KR20120010971A - 접착제 조성물 및 접착 필름 - Google Patents
접착제 조성물 및 접착 필름 Download PDFInfo
- Publication number
- KR20120010971A KR20120010971A KR1020110073644A KR20110073644A KR20120010971A KR 20120010971 A KR20120010971 A KR 20120010971A KR 1020110073644 A KR1020110073644 A KR 1020110073644A KR 20110073644 A KR20110073644 A KR 20110073644A KR 20120010971 A KR20120010971 A KR 20120010971A
- Authority
- KR
- South Korea
- Prior art keywords
- resin
- adhesive
- filler
- adhesive composition
- film
- Prior art date
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/35—Heat-activated
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2010-167256 | 2010-07-26 | ||
JP2010167256A JP6159050B2 (ja) | 2010-07-26 | 2010-07-26 | 接着剤組成物及び接着フィルム |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020170099677A Division KR101864082B1 (ko) | 2010-07-26 | 2017-08-07 | 접착제 조성물 및 접착 필름 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20120010971A true KR20120010971A (ko) | 2012-02-06 |
Family
ID=45779193
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020110073644A KR20120010971A (ko) | 2010-07-26 | 2011-07-25 | 접착제 조성물 및 접착 필름 |
KR1020170099677A KR101864082B1 (ko) | 2010-07-26 | 2017-08-07 | 접착제 조성물 및 접착 필름 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020170099677A KR101864082B1 (ko) | 2010-07-26 | 2017-08-07 | 접착제 조성물 및 접착 필름 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP6159050B2 (ja) |
KR (2) | KR20120010971A (ja) |
TW (1) | TWI529232B (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9157014B2 (en) | 2012-11-29 | 2015-10-13 | Micron Technology, Inc. | Adhesives including a filler material and related methods |
JP6133152B2 (ja) * | 2013-07-10 | 2017-05-24 | 株式会社ディスコ | 樹脂シート貼着方法 |
JP6203645B2 (ja) * | 2014-01-09 | 2017-09-27 | 株式会社巴川製紙所 | 仮固定用接着シート |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08319466A (ja) | 1995-03-20 | 1996-12-03 | Fujitsu Ltd | 接着剤、半導体装置及びその製造方法 |
JP3628837B2 (ja) | 1997-04-14 | 2005-03-16 | 日本アエロジル株式会社 | 接着性樹脂組成物 |
KR100568491B1 (ko) * | 1997-07-04 | 2006-04-07 | 제온 코포레이션 | 반도체부품 접착제 |
KR100671312B1 (ko) * | 1999-08-25 | 2007-01-19 | 히다치 가세고교 가부시끼가이샤 | 배선단자 접속용 필름 |
US8445597B2 (en) * | 2006-07-20 | 2013-05-21 | Soken Chemical & Engineering Co., Ltd. | Pressure-sensitive adhesive composition for PDP front filter and use thereof |
JP2008063464A (ja) * | 2006-09-07 | 2008-03-21 | Tokyo Ohka Kogyo Co Ltd | 接着剤組成物、接着フィルム及び当該接着剤組成物の製造方法 |
JP2008308552A (ja) * | 2007-06-13 | 2008-12-25 | Shin Etsu Chem Co Ltd | 接着剤組成物及び接着フィルム |
JP5311534B2 (ja) * | 2007-12-04 | 2013-10-09 | 信越化学工業株式会社 | 接着剤組成物及び接着フィルム |
KR101284978B1 (ko) * | 2008-04-21 | 2013-07-10 | 주식회사 엘지화학 | 접착제 조성물, 상기를 포함하는 접착 필름, 다이싱 다이본딩 필름, 반도체 웨이퍼 및 반도체 장치 |
KR101485612B1 (ko) * | 2008-04-25 | 2015-01-22 | 신에쓰 가가꾸 고교 가부시끼가이샤 | 반도체 웨이퍼용 보호 필름 |
JP2010006912A (ja) * | 2008-06-25 | 2010-01-14 | Shin-Etsu Chemical Co Ltd | 接着剤組成物、接着フィルム及びダイシング・ダイアタッチフィルム |
KR100990807B1 (ko) * | 2008-07-30 | 2010-10-29 | 제일모직주식회사 | 반도체 칩 부착용 접착제 조성물 및 이를 이용한 반도체소자 |
JP5476046B2 (ja) * | 2008-10-03 | 2014-04-23 | 東京応化工業株式会社 | 剥離方法、基板の接着剤、および基板を含む積層体 |
JP5157938B2 (ja) * | 2009-01-27 | 2013-03-06 | 日立化成株式会社 | ダイボンディング用樹脂ペースト、該樹脂ペーストを用いた半導体装置の製造方法、および該製造方法により得られる半導体装置 |
-
2010
- 2010-07-26 JP JP2010167256A patent/JP6159050B2/ja active Active
-
2011
- 2011-07-06 TW TW100123849A patent/TWI529232B/zh active
- 2011-07-25 KR KR1020110073644A patent/KR20120010971A/ko active Application Filing
-
2017
- 2017-08-07 KR KR1020170099677A patent/KR101864082B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
KR101864082B1 (ko) | 2018-06-01 |
JP6159050B2 (ja) | 2017-07-05 |
JP2012025879A (ja) | 2012-02-09 |
KR20170094782A (ko) | 2017-08-21 |
TW201224100A (en) | 2012-06-16 |
TWI529232B (zh) | 2016-04-11 |
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