーン組成物 |
| JP2009298662A JP5503963B2 (ja) | 2009-12-28 | 2009-12-28 | 有機ケイ素化合物、その製造方法、及びその有機ケイ素化合物を接着性付与剤として含む硬化性シリコーン組成物 |
| JPJP-P-2009-298663 | 2009-12-28 | ||
| JPJP-P-2009-298662 | 2009-12-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20120099282A true KR20120099282A (ko) | 2012-09-07 |
Family
ID=43629686
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020127019022A KR20120099282A (ko) | 2009-12-28 | 2010-12-20 | 오르가노실리콘 화합물, 이의 생성 방법, 및 이를 함유하는 경화성 실리콘 조성물 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US8729195B2 (fr) |
| EP (1) | EP2519528A1 (fr) |
| KR (1) | KR20120099282A (fr) |
| CN (1) | CN102686598B (fr) |
| TW (1) | TWI512013B (fr) |
| WO (1) | WO2011081165A1 (fr) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5790480B2 (ja) * | 2011-12-20 | 2015-10-07 | 信越化学工業株式会社 | 酸無水物基含有オルガノシロキサン及びその製造方法 |
| CN104277405B (zh) * | 2014-10-20 | 2017-02-15 | 上海工程技术大学 | 一种超分子蒙脱土增强硅胶模具胶及其制备方法 |
| US20210363391A1 (en) * | 2017-08-07 | 2021-11-25 | Nitto Denko Corporation | Pressure-sensitive adhesive layer, optical film having pressure-sensitive adhesive layer, optical laminate, and image display device |
| TWI780238B (zh) | 2017-11-16 | 2022-10-11 | 美商陶氏有機矽公司 | 單部分式可固化聚矽氧組成物 |
| ES2944442T3 (es) | 2018-09-13 | 2023-06-21 | Momentive Performance Mat Gmbh | Polisiloxanos funcionales |
| JP7074642B2 (ja) * | 2018-10-29 | 2022-05-24 | 信越化学工業株式会社 | シリコーンエマルジョン組成物 |
| JP7084343B2 (ja) * | 2019-03-11 | 2022-06-14 | 信越化学工業株式会社 | 付加硬化型シリコーン組成物、その硬化物、及び光半導体素子 |
| EP3947565A1 (fr) * | 2019-03-25 | 2022-02-09 | Lord Corporation | Élastomères de silicone moulables ayant une adhérence sans primaire sélective |
| TW202106767A (zh) * | 2019-08-07 | 2021-02-16 | 美商陶氏全球科技公司 | 酸酐及芳族官能化之聚有機矽氧烷 |
| JP2023514372A (ja) * | 2020-02-19 | 2023-04-05 | モメンティブ パフォーマンス マテリアルズ インコーポレイテッド | 光硬化性シリコーン組成物および剥離ライナーの製造方法 |
| KR20230025408A (ko) * | 2020-06-24 | 2023-02-21 | 다우 실리콘즈 코포레이션 | 실리콘 탄성중합체 조성물 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3301807A1 (de) | 1983-01-20 | 1984-07-26 | Wacker-Chemie GmbH, 8000 München | Verfahren zur herstellung von silanen mit sic-gebundener bernsteinsaeureanhydridgruppe und silane mit derartiger gruppe |
| JPH0647595B2 (ja) | 1983-04-11 | 1994-06-22 | ゼネラル・エレクトリック・カンパニイ | 二無水物終端ポリジオルガノシロキサンの製造方法 |
| JP3029686B2 (ja) * | 1991-02-13 | 2000-04-04 | 東レ・ダウコーニング・シリコーン株式会社 | オルガノペンタシロキサンおよびその製造方法 |
| JPH05331291A (ja) | 1992-06-03 | 1993-12-14 | Shin Etsu Chem Co Ltd | 酸無水物基含有オルガノポリシロキサンおよびその製造方法 |
| JP2850726B2 (ja) | 1993-10-29 | 1999-01-27 | 信越化学工業株式会社 | 有機ケイ素化合物及びその製造方法 |
| US5492994A (en) * | 1995-01-12 | 1996-02-20 | Dow Corning Corporation | Adhesion additives and curable organosiloxane compositions containing same |
| JP4221089B2 (ja) * | 1998-05-27 | 2009-02-12 | 東レ・ダウコーニング株式会社 | シロキサンを含有する組成物 |
| CA2346357A1 (fr) * | 1998-10-08 | 2000-04-13 | Kaneka Corporation | Compositions durcissables |
| JP4013023B2 (ja) * | 2000-10-05 | 2007-11-28 | 信越化学工業株式会社 | 有機ケイ素化合物 |
| JP2005327777A (ja) | 2004-05-12 | 2005-11-24 | Shin Etsu Chem Co Ltd | 発光ダイオード用シリコーン樹脂組成物 |
| EP1846480B1 (fr) * | 2005-02-01 | 2008-10-22 | Dow Corning Corporation | Compositions d'enduction durcissables |
| JP5247979B2 (ja) * | 2005-06-01 | 2013-07-24 | モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 | 透明な硬化物を与えるポリオルガノシロキサン組成物 |
| JP4395472B2 (ja) * | 2005-11-08 | 2010-01-06 | 信越化学工業株式会社 | 金メッキプリント基板上に装着された半導体素子の封止方法 |
| US20080146709A1 (en) | 2006-12-15 | 2008-06-19 | Shin -Etsu Chemical Co., Ltd. | Addition curable silicone adhesive composition and cured product thereof |
| JP2009298549A (ja) | 2008-06-13 | 2009-12-24 | Ricoh Co Ltd | 自動原稿搬送装置及び画像形成装置 |
| JP5311891B2 (ja) | 2008-06-16 | 2013-10-09 | 花王株式会社 | 水硬性組成物用添加剤組成物 |
| JP5274117B2 (ja) | 2008-06-16 | 2013-08-28 | 日揮触媒化成株式会社 | 多孔質球状粒子、その製造方法および該多孔質球状粒子を含むインク受容層形成用塗布液 |
| DE102009002231A1 (de) * | 2009-04-06 | 2010-10-07 | Wacker Chemie Ag | Bei Raumtemperatur selbsthaftende Pt-katalysierte additions-vernetzende Siliconzusammensetzungen |
-
2010
- 2010-12-20 CN CN201080059463.5A patent/CN102686598B/zh not_active Expired - Fee Related
- 2010-12-20 KR KR1020127019022A patent/KR20120099282A/ko not_active Application Discontinuation
- 2010-12-20 WO PCT/JP2010/073651 patent/WO2011081165A1/fr active Application Filing
- 2010-12-20 US US13/519,066 patent/US8729195B2/en not_active Expired - Fee Related
- 2010-12-20 EP EP10805746A patent/EP2519528A1/fr not_active Withdrawn
- 2010-12-21 TW TW099145084A patent/TWI512013B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| EP2519528A1 (fr) | 2012-11-07 |
| US20120309921A1 (en) | 2012-12-06 |
| TW201139521A (en) | 2011-11-16 |
| CN102686598B (zh) | 2015-06-17 |
| CN102686598A (zh) | 2012-09-19 |
| TWI512013B (zh) | 2015-12-11 |
| WO2011081165A1 (fr) | 2011-07-07 |
| US8729195B2 (en) | 2014-05-20 |
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