KR20110039372A - 전기·전자부품용 동합금재 - Google Patents

전기·전자부품용 동합금재 Download PDF

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Publication number
KR20110039372A
KR20110039372A KR1020117004941A KR20117004941A KR20110039372A KR 20110039372 A KR20110039372 A KR 20110039372A KR 1020117004941 A KR1020117004941 A KR 1020117004941A KR 20117004941 A KR20117004941 A KR 20117004941A KR 20110039372 A KR20110039372 A KR 20110039372A
Authority
KR
South Korea
Prior art keywords
copper alloy
alloy material
bending
mass
ratio
Prior art date
Application number
KR1020117004941A
Other languages
English (en)
Korean (ko)
Inventor
료스케 마쓰오
구니테루 미하라
다쓰히코 에구치
Original Assignee
후루카와 덴키 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 후루카와 덴키 고교 가부시키가이샤 filed Critical 후루카와 덴키 고교 가부시키가이샤
Publication of KR20110039372A publication Critical patent/KR20110039372A/ko

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Conductive Materials (AREA)
KR1020117004941A 2008-08-05 2009-07-30 전기·전자부품용 동합금재 KR20110039372A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2008-202469 2008-08-05
JP2008202469 2008-08-05

Publications (1)

Publication Number Publication Date
KR20110039372A true KR20110039372A (ko) 2011-04-15

Family

ID=41663648

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020117004941A KR20110039372A (ko) 2008-08-05 2009-07-30 전기·전자부품용 동합금재

Country Status (6)

Country Link
US (1) US20110200480A1 (de)
EP (1) EP2333127A4 (de)
JP (1) JPWO2010016428A1 (de)
KR (1) KR20110039372A (de)
CN (1) CN102112641B (de)
WO (1) WO2010016428A1 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102005332B1 (ko) * 2019-04-09 2019-10-01 주식회사 풍산 굽힘가공성이 우수한 Cu-Co-Si-Fe-P계 구리 합금 및 그 제조 방법

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4830035B2 (ja) 2010-04-14 2011-12-07 Ｊｘ日鉱日石金属株式会社 電子材料用Ｃｕ−Ｓｉ−Ｃｏ系合金及びその製造方法
JP4672804B1 (ja) 2010-05-31 2011-04-20 Ｊｘ日鉱日石金属株式会社 電子材料用Ｃｕ−Ｃｏ−Ｓｉ系銅合金及びその製造方法
JP4708497B1 (ja) * 2010-06-03 2011-06-22 Ｊｘ日鉱日石金属株式会社 Ｃｕ−Ｃｏ−Ｓｉ系合金板及びその製造方法
JP4834781B1 (ja) * 2010-08-24 2011-12-14 Ｊｘ日鉱日石金属株式会社 電子材料用Ｃｕ−Ｃｏ−Ｓｉ系合金
JP5508326B2 (ja) * 2011-03-24 2014-05-28 Ｊｘ日鉱日石金属株式会社 Ｃｏ−Ｓｉ系銅合金板
JP4831552B1 (ja) * 2011-03-28 2011-12-07 Ｊｘ日鉱日石金属株式会社 Ｃｏ−Ｓｉ系銅合金板
JP6205105B2 (ja) * 2011-04-18 2017-09-27 Ｊｘ金属株式会社 電子材料用Ｃｕ−Ｎｉ−Ｓｉ系合金、Ｃｕ−Ｃｏ−Ｓｉ系合金及びその製造方法
JP5802150B2 (ja) * 2012-02-24 2015-10-28 株式会社神戸製鋼所 銅合金
US10002684B2 (en) * 2012-07-26 2018-06-19 Ngk Insulators, Ltd. Copper alloy and method for manufacturing the same
CN110205570B (zh) * 2019-04-15 2021-01-01 丰山(连云港)新材料有限公司 一种电气电子部件用铜合金的热处理方法
CN110415895A (zh) * 2019-08-16 2019-11-05 仙桃科利科技发展有限公司 一种高传输率抗老化数据线的制作工艺

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63307232A (ja) * 1987-06-04 1988-12-14 Sumitomo Metal Mining Co Ltd 銅合金
JPH02277735A (ja) * 1989-04-20 1990-11-14 Sumitomo Metal Mining Co Ltd リードフレーム用銅合金
JP3408021B2 (ja) * 1995-06-30 2003-05-19 古河電気工業株式会社 電子電気部品用銅合金およびその製造方法
JP3510469B2 (ja) * 1998-01-30 2004-03-29 古河電気工業株式会社 導電性ばね用銅合金及びその製造方法
JP3739214B2 (ja) * 1998-03-26 2006-01-25 株式会社神戸製鋼所 電子部品用銅合金板
JP2000087158A (ja) * 1998-09-11 2000-03-28 Furukawa Electric Co Ltd:The 半導体リードフレーム用銅合金
JP3754011B2 (ja) * 2002-09-04 2006-03-08 デプト株式会社 電子部品用金属材料、電子部品、電子機器、金属材料の加工方法、電子部品の製造方法及び電子光学部品
EP1873267B1 (de) * 2005-03-24 2014-07-02 JX Nippon Mining & Metals Corporation Kupferlegierung für elektronikmaterial
JP4068626B2 (ja) * 2005-03-31 2008-03-26 日鉱金属株式会社 電子材料用Ｃｕ−Ｎｉ−Ｓｉ−Ｃｏ−Ｃｒ系銅合金及びその製造方法
JP2007169764A (ja) * 2005-12-26 2007-07-05 Furukawa Electric Co Ltd:The 銅合金
JP5355865B2 (ja) * 2006-06-01 2013-11-27 古河電気工業株式会社 銅合金線材の製造方法および銅合金線材
JP4943095B2 (ja) * 2006-08-30 2012-05-30 三菱電機株式会社 銅合金及びその製造方法
JP5085908B2 (ja) * 2006-10-03 2012-11-28 Ｊｘ日鉱日石金属株式会社 電子材料用銅合金及びその製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102005332B1 (ko) * 2019-04-09 2019-10-01 주식회사 풍산 굽힘가공성이 우수한 Cu-Co-Si-Fe-P계 구리 합금 및 그 제조 방법
WO2020209485A1 (ko) * 2019-04-09 2020-10-15 주식회사 풍산 굽힘가공성이 우수한 cu-co-si-fe-p계 구리합금 및 그 제조 방법

Also Published As

Publication number Publication date
CN102112641A (zh) 2011-06-29
EP2333127A1 (de) 2011-06-15
CN102112641B (zh) 2013-03-27
JPWO2010016428A1 (ja) 2012-01-19
US20110200480A1 (en) 2011-08-18
EP2333127A4 (de) 2012-07-04
WO2010016428A1 (ja) 2010-02-11

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E902 Notification of reason for refusal
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Free format text: TRIAL NUMBER: 2015101005730; TRIAL DECISION FOR APPEAL AGAINST DECISION TO DECLINE REFUSAL REQUESTED 20150930

Effective date: 20171030