KR20110118765A - 광전 소자의 제조 방법 및 광전 소자 - Google Patents

광전 소자의 제조 방법 및 광전 소자 Download PDF

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Publication number
KR20110118765A
KR20110118765A KR1020117011021A KR20117011021A KR20110118765A KR 20110118765 A KR20110118765 A KR 20110118765A KR 1020117011021 A KR1020117011021 A KR 1020117011021A KR 20117011021 A KR20117011021 A KR 20117011021A KR 20110118765 A KR20110118765 A KR 20110118765A
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KR
South Korea
Prior art keywords
metal layer
carrier
optical device
semiconductor chip
optoelectronic
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KR1020117011021A
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English (en)
Korean (ko)
Inventor
패트릭 닌쯔
허벌트 브루너
Original Assignee
오스람 옵토 세미컨덕터스 게엠베하
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Publication of KR20110118765A publication Critical patent/KR20110118765A/ko
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0235—Method for mounting laser chips
    • H01S5/02355—Fixing laser chips on mounts
    • H01S5/0237—Fixing laser chips on mounts by soldering
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W95/00—Packaging processes not covered by the other groups of this subclass

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  • Led Device Packages (AREA)
KR1020117011021A 2009-01-15 2009-11-02 광전 소자의 제조 방법 및 광전 소자 Withdrawn KR20110118765A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102009004724.7 2009-01-15
DE102009004724A DE102009004724A1 (de) 2009-01-15 2009-01-15 Verfahren zur Herstellung eines optoelektronischen Bauteils und optoelektronisches Bauteil

Publications (1)

Publication Number Publication Date
KR20110118765A true KR20110118765A (ko) 2011-11-01

Family

ID=42040475

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020117011021A Withdrawn KR20110118765A (ko) 2009-01-15 2009-11-02 광전 소자의 제조 방법 및 광전 소자

Country Status (7)

Country Link
US (1) US8450847B2 (https=)
EP (1) EP2377172A1 (https=)
JP (1) JP2012515441A (https=)
KR (1) KR20110118765A (https=)
CN (1) CN102282686A (https=)
DE (1) DE102009004724A1 (https=)
WO (1) WO2010081445A1 (https=)

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JP6833385B2 (ja) * 2016-07-29 2021-02-24 エルジー ディスプレイ カンパニー リミテッド 表示装置の製造方法および製造装置
JP7408266B2 (ja) 2017-06-14 2024-01-05 日亜化学工業株式会社 光源装置
CN113067248A (zh) * 2019-12-31 2021-07-02 深圳市中光工业技术研究院 激光封装结构
CN111477693A (zh) * 2020-04-27 2020-07-31 深圳市灵明光子科技有限公司 光学芯片封装结构及其封装方法、光电装置

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Also Published As

Publication number Publication date
WO2010081445A1 (de) 2010-07-22
JP2012515441A (ja) 2012-07-05
US8450847B2 (en) 2013-05-28
US20110285017A1 (en) 2011-11-24
DE102009004724A1 (de) 2010-07-22
EP2377172A1 (de) 2011-10-19
CN102282686A (zh) 2011-12-14

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