KR20110076875A - 열 전도성 젤 팩 - Google Patents

열 전도성 젤 팩 Download PDF

Info

Publication number
KR20110076875A
KR20110076875A KR1020117005512A KR20117005512A KR20110076875A KR 20110076875 A KR20110076875 A KR 20110076875A KR 1020117005512 A KR1020117005512 A KR 1020117005512A KR 20117005512 A KR20117005512 A KR 20117005512A KR 20110076875 A KR20110076875 A KR 20110076875A
Authority
KR
South Korea
Prior art keywords
gel
heat transfer
transfer surface
gel pack
thermal management
Prior art date
Application number
KR1020117005512A
Other languages
English (en)
Korean (ko)
Inventor
에오인 오리어던
필립 블레이델
게리 우드
마이클 에이치. 버니언
하리시 뤼티
Original Assignee
파커-한니핀 코포레이션
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 파커-한니핀 코포레이션 filed Critical 파커-한니핀 코포레이션
Publication of KR20110076875A publication Critical patent/KR20110076875A/ko

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20454—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff with a conformable or flexible structure compensating for irregularities, e.g. cushion bags, thermal paste
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Thermal Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
KR1020117005512A 2008-09-26 2009-09-24 열 전도성 젤 팩 KR20110076875A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10029708P 2008-09-26 2008-09-26
US61/100,297 2008-09-26

Publications (1)

Publication Number Publication Date
KR20110076875A true KR20110076875A (ko) 2011-07-06

Family

ID=41403006

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020117005512A KR20110076875A (ko) 2008-09-26 2009-09-24 열 전도성 젤 팩

Country Status (7)

Country Link
US (1) US20110308781A1 (zh)
EP (1) EP2329702A1 (zh)
JP (1) JP2012503890A (zh)
KR (1) KR20110076875A (zh)
CN (1) CN102150484A (zh)
TW (1) TWI457425B (zh)
WO (1) WO2010036784A1 (zh)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2699739T3 (es) 2010-09-10 2019-02-12 Medivance Inc Compresa médica de enfriamiento
US9622907B2 (en) 2010-09-10 2017-04-18 Medivance Incorporated Cooling medical pad
TW201241603A (en) 2011-04-08 2012-10-16 Asustek Comp Inc Motherboard
CN103188916A (zh) * 2011-12-30 2013-07-03 鸿富锦精密工业（深圳）有限公司 散热装置及带有该散热装置的电子设备
CN105007866B (zh) * 2013-01-29 2017-08-08 梅迪万斯股份有限公司 具有增加的水流通面积的混合医疗冷却垫
CN104640413A (zh) * 2013-11-08 2015-05-20 极致科技有限公司 软性热传递组件
US9615486B2 (en) * 2014-03-26 2017-04-04 General Electric Company Thermal interface devices
US10111363B2 (en) * 2014-12-04 2018-10-23 Microsoft Technology Licensing, Llc System for effectively transfering heat from electronic devices and method for forming the same
JP6787903B2 (ja) 2015-01-27 2020-11-18 メディヴァンス インコーポレイテッドＭｅｄｉｖａｎｃｅ，Ｉｎｃ． 熱療法用の改良された医療用パッド及びシステム
JP2016219599A (ja) 2015-05-20 2016-12-22 株式会社リコー 電子機器および熱拡散体
FR3042309B1 (fr) * 2015-10-09 2017-12-15 Commissariat Energie Atomique Structure dbc amelioree dotee d'un support integrant un materiau a changement de phase
US10791651B2 (en) 2016-05-31 2020-09-29 Carbice Corporation Carbon nanotube-based thermal interface materials and methods of making and using thereof
US10660208B2 (en) * 2016-07-13 2020-05-19 General Electric Company Embedded dry film battery module and method of manufacturing thereof
TWI755492B (zh) 2017-03-06 2022-02-21 美商卡爾拜斯有限公司 基於碳納米管的熱界面材料及其製造和使用方法
US10714829B2 (en) * 2017-05-09 2020-07-14 Ball Aerospace & Technologies Corp. Planar phased array antenna
JP6886698B2 (ja) * 2017-06-29 2021-06-16 北川工業株式会社 熱伝導液パック
AT521329B1 (de) * 2018-06-12 2020-03-15 Miba Ag Akkumulator
CN108777927B (zh) * 2018-06-26 2019-11-26 联想(北京)有限公司 一种散热装置、方法及电子设备
JP6825661B2 (ja) * 2019-08-26 2021-02-03 株式会社リコー 電子機器および熱拡散体
US10980152B1 (en) * 2019-11-11 2021-04-13 Seagate Technology Llc Thermal rectification with phase change materials
CN114539782A (zh) * 2022-01-18 2022-05-27 深圳先进电子材料国际创新研究院 一种降低接触热阻导热凝胶的方法及其应用

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4092697A (en) * 1976-12-06 1978-05-30 International Business Machines Corporation Heat transfer mechanism for integrated circuit package
JPS60500391A (ja) 1982-12-16 1985-03-22 ハスレル　エ−ジ− 熱伝導性のペ−スト又は液体が満たされた扁平なバッグ
US4852646A (en) * 1987-06-16 1989-08-01 Raychem Corporation Thermally conductive gel materials
US4997032A (en) * 1987-09-25 1991-03-05 Minnesota Mining And Manufacturing Company Thermal transfer bag
US5000256A (en) * 1990-07-20 1991-03-19 Minnesota Mining And Manufacturing Company Heat transfer bag with thermal via
US5485671A (en) * 1993-09-10 1996-01-23 Aavid Laboratories, Inc. Method of making a two-phase thermal bag component cooler
US5640303A (en) 1995-10-30 1997-06-17 Precision Connector Designs, Inc. Interconnection apparatus for semiconductor/integrated circuit devices
EP0956590A1 (en) 1996-04-29 1999-11-17 Parker-Hannifin Corporation Conformal thermal interface material for electronic components
JPH11177264A (ja) * 1997-12-16 1999-07-02 Pfu Ltd 携帯型電子機器の収納ケース
US5966288A (en) * 1998-05-22 1999-10-12 Northern Telecom Limited Assemblies of electronic devices and flexible containers thereof
US20020086600A1 (en) * 2000-12-29 2002-07-04 Prosenjit Ghosh Thermal interface medium
JP3712943B2 (ja) * 2001-02-08 2005-11-02 富士高分子工業株式会社 熱軟化放熱シート及びこれを用いた放熱シート
JP3536824B2 (ja) * 2001-03-30 2004-06-14 ミノルタ株式会社 基板の放熱構造
JP3938681B2 (ja) * 2001-11-21 2007-06-27 信越化学工業株式会社 放熱構造体
US6597575B1 (en) * 2002-01-04 2003-07-22 Intel Corporation Electronic packages having good reliability comprising low modulus thermal interface materials
US7208192B2 (en) 2002-05-31 2007-04-24 Parker-Hannifin Corporation Thermally or electrically-conductive form-in-place gap filter
JP2004363568A (ja) * 2003-05-09 2004-12-24 Matsushita Electric Ind Co Ltd 回路素子内蔵モジュール
US7063127B2 (en) * 2003-09-18 2006-06-20 International Business Machines Corporation Method and apparatus for chip-cooling
JP2005273592A (ja) * 2004-03-26 2005-10-06 Nippon Densan Corp 遠心ファン
KR20060021707A (ko) * 2004-09-03 2006-03-08 엘지전자 주식회사 플라즈마 디스플레이 패널용 티씨피의 히트 싱크 어셈블리장치
US7280355B2 (en) * 2005-05-11 2007-10-09 Taylor Paul G Apparatus for use with laptop computer
US20070051773A1 (en) * 2005-09-02 2007-03-08 Ruchert Brian D Thermal interface materials, methods of preparation thereof and their applications
TWI270187B (en) * 2005-12-19 2007-01-01 Polytronics Technology Corp Thermal conductive apparatus and manufacturing method thereof
US7551439B2 (en) * 2006-03-28 2009-06-23 Delphi Technologies, Inc. Fluid cooled electronic assembly
WO2008053843A1 (en) * 2006-11-01 2008-05-08 Hitachi Chemical Co., Ltd. Heat conducting sheet, process for producing the same, and radiator utilizing the sheet
JPWO2008075574A1 (ja) * 2006-12-19 2010-04-08 日立化成工業株式会社 放熱材
US8448693B2 (en) * 2007-02-08 2013-05-28 Lundell Manufacturing Corporation Sealed thermal interface component

Also Published As

Publication number Publication date
TW201026834A (en) 2010-07-16
JP2012503890A (ja) 2012-02-09
US20110308781A1 (en) 2011-12-22
TWI457425B (zh) 2014-10-21
CN102150484A (zh) 2011-08-10
WO2010036784A1 (en) 2010-04-01
EP2329702A1 (en) 2011-06-08

Similar Documents

Publication Publication Date Title
KR20110076875A (ko) 열 전도성 젤 팩
US7208192B2 (en) Thermally or electrically-conductive form-in-place gap filter
US11610831B2 (en) Methods for establishing thermal joints between heat spreaders or lids and heat sources
US8119191B2 (en) Dispensable cured resin
CA2770719C (en) Fully-cured thermally or electrically-conductive form-in-place gap filler
US20160315030A1 (en) Reusable thermoplastic thermal interface materials and methods for establishing thermal joints between heat sources and heat dissipating/removal structures
US20150334871A1 (en) Thermal interface materials with thin film sealants
US8837151B2 (en) Memory modules including compliant multilayered thermally-conductive interface assemblies
US20150301568A1 (en) Thermal Solutions and Methods for Dissipating Heat from Electronic Devices Using the Same Side of an Anisotropic Heat Spreader
MX2011008921A (es) Producto de espuma termicamente conductor.
US20100321897A1 (en) Compliant multilayered thermally-conductive interface assemblies
KR101367040B1 (ko) 분배성 경화 수지
JPH10308485A (ja) 複合熱インターフェース用アセンブリ
CN213401173U (zh) 热界面材料件和包括热界面材料件的电子装置
CN214012524U (zh) 导电导热垫圈、电装置
TW202223925A (zh) 導電導熱墊圈
JP3191158U (ja) 熱伝導性ゲルパック
US20190221495A1 (en) Method and Apparatus of Operating a Compressible Thermal Interface
JP2001523047A (ja) 非導電性熱放散器構成要素
CN114628055A (zh) 导电导热垫圈、制造导电导热垫圈的方法、电装置
CN102985510B (zh) 完全固化的热或电-传导性原地形成间隙填料
Chung Ball-grid-array package thermal management

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E601 Decision to refuse application