KR20120086737A - 방사선 경화성 수지 조성물 및 이를 이용한 급속 성형법 - Google Patents

방사선 경화성 수지 조성물 및 이를 이용한 급속 성형법 Download PDF

Info

Publication number
KR20120086737A
KR20120086737A KR1020127016516A KR20127016516A KR20120086737A KR 20120086737 A KR20120086737 A KR 20120086737A KR 1020127016516 A KR1020127016516 A KR 1020127016516A KR 20127016516 A KR20127016516 A KR 20127016516A KR 20120086737 A KR20120086737 A KR 20120086737A
Authority
KR
South Korea
Prior art keywords
composition
weight
total weight
group
radiation curable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020127016516A
Other languages
English (en)
Korean (ko)
Inventor
젠스 크리스토프 티에스
에일린 조지 엔겔로 아타나시오스 디아스
존 앨런 로톤
데이비드 엘. 윈밀
지젱 쉬
자오롱 유
Original Assignee
디에스엠 아이피 어셋츠 비.브이.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 디에스엠 아이피 어셋츠 비.브이. filed Critical 디에스엠 아이피 어셋츠 비.브이.
Publication of KR20120086737A publication Critical patent/KR20120086737A/ko
Ceased legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/10Processes of additive manufacturing
    • B29C64/106Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B33ADDITIVE MANUFACTURING TECHNOLOGY
    • B33YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y70/00Materials specially adapted for additive manufacturing
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/06Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polyethers, polyoxymethylenes or polyacetals
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/10Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers containing more than one epoxy radical per molecule
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06Polymers provided for in subclass C08G
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/04Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
    • C08G65/06Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
    • C08G65/16Cyclic ethers having four or more ring atoms
    • C08G65/18Oxetanes
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0037Production of three-dimensional images
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/038Macromolecular compounds which are rendered insoluble or differentially wettable
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B33ADDITIVE MANUFACTURING TECHNOLOGY
    • B33YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y10/00Processes of additive manufacturing

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Optics & Photonics (AREA)
  • Epoxy Resins (AREA)
  • Polyethers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Graft Or Block Polymers (AREA)
KR1020127016516A 2002-05-03 2003-05-01 방사선 경화성 수지 조성물 및 이를 이용한 급속 성형법 Ceased KR20120086737A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US37723902P 2002-05-03 2002-05-03
US60/377,239 2002-05-03
PCT/NL2003/000320 WO2003093901A1 (en) 2002-05-03 2003-05-01 Radiation curable resin composition and rapid prototyping process using the same

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020117006984A Division KR101176747B1 (ko) 2002-05-03 2003-05-01 방사선 경화성 수지 조성물 및 이를 이용한 급속 성형법

Publications (1)

Publication Number Publication Date
KR20120086737A true KR20120086737A (ko) 2012-08-03

Family

ID=29401462

Family Applications (3)

Application Number Title Priority Date Filing Date
KR1020127016516A Ceased KR20120086737A (ko) 2002-05-03 2003-05-01 방사선 경화성 수지 조성물 및 이를 이용한 급속 성형법
KR10-2004-7017652A Ceased KR20050007372A (ko) 2002-05-03 2003-05-01 방사선 경화성 수지 조성물 및 이를 이용한 쾌속 성형법
KR1020117006984A Expired - Lifetime KR101176747B1 (ko) 2002-05-03 2003-05-01 방사선 경화성 수지 조성물 및 이를 이용한 급속 성형법

Family Applications After (2)

Application Number Title Priority Date Filing Date
KR10-2004-7017652A Ceased KR20050007372A (ko) 2002-05-03 2003-05-01 방사선 경화성 수지 조성물 및 이를 이용한 쾌속 성형법
KR1020117006984A Expired - Lifetime KR101176747B1 (ko) 2002-05-03 2003-05-01 방사선 경화성 수지 조성물 및 이를 이용한 급속 성형법

Country Status (8)

Country Link
US (3) US7183040B2 (https=)
EP (2) EP2466378B1 (https=)
JP (2) JP2005529200A (https=)
KR (3) KR20120086737A (https=)
CN (2) CN100576069C (https=)
AU (1) AU2003224516A1 (https=)
ES (1) ES2405107T3 (https=)
WO (1) WO2003093901A1 (https=)

Families Citing this family (61)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB0212062D0 (en) * 2002-05-24 2002-07-03 Vantico Ag Jetable compositions
US20040077745A1 (en) * 2002-10-18 2004-04-22 Jigeng Xu Curable compositions and rapid prototyping process using the same
US20040137368A1 (en) * 2003-01-13 2004-07-15 3D Systems, Inc. Stereolithographic resins containing selected oxetane compounds
US20050040564A1 (en) * 2003-08-18 2005-02-24 Jones Oliver Systems and methods for using norbornene based curable materials
WO2005021248A1 (ja) * 2003-08-27 2005-03-10 Fuji Photo Film Co., Ltd. 三次元造形物の製造方法
US7232850B2 (en) * 2003-10-03 2007-06-19 Huntsman Advanced Materials Americas Inc. Photocurable compositions for articles having stable tensile properties
US20070149667A1 (en) * 2003-10-16 2007-06-28 Dsm Ip Assets B.V. Curable compositions and rapid prototyping process using the same
WO2005045525A1 (en) * 2003-11-06 2005-05-19 Dsm Ip Assets B.V. Curable compositions and rapid prototyping process using the same
JP2007513234A (ja) * 2003-12-02 2007-05-24 ディーエスエム アイピー アセッツ ビー.ブイ. 難燃性の放射線硬化性組成物
WO2006029095A1 (en) * 2004-09-03 2006-03-16 Henkel Corporation Photoinitiated cationic epoxy compositions
SE529306C2 (sv) * 2005-03-18 2007-06-26 Perstorp Specialty Chem Ab Ultravioletthärdande hartskomposition
JP4702784B2 (ja) * 2005-08-08 2011-06-15 ソニー株式会社 液体吐出型記録ヘッドの流路構成材料
US7279210B2 (en) * 2005-09-07 2007-10-09 3M Innovative Properties Company Curable compositions, methods of making and using the same, and articles therefrom
JP5306814B2 (ja) 2005-09-13 2013-10-02 スリーディー システムズ インコーポレーテッド Abs類似物品製造を目的とした光硬化性組成物
CN101277991B (zh) * 2005-09-29 2011-11-09 Cmet公司 用于立体平版印刷术的树脂组合物
EP1941322B1 (en) * 2005-10-27 2018-05-30 3D Systems, Inc. Antimony-free photocurable resin composition and three dimensional article
JP5068454B2 (ja) * 2005-12-06 2012-11-07 富士フイルム株式会社 インク組成物、インクジェット記録方法、印刷物、平版印刷版の製造方法、及び平版印刷版
JP5280615B2 (ja) * 2006-06-16 2013-09-04 シーメット株式会社 光学的立体造形用樹脂組成物
JP2008024871A (ja) * 2006-07-24 2008-02-07 Fujifilm Corp インク組成物、インクジェット記録方法、印刷物、平版印刷版の製造方法、及び平版印刷版
US20080103226A1 (en) 2006-10-31 2008-05-01 Dsm Ip Assets B.V. Photo-curable resin composition
JP2010520947A (ja) * 2007-03-14 2010-06-17 ハンツマン・アドヴァンスト・マテリアルズ・(スイッツランド)・ゲーエムベーハー Abs様物品を製造するための光硬化性組成物
EP2135136B1 (en) * 2007-03-20 2018-10-17 DSM IP Assets B.V. Stereolithography resin compositions and three-dimensional objects made therefrom
US20090004579A1 (en) * 2007-06-27 2009-01-01 Dsm Ip Assets B.V. Clear and colorless three-dimensional articles made via stereolithography and method of making said articles
WO2009070500A1 (en) * 2007-11-27 2009-06-04 Huntsman Advanced Materials Americas Inc. Photocurable resin composition for producing three dimensional articles having high clarity
JP5210645B2 (ja) * 2008-01-25 2013-06-12 シーメット株式会社 光学的立体造形用樹脂組成物
JP5284833B2 (ja) * 2008-03-31 2013-09-11 富士フイルム株式会社 フォトスペーサーの製造方法
JP5446902B2 (ja) * 2009-03-05 2014-03-19 Dic株式会社 カチオン重合性接着剤及びそれを用いて得られた偏光板
US8501033B2 (en) 2009-03-13 2013-08-06 Dsm Ip Assets B.V. Radiation curable resin composition and rapid three-dimensional imaging process using the same
US8365499B2 (en) 2009-09-04 2013-02-05 Valinge Innovation Ab Resilient floor
ES2985671T3 (es) 2009-09-04 2024-11-06 Vaelinge Innovation Ab Suelo elástico
US11725395B2 (en) 2009-09-04 2023-08-15 Välinge Innovation AB Resilient floor
EP4092213B1 (en) * 2010-01-11 2023-12-13 Välinge Innovation AB Floor covering with interlocking design
CN102385250A (zh) * 2011-06-29 2012-03-21 南昌大学 一种紫外激光固化快速成型光敏树脂及制备方法
JP5843508B2 (ja) * 2011-07-21 2016-01-13 Jsr株式会社 光学的立体造形用放射線硬化性液状樹脂組成物、及びそれを光硬化させて得られる光造形物
JP6105587B2 (ja) 2011-08-29 2017-04-05 セラロック、イノベーション、アクチボラグ フロアパネル用機械式係止システム
JP2014048556A (ja) * 2012-09-03 2014-03-17 Sumitomo Chemical Co Ltd 感光性樹脂組成物
UA111803C2 (uk) * 2012-10-05 2016-06-10 Кроноплюс Текнікал Аг Підлогова панель для зовнішнього застосування
CN102981362A (zh) * 2012-11-14 2013-03-20 南昌大学 4,5-环氧环己烷-1,2-二甲酸二缩水甘油酯作为预聚物制备立体光刻快速成型光敏树脂的方法及应用
EP3656944A1 (en) 2013-03-25 2020-05-27 Välinge Innovation AB Floorboards provided with a mechanical locking system and a method to produce such a locking system
EP2842980B1 (en) 2013-08-09 2021-05-05 DSM IP Assets B.V. Low-viscosity liquid radiation curable dental aligner mold resin compositions for additive manufacturing
JP6399084B2 (ja) * 2014-03-14 2018-10-03 コニカミノルタ株式会社 3d造形用光硬化性組成物および3d造形物の製造方法
HUE061045T2 (hu) 2014-08-29 2023-05-28 Vaelinge Innovation Ab Függõleges illesztékrendszer felületburkoló panelhez
US10241403B2 (en) * 2015-03-26 2019-03-26 Tokyo Ohka Kogyo Co., Ltd. Negative photosensitive composition and pattern formation method
EP3390744B1 (en) 2015-12-17 2024-08-21 Välinge Innovation AB A method for producing a mechanical locking system for panels
CN108779321B (zh) * 2016-03-30 2021-04-02 株式会社Adeka 固化性组合物、固化物的制造方法、及其固化物
EA038228B1 (ru) 2016-09-30 2021-07-27 Велинге Инновейшн Аб Набор панелей, собираемых посредством вертикального перемещения и совместного блокирования в вертикальном и горизонтальном направлении
WO2018078160A1 (en) 2016-10-28 2018-05-03 Dsm Ip Assets B.V. Thermosetting compositions and forming three-dimensional objects therefrom
EP3315292A1 (en) * 2016-10-28 2018-05-02 DSM IP Assets B.V. Thermosetting compositions and forming three-dimensional objects therefrom
JP7068270B2 (ja) * 2017-03-06 2022-05-16 マクセル株式会社 モデル材インクセット、サポート材組成物、インクセット、立体造形物および立体造形物の製造方法
KR102171283B1 (ko) * 2017-04-28 2020-10-28 주식회사 엘지화학 밀봉재 조성물
CN111315701B (zh) 2017-11-03 2022-10-14 科思创(荷兰)有限公司 包含用液体可辐射固化超吸收性聚合物组合物涂布的纤维的阻水体系
CN111788269B (zh) 2017-12-15 2023-10-20 科思创(荷兰)有限公司 用于高温喷射粘性热固性材料以经由增材制造创建固体制品的组合物和方法
TWI692502B (zh) 2017-12-29 2020-05-01 法商阿科瑪法國公司 可固化組成物
HRP20230520T1 (hr) 2018-01-09 2023-08-04 Välinge Innovation AB Skup ploča
CN112074395A (zh) * 2018-03-02 2020-12-11 福姆实验室公司 潜伏性固化树脂及相关方法
US10793735B2 (en) * 2018-03-15 2020-10-06 Ricoh Company, Ltd. Curable composition, curable ink, storing container, two-dimensional or three-dimensional image forming device, two-dimensional or three-dimensional image forming method, cured product, printed matter, and adhesive label
WO2020003133A1 (en) * 2018-06-29 2020-01-02 3M Innovative Properties Company Hydrated orthodontic articles, kits, and methods of making same
CN111624853B (zh) * 2019-07-10 2023-07-14 住华科技股份有限公司 着色树脂组成物、及应用其的彩色滤光片和显示设备
WO2021183096A1 (en) * 2020-03-09 2021-09-16 Hewlett-Packard Development Company, L.P. Three-dimensional printing with charged yellow water-soluble dye-based fusing agent
SE545292C2 (en) * 2020-07-08 2023-06-20 Perstorp Ab A radiation curable composition comprising a biobased reactive diluent
EP4206820A1 (en) 2021-12-30 2023-07-05 Arkema France Hybrid photocurable composition

Family Cites Families (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3708296A (en) * 1968-08-20 1973-01-02 American Can Co Photopolymerization of epoxy monomers
US3835003A (en) * 1968-08-20 1974-09-10 American Can Co Photopolymerization of oxetanes
PT71476A (en) 1979-07-03 1980-08-01 Sagami Chem Res Process for producing oxygen-containing hydrocarbon compounds
US4339567A (en) 1980-03-07 1982-07-13 Ciba-Geigy Corporation Photopolymerization by means of sulphoxonium salts
US4383025A (en) 1980-07-10 1983-05-10 Ciba-Geigy Corporation Photopolymerization by means of sulfoxonium salts
US4398014A (en) 1980-11-04 1983-08-09 Ciba-Geigy Corporation Sulfoxonium salts and their use as polymerization catalysts
EP0094914B1 (de) 1982-05-19 1986-09-24 Ciba-Geigy Ag Photopolymerisation mittels organometallischer Salze
EP0094915B1 (de) 1982-05-19 1987-01-21 Ciba-Geigy Ag Härtbare, Metallocenkomplexe enthaltende Zusammensetzungen, daraus erhältliche aktivierte Vorstufen und deren Verwendung
EP0153904B1 (de) 1984-02-10 1988-09-14 Ciba-Geigy Ag Verfahren zur Herstellung einer Schutzschicht oder einer Reliefabbildung
GB8414525D0 (en) 1984-06-07 1984-07-11 Ciba Geigy Ag Sulphoxonium salts
US4694029A (en) * 1985-04-09 1987-09-15 Cook Paint And Varnish Company Hybrid photocure system
US4772530A (en) 1986-05-06 1988-09-20 The Mead Corporation Photosensitive materials containing ionic dye compounds as initiators
US4772541A (en) 1985-11-20 1988-09-20 The Mead Corporation Photohardenable compositions containing a dye borate complex and photosensitive materials employing the same
EP0223587B1 (en) 1985-11-20 1991-02-13 The Mead Corporation Photosensitive materials containing ionic dye compounds as initiators
US4751102A (en) 1987-07-27 1988-06-14 The Mead Corporation Radiation-curable ink and coating compositions containing ionic dye compounds as initiators
US5002856A (en) 1989-08-02 1991-03-26 E. I. Du Pont De Nemours And Company Thermally stable carbazole diazonium salts as sources of photo-initiated strong acid
TW269017B (https=) 1992-12-21 1996-01-21 Ciba Geigy Ag
US5364737A (en) * 1994-01-25 1994-11-15 Morton International, Inc. Waterbone photoresists having associate thickeners
KR950034472A (ko) * 1994-04-06 1995-12-28 가나이 쓰토무 패턴형성방법 및 그것에 사용되는 투영노광장치
WO1996041237A1 (en) 1995-06-07 1996-12-19 E.I. Du Pont De Nemours And Company Sensitizers and photoacid precursors
US5665792A (en) 1995-06-07 1997-09-09 E. I. Du Pont De Nemours And Company Stabilizers for use with photoacid precursor formulations
JP3161583B2 (ja) * 1995-07-21 2001-04-25 東亞合成株式会社 活性エネルギー線硬化型組成物
JP3849989B2 (ja) * 1996-04-09 2006-11-22 株式会社Adeka 光学的立体造形用樹脂組成物および光学的立体造形法
TW329539B (en) * 1996-07-05 1998-04-11 Mitsubishi Electric Corp The semiconductor device and its manufacturing method
KR100491736B1 (ko) * 1996-07-29 2005-09-09 반티코 아게 입체리토그래피용방사선-경화성액체조성물
KR100481994B1 (ko) * 1996-08-27 2005-12-01 세이코 엡슨 가부시키가이샤 박리방법,박막디바이스의전사방법,및그것을이용하여제조되는박막디바이스,박막집적회로장치및액정표시장치
JP4197361B2 (ja) * 1996-12-02 2008-12-17 株式会社Adeka 光学的立体造形用樹脂組成物および光学的立体造形方法
JP3626302B2 (ja) * 1996-12-10 2005-03-09 Jsr株式会社 光硬化性樹脂組成物
US5821897A (en) 1996-12-20 1998-10-13 Wiltron Company Simulator for testing a collision avoidance radar system
FR2757530A1 (fr) 1996-12-24 1998-06-26 Rhodia Chimie Sa Utilisation pour la stereophotolithographie - d'une composition liquide photoreticulable par voie cationique comprenant un photoamorceur du type sels d'onium ou de complexes organometalliques
JP3913350B2 (ja) * 1998-01-13 2007-05-09 ナブテスコ株式会社 光学的造形用樹脂組成物
US6287745B1 (en) * 1998-02-18 2001-09-11 Dsm N.V. Photocurable liquid resin composition comprising an epoxy-branched alicyclic compound
DE69906076T2 (de) * 1998-06-11 2003-12-24 Dow Global Technologies, Inc. Photohärtende elastomere polymere
JP4350832B2 (ja) * 1999-04-19 2009-10-21 Jsr株式会社 立体造形用光硬化性樹脂組成物およびこれを硬化してなる造形物
US6413699B1 (en) * 1999-10-11 2002-07-02 Macdermid Graphic Arts, Inc. UV-absorbing support layers and flexographic printing elements comprising same
JP3893833B2 (ja) * 2000-02-09 2007-03-14 ブラザー工業株式会社 インクジェット記録方式用エネルギー線硬化型組成物
JP2001310938A (ja) 2000-04-28 2001-11-06 Showa Denko Kk 重合性組成物、その硬化物と製造方法
JP3974336B2 (ja) * 2001-03-01 2007-09-12 ナブテスコ株式会社 光学的立体造形用の活性エネルギー線硬化性樹脂組成物
US20030149124A1 (en) * 2001-11-27 2003-08-07 Thommes Glen A. Radiation curable resin composition for making colored three dimensional objects

Also Published As

Publication number Publication date
US7183040B2 (en) 2007-02-27
CN100576069C (zh) 2009-12-30
US20040142274A1 (en) 2004-07-22
HK1080554A1 (zh) 2006-04-28
CN101706639A (zh) 2010-05-12
EP2466378A3 (en) 2012-09-05
EP1502155A1 (en) 2005-02-02
JP2005529200A (ja) 2005-09-29
US20080064780A1 (en) 2008-03-13
EP1502155B1 (en) 2013-01-30
ES2405107T3 (es) 2013-05-30
KR101176747B1 (ko) 2012-08-23
US20070154840A1 (en) 2007-07-05
JP2010189641A (ja) 2010-09-02
KR20110051258A (ko) 2011-05-17
EP2466378B1 (en) 2014-01-08
WO2003093901A1 (en) 2003-11-13
AU2003224516A1 (en) 2003-11-17
JP5656419B2 (ja) 2015-01-21
KR20050007372A (ko) 2005-01-17
EP2466378A2 (en) 2012-06-20
CN1650231A (zh) 2005-08-03

Similar Documents

Publication Publication Date Title
KR101176747B1 (ko) 방사선 경화성 수지 조성물 및 이를 이용한 급속 성형법
US9090020B2 (en) Photo-curable resin composition
US8501033B2 (en) Radiation curable resin composition and rapid three-dimensional imaging process using the same
KR101048603B1 (ko) 경화성 조성물 및 이를 사용한 급속 조형 방법
US20100304088A1 (en) Radiation curable resin composition and rapid three dimensional imaging process using the same
KR20040030694A (ko) 방사선-경화성 수지 조성물 및 이를 사용한 신속프로토타이핑 방법
US20150044623A1 (en) Low-viscosity liquid radiation curable dental aligner mold resin compositions for additive manufacturing
JP2005510603A (ja) 着色された三次元物品を製造するための照射硬化性樹脂組成物
JP2002060463A (ja) 光硬化性樹脂組成物および立体形状物
HK1143864A (en) Radiation curable resin composition and rapid prototyping process using the same
HK1080554B (en) Radiation curable resin composition and rapid prototyping process using the same
US20040054025A1 (en) Compositions comprising a benzophenone photoinitiator
WO2004001507A1 (en) Compositions comprising a benzophenone photoinitiator
HK1120869A (en) Photo-curable resin composition

Legal Events

Date Code Title Description
A107 Divisional application of patent
A201 Request for examination
PA0104 Divisional application for international application

Comment text: Divisional Application for International Patent

Patent event code: PA01041R01D

Patent event date: 20120625

PA0201 Request for examination
PG1501 Laying open of application
E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20120903

Patent event code: PE09021S01D

E601 Decision to refuse application
PE0601 Decision on rejection of patent

Patent event date: 20130325

Comment text: Decision to Refuse Application

Patent event code: PE06012S01D

Patent event date: 20120903

Comment text: Notification of reason for refusal

Patent event code: PE06011S01I