KR20110082476A - 대상체들의 다수의 측면을 이미지 촬영하도록 된 이미징 시스템에 대상체들을 제공하는 시스템 및 방법 - Google Patents
대상체들의 다수의 측면을 이미지 촬영하도록 된 이미징 시스템에 대상체들을 제공하는 시스템 및 방법 Download PDFInfo
- Publication number
- KR20110082476A KR20110082476A KR1020100135191A KR20100135191A KR20110082476A KR 20110082476 A KR20110082476 A KR 20110082476A KR 1020100135191 A KR1020100135191 A KR 1020100135191A KR 20100135191 A KR20100135191 A KR 20100135191A KR 20110082476 A KR20110082476 A KR 20110082476A
- Authority
- KR
- South Korea
- Prior art keywords
- objects
- container
- tunnels
- feeder
- amount
- Prior art date
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G51/00—Conveying articles through pipes or tubes by fluid flow or pressure; Conveying articles over a flat surface, e.g. the base of a trough, by jets located in the surface
- B65G51/02—Directly conveying the articles, e.g. slips, sheets, stockings, containers or workpieces, by flowing gases
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Fluid Mechanics (AREA)
- Mechanical Engineering (AREA)
- Sorting Of Articles (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29372810P | 2010-01-11 | 2010-01-11 | |
US61/293,728 | 2010-01-11 | ||
JP2010269949A JP5774296B2 (ja) | 2010-01-11 | 2010-12-03 | 物体の複数側面を画像化するようになされた画像システムへの物体の供給 |
JPJP-P-2010-269949 | 2010-12-03 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20110082476A true KR20110082476A (ko) | 2011-07-19 |
Family
ID=44456546
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020100135191A KR20110082476A (ko) | 2010-01-11 | 2010-12-27 | 대상체들의 다수의 측면을 이미지 촬영하도록 된 이미징 시스템에 대상체들을 제공하는 시스템 및 방법 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP5774296B2 (zh) |
KR (1) | KR20110082476A (zh) |
CN (1) | CN102183698B (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9645097B2 (en) | 2014-06-20 | 2017-05-09 | Kla-Tencor Corporation | In-line wafer edge inspection, wafer pre-alignment, and wafer cleaning |
US9885671B2 (en) | 2014-06-09 | 2018-02-06 | Kla-Tencor Corporation | Miniaturized imaging apparatus for wafer edge |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6085530U (ja) * | 1983-11-15 | 1985-06-12 | アジナ技研株式会社 | 球体の圧縮空気による搬送装置 |
JP2961510B2 (ja) * | 1995-05-23 | 1999-10-12 | 長野日本無線株式会社 | 部品供給装置 |
JPH11301850A (ja) * | 1998-04-20 | 1999-11-02 | Sony Corp | バルクフィーダ |
JPH11330782A (ja) * | 1998-05-13 | 1999-11-30 | Taiyo Yuden Co Ltd | 電子部品取込装置 |
JP2000183590A (ja) * | 1998-12-18 | 2000-06-30 | Sony Corp | 部品供給装置及びそれを備えた部品装着装置 |
JP3521401B2 (ja) * | 2000-10-30 | 2004-04-19 | 日本リトル株式会社 | 電子部品整列供給装置 |
CN2935142Y (zh) * | 2005-11-22 | 2007-08-15 | 清华大学 | 成像设备 |
CN200989990Y (zh) * | 2006-09-04 | 2007-12-12 | 万航 | X片传送装置 |
CN200996943Y (zh) * | 2006-10-09 | 2007-12-26 | 同方威视技术股份有限公司 | 一种货物检查设备 |
EP2011574A1 (en) * | 2007-07-02 | 2009-01-07 | STMicroelectronics (Research & Development) Limited | Assaying device and method of transporting a fluid in an assaying device |
-
2010
- 2010-12-03 JP JP2010269949A patent/JP5774296B2/ja not_active Expired - Fee Related
- 2010-12-27 KR KR1020100135191A patent/KR20110082476A/ko not_active Application Discontinuation
-
2011
- 2011-01-11 CN CN201110024571.5A patent/CN102183698B/zh not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9885671B2 (en) | 2014-06-09 | 2018-02-06 | Kla-Tencor Corporation | Miniaturized imaging apparatus for wafer edge |
US9645097B2 (en) | 2014-06-20 | 2017-05-09 | Kla-Tencor Corporation | In-line wafer edge inspection, wafer pre-alignment, and wafer cleaning |
Also Published As
Publication number | Publication date |
---|---|
JP5774296B2 (ja) | 2015-09-09 |
CN102183698B (zh) | 2015-04-01 |
JP2011140398A (ja) | 2011-07-21 |
CN102183698A (zh) | 2011-09-14 |
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