KR20120025433A - 발광 장치 및 그 제조 방법 - Google Patents

발광 장치 및 그 제조 방법 Download PDF

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Publication number
KR20120025433A
KR20120025433A KR1020110089986A KR20110089986A KR20120025433A KR 20120025433 A KR20120025433 A KR 20120025433A KR 1020110089986 A KR1020110089986 A KR 1020110089986A KR 20110089986 A KR20110089986 A KR 20110089986A KR 20120025433 A KR20120025433 A KR 20120025433A
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KR
South Korea
Prior art keywords
light emitting
semiconductor layer
layer
trench
carrier
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Ceased
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KR1020110089986A
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English (en)
Korean (ko)
Inventor
차오-싱 첸
치엔-카이 청
추-린 야오
신-마오 리우
치엔-푸 황
Original Assignee
에피스타 코포레이션
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Publication of KR20120025433A publication Critical patent/KR20120025433A/ko
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/813—Bodies having a plurality of light-emitting regions, e.g. multi-junction LEDs or light-emitting devices having photoluminescent regions within the bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
    • H10H20/018—Bonding of wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
    • H10H20/82—Roughened surfaces, e.g. at the interface between epitaxial layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/83—Electrodes
    • H10H20/831—Electrodes characterised by their shape
    • H10H20/8316—Multi-layer electrodes comprising at least one discontinuous layer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/83—Electrodes
    • H10H20/831—Electrodes characterised by their shape
    • H10H20/8312—Electrodes characterised by their shape extending at least partially through the bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls

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  • Led Devices (AREA)
  • Led Device Packages (AREA)
KR1020110089986A 2010-09-06 2011-09-06 발광 장치 및 그 제조 방법 Ceased KR20120025433A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US38025810P 2010-09-06 2010-09-06
US61/380,258 2010-09-06

Publications (1)

Publication Number Publication Date
KR20120025433A true KR20120025433A (ko) 2012-03-15

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020110089986A Ceased KR20120025433A (ko) 2010-09-06 2011-09-06 발광 장치 및 그 제조 방법

Country Status (6)

Country Link
US (2) US8592827B2 (enExample)
JP (1) JP6038436B2 (enExample)
KR (1) KR20120025433A (enExample)
CN (1) CN102386201B (enExample)
DE (1) DE102011053274B4 (enExample)
TW (2) TWI557934B (enExample)

Cited By (1)

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Publication number Priority date Publication date Assignee Title
KR20180031074A (ko) * 2013-07-29 2018-03-27 에피스타 코포레이션 반도체 장치

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TWI446578B (zh) * 2010-09-23 2014-07-21 Epistar Corp 發光元件及其製法
US8241932B1 (en) * 2011-03-17 2012-08-14 Tsmc Solid State Lighting Ltd. Methods of fabricating light emitting diode packages
TWI488295B (zh) * 2012-05-25 2015-06-11 Phostek Inc 發光二極體陣列與其形成方法
TWI466328B (zh) * 2012-06-11 2014-12-21 Ritedia Corp 覆晶式發光二極體及其製法與應用
JP2014096455A (ja) * 2012-11-08 2014-05-22 Stanley Electric Co Ltd 半導体発光素子アレイおよび車両用灯具
US20140151630A1 (en) * 2012-12-04 2014-06-05 Feng-Hsu Fan Protection for the epitaxial structure of metal devices
TWI499091B (zh) * 2012-12-18 2015-09-01 新世紀光電股份有限公司 發光裝置
DE102013103079A1 (de) * 2013-03-26 2014-10-02 Osram Opto Semiconductors Gmbh Optoelektronischer Halbleiterchip und Verfahren zur Herstellung eines optoelektronischen Halbleiterchips
KR20140140399A (ko) * 2013-05-29 2014-12-09 서울바이오시스 주식회사 복수개의 발광 요소들을 갖는 발광다이오드 및 그것을 제조하는 방법
DE112013007192B4 (de) * 2013-06-26 2024-05-23 Epistar Corporation Lichtemittierende Vorrichtung
TWI566427B (zh) * 2013-07-05 2017-01-11 晶元光電股份有限公司 發光元件及其製造方法
CN105324857B (zh) * 2013-07-05 2019-01-11 晶元光电股份有限公司 发光元件的制造方法
DE102013107531A1 (de) * 2013-07-16 2015-01-22 Osram Opto Semiconductors Gmbh Optoelektronischer Halbleiterchip
TWI603390B (zh) * 2013-07-29 2017-10-21 晶元光電股份有限公司 選擇性轉移半導體元件的方法
US11329195B2 (en) 2013-08-27 2022-05-10 Epistar Corporation Semiconductor light-emitting device
US9461209B2 (en) * 2013-11-27 2016-10-04 Epistar Corporation Semiconductor light-emitting device
CN110047865B (zh) * 2013-09-03 2024-02-23 晶元光电股份有限公司 具有多个发光结构的发光元件
KR102378952B1 (ko) * 2015-08-27 2022-03-25 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광소자 및 이를 포함하는 발광소자 패키지
CN106784276B (zh) * 2016-11-30 2019-04-12 陕西科技大学 一种金刚石热沉GaN基异侧电极LED制作方法
US20200243736A1 (en) * 2017-01-12 2020-07-30 Enkris Semiconductor, Inc. Semiconductor device and fabrication method for the same
WO2018160858A1 (en) * 2017-03-01 2018-09-07 Phase Sensitive Innovations, Inc. Diamond-backed photodiodes, diamond-sandwiched photodiodes, photodiode systems and related methods of manufacture
CN109768134A (zh) * 2019-01-28 2019-05-17 华引芯（武汉）科技有限公司 一种发光高效率反转垂直结构高压芯片及其制备方法
CN112687780B (zh) * 2020-12-29 2022-02-11 厦门三安光电有限公司 一种高压发光二极管芯片

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JP3717196B2 (ja) * 1994-07-19 2005-11-16 豊田合成株式会社 発光素子
JP2005322722A (ja) * 2004-05-07 2005-11-17 Korai Kagi Kofun Yugenkoshi 発光ダイオード
US7563625B2 (en) * 2005-01-11 2009-07-21 SemiLEDs Optoelectronics Co., Ltd. Method of making light-emitting diodes (LEDs) with improved light extraction by roughening
US7221044B2 (en) * 2005-01-21 2007-05-22 Ac Led Lighting, L.L.C. Heterogeneous integrated high voltage DC/AC light emitter
CN1835253A (zh) * 2005-03-17 2006-09-20 日立电线株式会社 发光二极管阵列
KR100782129B1 (ko) * 2006-05-25 2007-12-05 한국광기술원 웨이퍼 본딩 공정을 이용한 실리콘 기반 발광다이오드제조방법
WO2008031280A1 (fr) * 2006-09-13 2008-03-20 Helio Optoelectronics Corporation Structure de diode électroluminescente
KR100974923B1 (ko) * 2007-03-19 2010-08-10 서울옵토디바이스주식회사 발광 다이오드
DE102008011848A1 (de) * 2008-02-29 2009-09-03 Osram Opto Semiconductors Gmbh Optoelektronischer Halbleiterkörper und Verfahren zur Herstellung eines solchen
KR20100028412A (ko) * 2008-09-04 2010-03-12 삼성전자주식회사 나노 막대를 이용한 발광 다이오드 및 그 제조 방법
JP5123269B2 (ja) * 2008-09-30 2013-01-23 ソウル オプト デバイス カンパニー リミテッド 発光素子及びその製造方法
DE102008062933B4 (de) * 2008-12-23 2021-05-12 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronische Projektionsvorrichtung
KR100986570B1 (ko) * 2009-08-31 2010-10-07 엘지이노텍 주식회사 반도체 발광소자 및 그 제조방법

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180031074A (ko) * 2013-07-29 2018-03-27 에피스타 코포레이션 반도체 장치
US10553747B2 (en) 2013-07-29 2020-02-04 Epistar Corporation Method of selectively transferring semiconductor device
US11211522B2 (en) 2013-07-29 2021-12-28 Epistar Corporation Method of selectively transferring semiconductor device
US11901478B2 (en) 2013-07-29 2024-02-13 Epistar Corporation Method of selectively transferring semiconductor device
US12369431B2 (en) 2013-07-29 2025-07-22 Epistar Corporation Method of selectively transferring semiconductor device

Also Published As

Publication number Publication date
JP6038436B2 (ja) 2016-12-07
TW201212280A (en) 2012-03-16
US8847248B2 (en) 2014-09-30
CN102386201B (zh) 2016-07-06
TWI539622B (zh) 2016-06-21
TWI557934B (zh) 2016-11-11
TW201212279A (en) 2012-03-16
US8592827B2 (en) 2013-11-26
JP2012060115A (ja) 2012-03-22
DE102011053274B4 (de) 2021-03-18
CN102386201A (zh) 2012-03-21
DE102011053274A1 (de) 2012-03-08
US20120056212A1 (en) 2012-03-08
US20140077238A1 (en) 2014-03-20

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