WO2008142985A1 - Film et bobine pour connexion électroconductrice anisotrope - Google Patents

Film et bobine pour connexion électroconductrice anisotrope Download PDF

Info

Publication number
WO2008142985A1
WO2008142985A1 PCT/JP2008/058430 JP2008058430W WO2008142985A1 WO 2008142985 A1 WO2008142985 A1 WO 2008142985A1 JP 2008058430 W JP2008058430 W JP 2008058430W WO 2008142985 A1 WO2008142985 A1 WO 2008142985A1
Authority
WO
WIPO (PCT)
Prior art keywords
film
anisotropic electroconductive
electroconductive connection
adhesive film
reel
Prior art date
Application number
PCT/JP2008/058430
Other languages
English (en)
Japanese (ja)
Inventor
Kazuya Sato
Original Assignee
Hitachi Chemical Company, Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Company, Ltd. filed Critical Hitachi Chemical Company, Ltd.
Priority to KR1020097016729A priority Critical patent/KR101183299B1/ko
Priority to KR1020117025913A priority patent/KR101180619B1/ko
Publication of WO2008142985A1 publication Critical patent/WO2008142985A1/fr

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0264—Peeling insulating layer, e.g. foil, or separating mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/066—Transfer laminating of insulating material, e.g. resist as a whole layer, not as a pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Non-Insulated Conductors (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

La présente invention concerne un film en forme de bande (10) pour connexion électroconductrice anisotrope, comprenant un stratifié (15) comprenant un premier film (11), un film adhésif (12) et un second film (13) empilés dans cet ordre. Dans ce film en forme de bande (10), le film adhésif (12) a sur son plan une partie transversale X entre une face d'extrémité (13a) dans la direction longitudinale du second film (13) et un plan principal (12b) du film adhésif (12) et fait saillie à partir d'un plan de référence (16) perpendiculaire au plan principal (12b) du film adhésif (12). Selon le film pour connexion électroconductrice anisotrope, dans les films portant le film adhésif entre eux, seul un des films peut être sélectivement séparé et supprimé avec une fiabilité satisfaisante.
PCT/JP2008/058430 2007-05-23 2008-05-02 Film et bobine pour connexion électroconductrice anisotrope WO2008142985A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020097016729A KR101183299B1 (ko) 2007-05-23 2008-05-02 이방 도전 접속용 필름 및 릴체
KR1020117025913A KR101180619B1 (ko) 2007-05-23 2008-05-02 이방 도전 접속용 필름 및 릴체

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-136982 2007-05-23
JP2007136982A JP5104034B2 (ja) 2007-05-23 2007-05-23 異方導電接続用フィルム及びリール体

Publications (1)

Publication Number Publication Date
WO2008142985A1 true WO2008142985A1 (fr) 2008-11-27

Family

ID=40031700

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/058430 WO2008142985A1 (fr) 2007-05-23 2008-05-02 Film et bobine pour connexion électroconductrice anisotrope

Country Status (5)

Country Link
JP (1) JP5104034B2 (fr)
KR (3) KR20110126189A (fr)
CN (4) CN102352194B (fr)
TW (2) TWI456322B (fr)
WO (1) WO2008142985A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2312697A1 (fr) * 2009-03-26 2011-04-20 Hitachi Chemical Company, Ltd. Bobine de matériau adhésif
WO2014024478A1 (fr) * 2012-08-07 2014-02-13 パナソニック株式会社 Procédé de fabrication de corps joint et corps joint

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5459099B2 (ja) * 2010-06-24 2014-04-02 デクセリアルズ株式会社 半導体装置の製造方法
JP5759168B2 (ja) * 2010-12-24 2015-08-05 デクセリアルズ株式会社 リール体及びリール体の製造方法
JP5737134B2 (ja) * 2011-10-21 2015-06-17 Tdk株式会社 粘着シート、表示器用部品および粘着シート製造方法
JP6170290B2 (ja) * 2012-10-11 2017-07-26 日東電工株式会社 積層体
JP6677966B2 (ja) * 2014-11-17 2020-04-08 日東電工株式会社 セパレータ付き封止用シート、及び、半導体装置の製造方法
JP2016096308A (ja) * 2014-11-17 2016-05-26 日東電工株式会社 半導体装置の製造方法
JP6689135B2 (ja) * 2016-05-20 2020-04-28 デクセリアルズ株式会社 接着テープ構造体
JP6829998B2 (ja) * 2017-01-25 2021-02-17 日東シンコー株式会社 基材付接着シート及び半導体モジュール
JP6641338B2 (ja) * 2017-11-02 2020-02-05 積水化学工業株式会社 積層フィルム及び積層フィルムの製造方法
CN109341909B (zh) * 2018-11-20 2020-11-10 郑州大学 一种多功能柔性应力传感器
KR102103745B1 (ko) * 2020-02-06 2020-05-29 (주)에이치케이 전자파 차폐필름용 이형필름의 부착장치 및 방법

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4832660U (fr) * 1971-08-23 1973-04-20
JPS4856600U (fr) * 1971-10-29 1973-07-19
JPS55127741U (fr) * 1979-03-01 1980-09-09
JPS61120178U (fr) * 1985-01-17 1986-07-29
JPH0437239U (fr) * 1990-07-20 1992-03-30
JPH0621573U (ja) * 1992-03-13 1994-03-22 昌一 柴田 クリーナー用ロール巻粘着テープ
JPH07315682A (ja) * 1994-05-20 1995-12-05 Sony Chem Corp シート状接着材の剥離フィルムの剥離方法及び剥離装置
JPH11100553A (ja) * 1997-09-29 1999-04-13 Toray Ind Inc Ｔａｂ用接着剤付きテープのロールおよびｔａｂ用接着剤付きテープの製造方法
JP2004211017A (ja) * 2003-01-08 2004-07-29 Hitachi Chem Co Ltd 接着剤テープ、接着剤テープの製造方法及び接着剤テープの圧着方法
WO2007015372A1 (fr) * 2005-08-04 2007-02-08 Hitachi Chemical Co., Ltd. Film conducteur anisotrope et procédé de production correspondant

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4832260U (fr) * 1971-08-17 1973-04-19
JP2003276090A (ja) * 2002-03-25 2003-09-30 Sony Chem Corp フィルム状接着剤の貼付装置
CN100548840C (zh) * 2002-07-30 2009-10-14 日立化成工业株式会社 粘接材料带连接体及粘接材料带的连接方法
JP3921452B2 (ja) * 2003-03-04 2007-05-30 ソニーケミカル＆インフォメーションデバイス株式会社 異方導電性フィルムの積層テープ製造方法
DE602004018720D1 (de) * 2003-09-09 2009-02-12 Nitto Denko Corp Anisotrop-leitender Film , Herstellungs- und Gebrauchsverfahren
WO2006075483A1 (fr) * 2005-01-12 2006-07-20 Idemitsu Kosan Co., Ltd. Substrat tft et procede de production afferent, substrat stratifie avec film conducteur transparent et cablage en al et procede de production afferent, carte de circuits imprimes stratifiee avec film conducteur transparent et cablage en al et procede de production afferent et materieu de film conducteur transparent a oxyde
JP2006278837A (ja) * 2005-03-30 2006-10-12 Mitsui Mining & Smelting Co Ltd フレキシブルプリント配線板の製造方法及びフレキシブルプリント配線板
KR100683307B1 (ko) * 2006-01-16 2007-02-15 엘에스전선 주식회사 두께 편차를 갖는 이방성 도전 필름

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4832660U (fr) * 1971-08-23 1973-04-20
JPS4856600U (fr) * 1971-10-29 1973-07-19
JPS55127741U (fr) * 1979-03-01 1980-09-09
JPS61120178U (fr) * 1985-01-17 1986-07-29
JPH0437239U (fr) * 1990-07-20 1992-03-30
JPH0621573U (ja) * 1992-03-13 1994-03-22 昌一 柴田 クリーナー用ロール巻粘着テープ
JPH07315682A (ja) * 1994-05-20 1995-12-05 Sony Chem Corp シート状接着材の剥離フィルムの剥離方法及び剥離装置
JPH11100553A (ja) * 1997-09-29 1999-04-13 Toray Ind Inc Ｔａｂ用接着剤付きテープのロールおよびｔａｂ用接着剤付きテープの製造方法
JP2004211017A (ja) * 2003-01-08 2004-07-29 Hitachi Chem Co Ltd 接着剤テープ、接着剤テープの製造方法及び接着剤テープの圧着方法
WO2007015372A1 (fr) * 2005-08-04 2007-02-08 Hitachi Chemical Co., Ltd. Film conducteur anisotrope et procédé de production correspondant

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2312697A1 (fr) * 2009-03-26 2011-04-20 Hitachi Chemical Company, Ltd. Bobine de matériau adhésif
EP2312697A4 (fr) * 2009-03-26 2012-03-21 Hitachi Chemical Co Ltd Bobine de matériau adhésif
WO2014024478A1 (fr) * 2012-08-07 2014-02-13 パナソニック株式会社 Procédé de fabrication de corps joint et corps joint
US9252390B2 (en) 2012-08-07 2016-02-02 Joled Inc. Production method for joined body, and joined body
JPWO2014024478A1 (ja) * 2012-08-07 2016-07-25 株式会社Ｊｏｌｅｄ 接合体の製造方法及び接合体

Also Published As

Publication number Publication date
JP5104034B2 (ja) 2012-12-19
TWI456322B (zh) 2014-10-11
CN102324272A (zh) 2012-01-18
KR101180619B1 (ko) 2012-09-06
KR101183299B1 (ko) 2012-09-14
TW200912491A (en) 2009-03-16
KR20110126188A (ko) 2011-11-22
KR20110126189A (ko) 2011-11-22
JP2008293751A (ja) 2008-12-04
TWI396022B (zh) 2013-05-11
CN102352194A (zh) 2012-02-15
CN102354816A (zh) 2012-02-15
CN101606282A (zh) 2009-12-16
TW201314329A (zh) 2013-04-01
CN102352194B (zh) 2015-11-25
KR20090122923A (ko) 2009-12-01

Similar Documents

Publication Publication Date Title
WO2008142985A1 (fr) Film et bobine pour connexion électroconductrice anisotrope
WO2007075516A3 (fr) Procede de formation d'une lame de polariseur
WO2012030494A3 (fr) Procédé de fabrication d'un dispositif d'affichage d'image
WO2009072469A1 (fr) Plaque de polarisation et dispositif d'affichage d'images
TW200834123A (en) Surface protection film and optical film with surface protection film
WO2008108042A1 (fr) Substrat de panneau d'affichage, panneau d'affichage, dispositif d'affichage et procédé de fabrication d'un substrat de panneau d'affichage
TW200725770A (en) Connecting apparatus for adhesive tape and pasting apparatus
WO2011159546A3 (fr) Ensemble étiquette permettant d'apposer une étiquette sur des dispositifs électroniques
MY153006A (en) Wafer processing film
WO2006019666A3 (fr) Article optique stratifie
WO2009044560A1 (fr) Dispositif d'application de bande adhésive et procédé de liaison de bande
WO2008139742A1 (fr) Feuille adhésive sensible à la pression
EP1816088A4 (fr) Rouleau de film hydrosoluble et procede pour derouler le film hydrosoluble
WO2009078787A3 (fr) Ruban chirurgical
PL1936093T3 (pl) Taśma uszczelniajaca do uszczelniania szczeliny
SG11201902647VA (en) Thin film affixing device
WO2008126376A1 (fr) Dispositif de travail, dispositif d'application de ruban adhésif, et procédé permettant d'ajouter un élément en ruban
EP2325275A3 (fr) Feuille adhésive permettant de protéger la face arrière d'un module de batterie solaire et module de batterie solaire l'utilisant
WO2009141231A3 (fr) Systèmes comportant des composants couplés à un adhésif à dissipation électrostatique
TW200619841A (en) Photosensitive film, photosensitive film laminate and photosensitive film roll
WO2011048794A3 (fr) Élément optique et son procédé de fabrication
WO2009044592A1 (fr) Procédé de fabrication de film optique adhésif, film optique adhésif et dispositif d'affichage d'image
WO2012099794A3 (fr) Pile de films optiques
WO2008142937A1 (fr) Pellicules adhésives autocollantes
WO2014043229A3 (fr) Joint adhésif amovible pour dispositif informatique

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200880004823.4

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08752335

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 1020097016729

Country of ref document: KR

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 08752335

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 1020117025915

Country of ref document: KR

Ref document number: 1020117025913

Country of ref document: KR