KR20110126189A - 이방 도전 접속용 필름의 사용 방법 - Google Patents
이방 도전 접속용 필름의 사용 방법 Download PDFInfo
- Publication number
- KR20110126189A KR20110126189A KR1020117025915A KR20117025915A KR20110126189A KR 20110126189 A KR20110126189 A KR 20110126189A KR 1020117025915 A KR1020117025915 A KR 1020117025915A KR 20117025915 A KR20117025915 A KR 20117025915A KR 20110126189 A KR20110126189 A KR 20110126189A
- Authority
- KR
- South Korea
- Prior art keywords
- film
- adhesive
- adhesive film
- protective film
- support
- Prior art date
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
- H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0264—Peeling insulating layer, e.g. foil, or separating mask
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/066—Transfer laminating of insulating material, e.g. resist as a whole layer, not as a pattern
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Non-Insulated Conductors (AREA)
- Combinations Of Printed Boards (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2007-136982 | 2007-05-23 | ||
JP2007136982A JP5104034B2 (ja) | 2007-05-23 | 2007-05-23 | 異方導電接続用フィルム及びリール体 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020097016729A Division KR101183299B1 (ko) | 2007-05-23 | 2008-05-02 | 이방 도전 접속용 필름 및 릴체 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20110126189A true KR20110126189A (ko) | 2011-11-22 |
Family
ID=40031700
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020097016729A KR101183299B1 (ko) | 2007-05-23 | 2008-05-02 | 이방 도전 접속용 필름 및 릴체 |
KR1020117025915A KR20110126189A (ko) | 2007-05-23 | 2008-05-02 | 이방 도전 접속용 필름의 사용 방법 |
KR1020117025913A KR101180619B1 (ko) | 2007-05-23 | 2008-05-02 | 이방 도전 접속용 필름 및 릴체 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020097016729A KR101183299B1 (ko) | 2007-05-23 | 2008-05-02 | 이방 도전 접속용 필름 및 릴체 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020117025913A KR101180619B1 (ko) | 2007-05-23 | 2008-05-02 | 이방 도전 접속용 필름 및 릴체 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP5104034B2 (fr) |
KR (3) | KR101183299B1 (fr) |
CN (4) | CN102324272A (fr) |
TW (2) | TWI456322B (fr) |
WO (1) | WO2008142985A1 (fr) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102037614B (zh) * | 2009-03-26 | 2014-03-19 | 日立化成株式会社 | 粘接材料卷轴 |
JP5459099B2 (ja) * | 2010-06-24 | 2014-04-02 | デクセリアルズ株式会社 | 半導体装置の製造方法 |
JP5759168B2 (ja) * | 2010-12-24 | 2015-08-05 | デクセリアルズ株式会社 | リール体及びリール体の製造方法 |
JP5737134B2 (ja) * | 2011-10-21 | 2015-06-17 | Tdk株式会社 | 粘着シート、表示器用部品および粘着シート製造方法 |
JP6300321B2 (ja) * | 2012-08-07 | 2018-03-28 | 株式会社Joled | 接合体の製造方法及び接合体 |
JP6170290B2 (ja) * | 2012-10-11 | 2017-07-26 | 日東電工株式会社 | 積層体 |
JP2016096308A (ja) * | 2014-11-17 | 2016-05-26 | 日東電工株式会社 | 半導体装置の製造方法 |
JP6677966B2 (ja) * | 2014-11-17 | 2020-04-08 | 日東電工株式会社 | セパレータ付き封止用シート、及び、半導体装置の製造方法 |
JP6689135B2 (ja) * | 2016-05-20 | 2020-04-28 | デクセリアルズ株式会社 | 接着テープ構造体 |
JP6829998B2 (ja) * | 2017-01-25 | 2021-02-17 | 日東シンコー株式会社 | 基材付接着シート及び半導体モジュール |
JP6641338B2 (ja) * | 2017-11-02 | 2020-02-05 | 積水化学工業株式会社 | 積層フィルム及び積層フィルムの製造方法 |
CN109341909B (zh) * | 2018-11-20 | 2020-11-10 | 郑州大学 | 一种多功能柔性应力传感器 |
KR102103745B1 (ko) * | 2020-02-06 | 2020-05-29 | (주)에이치케이 | 전자파 차폐필름용 이형필름의 부착장치 및 방법 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4832260U (fr) * | 1971-08-17 | 1973-04-19 | ||
JPS4832660U (fr) * | 1971-08-23 | 1973-04-20 | ||
JPS4856600U (fr) * | 1971-10-29 | 1973-07-19 | ||
JPS55127741U (fr) * | 1979-03-01 | 1980-09-09 | ||
JPS61120178U (fr) * | 1985-01-17 | 1986-07-29 | ||
JPH0437239U (fr) * | 1990-07-20 | 1992-03-30 | ||
JPH0621573U (ja) * | 1992-03-13 | 1994-03-22 | 昌一 柴田 | クリーナー用ロール巻粘着テープ |
JP3552274B2 (ja) * | 1994-05-20 | 2004-08-11 | ソニーケミカル株式会社 | シート状接着材の剥離フィルムの剥離方法及び剥離装置 |
JPH11100553A (ja) * | 1997-09-29 | 1999-04-13 | Toray Ind Inc | Tab用接着剤付きテープのロールおよびtab用接着剤付きテープの製造方法 |
JP2003276090A (ja) * | 2002-03-25 | 2003-09-30 | Sony Chem Corp | フィルム状接着剤の貼付装置 |
JP2004211017A (ja) * | 2003-01-08 | 2004-07-29 | Hitachi Chem Co Ltd | 接着剤テープ、接着剤テープの製造方法及び接着剤テープの圧着方法 |
CN100548840C (zh) * | 2002-07-30 | 2009-10-14 | 日立化成工业株式会社 | 粘接材料带连接体及粘接材料带的连接方法 |
JP3921452B2 (ja) * | 2003-03-04 | 2007-05-30 | ソニーケミカル&インフォメーションデバイス株式会社 | 異方導電性フィルムの積層テープ製造方法 |
DE602004018720D1 (de) * | 2003-09-09 | 2009-02-12 | Nitto Denko Corp | Anisotrop-leitender Film , Herstellungs- und Gebrauchsverfahren |
CN101880859B (zh) * | 2005-01-12 | 2013-03-27 | 出光兴产株式会社 | 溅射标靶 |
JP2006278837A (ja) * | 2005-03-30 | 2006-10-12 | Mitsui Mining & Smelting Co Ltd | フレキシブルプリント配線板の製造方法及びフレキシブルプリント配線板 |
KR20100117680A (ko) * | 2005-08-04 | 2010-11-03 | 히다치 가세고교 가부시끼가이샤 | 이방도전필름 및 그 제조방법 |
KR100683307B1 (ko) * | 2006-01-16 | 2007-02-15 | 엘에스전선 주식회사 | 두께 편차를 갖는 이방성 도전 필름 |
-
2007
- 2007-05-23 JP JP2007136982A patent/JP5104034B2/ja active Active
-
2008
- 2008-05-02 CN CN2011102086234A patent/CN102324272A/zh active Pending
- 2008-05-02 KR KR1020097016729A patent/KR101183299B1/ko active IP Right Grant
- 2008-05-02 CN CN2011102086395A patent/CN102354816A/zh active Pending
- 2008-05-02 CN CNA2008800048234A patent/CN101606282A/zh active Pending
- 2008-05-02 KR KR1020117025915A patent/KR20110126189A/ko not_active Application Discontinuation
- 2008-05-02 WO PCT/JP2008/058430 patent/WO2008142985A1/fr active Application Filing
- 2008-05-02 KR KR1020117025913A patent/KR101180619B1/ko active IP Right Grant
- 2008-05-02 CN CN201110208628.7A patent/CN102352194B/zh active Active
- 2008-05-19 TW TW101145098A patent/TWI456322B/zh active
- 2008-05-19 TW TW097118385A patent/TWI396022B/zh active
Also Published As
Publication number | Publication date |
---|---|
CN102354816A (zh) | 2012-02-15 |
KR20110126188A (ko) | 2011-11-22 |
CN102324272A (zh) | 2012-01-18 |
JP2008293751A (ja) | 2008-12-04 |
KR101183299B1 (ko) | 2012-09-14 |
TWI456322B (zh) | 2014-10-11 |
WO2008142985A1 (fr) | 2008-11-27 |
TWI396022B (zh) | 2013-05-11 |
KR101180619B1 (ko) | 2012-09-06 |
CN101606282A (zh) | 2009-12-16 |
CN102352194B (zh) | 2015-11-25 |
JP5104034B2 (ja) | 2012-12-19 |
TW201314329A (zh) | 2013-04-01 |
CN102352194A (zh) | 2012-02-15 |
KR20090122923A (ko) | 2009-12-01 |
TW200912491A (en) | 2009-03-16 |
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Legal Events
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A107 | Divisional application of patent | ||
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E601 | Decision to refuse application |