WO2010016428A1 - 電気・電子部品用銅合金材 - Google Patents
電気・電子部品用銅合金材 Download PDFInfo
- Publication number
- WO2010016428A1 WO2010016428A1 PCT/JP2009/063614 JP2009063614W WO2010016428A1 WO 2010016428 A1 WO2010016428 A1 WO 2010016428A1 JP 2009063614 W JP2009063614 W JP 2009063614W WO 2010016428 A1 WO2010016428 A1 WO 2010016428A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- copper alloy
- bending
- alloy material
- mass
- ratio
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
- H01B1/026—Alloys based on copper
Definitions
- the present invention relates to a copper alloy material for electric / electronic parts.
- parts for electrical and electronic devices include brass (C26000), phosphor bronze (C51910, C52120, C52100) and beryllium copper (C17200, C17530), Corson copper alloy (C70250) has been used.
- Cxxxx is a type of copper alloy defined by CDA (Copper Development Association).
- CDA Copper Development Association
- Corson-type copper alloy has high conductivity, but Cu—Co— added with Co and Si as a copper alloy that has both conductivity higher than the conventional Corson-type copper alloy and high tensile strength and bending resistance.
- Si-based alloys have been studied (for example, Patent Documents 1 and 2).
- An object of the present invention is to provide a copper alloy material for electric / electronic parts that has high conductivity and high tensile strength and is excellent in bending resistance.
- a copper alloy material containing a predetermined amount of Co and Si, having a mass ratio of Co and Si within a predetermined range, and having a crystal grain size within the predetermined range is highly conductive. And high tensile strength, it has been found to pass a strict bending test. The present invention has been made based on this finding.
- Co is contained in an amount of 0.7 to 2.5% by mass
- Si is contained in a mass ratio of Co to Si (Co / Si ratio) in the range of 3.5 to 4.0
- the balance is Cu
- a copper alloy material for electric and electronic parts characterized by comprising inevitable impurities and having a crystal grain size of 3 to 15 ⁇ m
- the mass ratio ((Co + X) / Si ratio) of Si to the total mass of at least one selected from the group consisting of Cr, Ni, Fe, Zr and Ti and Co with respect to Si is 3.5 or more.
- a copper alloy material for electrical and electronic parts which is contained within a range of 4.0 or less and has a crystal grain size of 3 to 15 ⁇ m.
- the “copper alloy material” means a composition obtained by processing a composition as a copper alloy into a predetermined shape (for example, a plate, a strip, a foil, a bar, a wire, etc.).
- a predetermined shape for example, a plate, a strip, a foil, a bar, a wire, etc.
- a preferable specific example of the copper alloy material will be described with a plate material and a strip material, but the shape of the copper alloy material is not limited to the plate material and the strip material.
- the first copper alloy material for electric / electronic parts of the present invention will be described.
- Co and Si are essential components.
- Co and Si in the copper alloy mainly form precipitates of Co 2 Si intermetallic compounds. By setting the ratio of this precipitate within a specific range, it is possible to provide a copper alloy material for electric / electronic parts having high tensile strength and electrical conductivity.
- Co is 0.7 to 2.5% by mass, preferably 0.8 to 2.2% by mass, more preferably 0.9 to 1.7% by mass. is there. By setting it within this range, a copper alloy material for electric and electronic parts having high tensile strength and electrical conductivity can be obtained.
- the amount of Co is too small, the precipitate of Co 2 Si intermetallic compound decreases, and a copper alloy material for electric / electronic parts with high tensile strength and electrical conductivity cannot be obtained. If the amount of Co is too large, the effect is saturated.
- Si it is preferable to add an amount corresponding to Co so as to maintain the stoichiometric ratio of the Co 2 Si intermetallic compound.
- the amount of Si is not appropriate, it is the same as when the amount of Co is not appropriate. That is, if the amount of Si is too small, the precipitate of the Co 2 Si intermetallic compound decreases, and a copper alloy material for electric / electronic parts with high tensile strength and electrical conductivity cannot be obtained. If the amount of Si is too large, the effect is saturated.
- the optimum mass ratio of Co to Si is Co / Si ⁇ 4.2.
- Co to Si The mass ratio (Co / Si) is set in the range of 3.5 or more and 4.0 or less.
- the value of Co / Si is in the range of 3.70 to 3.95 in terms of mass ratio.
- the mass ratio of Co to Si (Co / Si ratio) is too small, Si becomes excessive, so that part of Si that does not form an intermetallic compound with Co is dissolved, resulting in a low electrical conductivity. If the mass ratio of Co to Si (Co / Si ratio) is too large, Co becomes excessive, so that a part of Co that does not form an intermetallic compound with Si is dissolved and the conductivity is lowered.
- the amount of Co and the amount of Si exceed a predetermined amount, an alloy material cannot be obtained unless the solution temperature is increased. Therefore, at a temperature higher than the usual solution temperature (about 1000 ° C.). When heat treatment is performed, problems such as inability to maintain the product shape occur.
- Si is determined so that the mass ratio of Co to Si (Co / Si) is in the range of 3.5 or more and 4.0 or less. Si is preferably 0.2 to 0.7% by mass.
- Co is 0.7 to 2.5% by mass, and at least one selected from the group consisting of Cr, Ni, Fe, Zr, Ti, Al, Sn, Mg and Zn is 0. Si in the total mass of at least one (X) selected from the group consisting of Cr, Ni, Fe, Zr, and Ti and Co containing 0.01 to 0.15% by mass, the balance being Cu and inevitable impurities
- X selected from the group consisting of Cr, Ni, Fe, Zr, and Ti and Co containing 0.01 to 0.15% by mass, the balance being Cu and inevitable impurities
- the mass ratio ((Co + X) / Si ratio) is within the range of 3.5 or more and 4.0 or less.
- the addition amount of at least one selected from the group consisting of Cr, Ni, Fe, Zr, Ti, Al, Sn, Mg and Zn is preferably 0.05 to 0.15% by mass.
- the addition amount is too small, the effect of the addition is small, and when the addition amount is too large, the strength is lowered and the conductivity is lowered by the solid solution of the added element.
- At least one (X) selected from the group consisting of Cr, Ni, Fe, Zr and Ti is substituted for a part of Co to form a (Co, X) 2 Si compound and to improve the strength. .
- Al, Sn, Mg, and Zn are characterized by solid solution in the copper matrix and strengthening.
- the alloy material is strengthened and the stress relaxation resistance is improved.
- the stress relaxation resistance is synergistically improved.
- the addition ratio of Sn and Mg is Sn / Mg ⁇ 1, the stress relaxation characteristics are further improved.
- the value of (Co + X) / Si ratio is in the range of 3.70 to 3.95 in terms of mass ratio.
- the mass ratio of Si to the total mass of at least one (X) selected from the group consisting of Cr, Ni, Fe, Zr and Ti and Co (( The amount of Si is determined so that the (Co + X) / Si ratio) is in the range of 3.5 to 4.0, but Si is preferably 0.2 to 0.7 mass%.
- the copper alloy for electric / electronic parts is not impaired. A material can be obtained.
- the crystal grain size is 3 to 15 ⁇ m.
- the crystal grain size refers to a value measured by JIS H 0501 (cutting method). By setting the crystal grain size within the range of 3 to 15 ⁇ m, it is possible to obtain a copper alloy material for electric / electronic parts having excellent bending resistance. When the crystal grain size is less than 3 ⁇ m, the remaining of the processed structure is confirmed, which adversely affects the bending resistance. On the other hand, when the grain size is larger than 15 ⁇ m, bending and cracking at the crystal grain boundaries become remarkable, resulting in a decrease in bending resistance.
- the crystal grain size is preferably 4 to 10 ⁇ m.
- the range of heat treatment conditions and rolling conditions in each step up to the final recrystallization heat treatment where the blending amount of elements such as Co and Si is within a specific range. Is within a specific range, or the heat history management conditions (temperature increase rate, holding temperature and time) of the recrystallization heat treatment are within a specific range.
- the recrystallization treatment temperature is preferably in the range of 850 to 900 ° C.
- the amount of Co added is 1.0 to 2.5% by mass.
- the recrystallization treatment temperature is preferably in the range of 900 to 1025 ° C.
- the upper limit temperature is more preferably 1000 ° C.
- the preferable manufacturing method of the copper alloy material of this invention is the following aspects, for example.
- the outline of the main manufacturing method of the copper alloy material of the present invention is as follows: melting ⁇ casting ⁇ hot rolling ⁇ facing ⁇ cold rolling ⁇ solution recrystallization heat treatment ⁇ rapid cooling ⁇ aging heat treatment ⁇ final cold rolling ⁇ low temperature annealing. is there. Aging heat treatment and final cold rolling may be performed in reverse order. The final low-temperature annealing may be omitted.
- recrystallization heat treatment After that, for the purpose of solution and recrystallization, recrystallization heat treatment is performed for a certain time (here 30 seconds) in a salt bath (salt bath furnace) maintained at a temperature of 800 to 1025 ° C., and quenching is performed by water cooling. Do.
- the temperature rise rate is adjusted by sandwiching the sample between stainless steel plates having different thicknesses.
- a preferable temperature increase rate at this time is 10 to 300 K / sec at a temperature of 300 ° C. or higher.
- a preferable cooling rate is 30 to 200 K / sec.
- ⁇ Aging heat treatment> Next, an aging heat treatment is performed at a temperature of 400 to 600 ° C. for 30 to 300 minutes for the purpose of aging precipitation. At that time, the rate of temperature rise from room temperature to the maximum temperature is in the range of 3 to 25 K / min. When the temperature is lowered, the temperature rises to 300 ° C, which is sufficiently lower than the temperature range considered to affect precipitation.
- R / t means the result of a W-bending test at a bending angle of 90 ° in accordance with the Japan Copper and Brass Association technical standard “Evaluation method for bending workability of copper and copper alloy sheet strip (JBMA T307)”. To do.
- the plate material cut in the vertical direction of rolling is subjected to a bending test under the condition of a predetermined bending radius (R), and the limit R at which the crack does not occur at the apex is obtained, and the plate thickness (t) at that time is specified.
- R a predetermined bending radius
- t the plate thickness
- R / t can be obtained.
- the copper alloy material of the present invention is excellent in conductivity and tensile strength, and can pass a bending test under severe conditions.
- recrystallization heat treatment was performed at a temperature of 870 to 1000 ° C.
- the recrystallization heat treatment was performed by increasing the temperature as the amount of Co added was increased. Specifically, when the addition amount of Co is 0.9% by mass, 870 ° C., when the addition amount of Co is 1.2% by mass, 915 ° C., and when the addition amount of Co is 1.4% by mass, 940 ° C., 965 ° C. when Co addition amount is 1.65% by mass, 980 ° C. when Co addition amount is 1.9% by mass, 1000 ° C. when Co addition amount is 2.4% by mass It was. Note that when an additive other than Co and Si was included (Alloy Nos.
- GW bending bending
- BW bending bending perpendicular to the rolling direction
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Conductive Materials (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200980130454.8A CN102112641B (zh) | 2008-08-05 | 2009-07-30 | 用于电气/电子部件的铜合金材料 |
JP2010523839A JPWO2010016428A1 (ja) | 2008-08-05 | 2009-07-30 | 電気・電子部品用銅合金材 |
EP09804912A EP2333127A4 (de) | 2008-08-05 | 2009-07-30 | Kupferlegierungsmaterial für elektrische und elektronische bauteile |
US13/021,444 US20110200480A1 (en) | 2008-08-05 | 2011-02-04 | Copper alloy material for electric/electronic parts |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008-202469 | 2008-08-05 | ||
JP2008202469 | 2008-08-05 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/021,444 Continuation US20110200480A1 (en) | 2008-08-05 | 2011-02-04 | Copper alloy material for electric/electronic parts |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2010016428A1 true WO2010016428A1 (ja) | 2010-02-11 |
Family
ID=41663648
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2009/063614 WO2010016428A1 (ja) | 2008-08-05 | 2009-07-30 | 電気・電子部品用銅合金材 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20110200480A1 (de) |
EP (1) | EP2333127A4 (de) |
JP (1) | JPWO2010016428A1 (de) |
KR (1) | KR20110039372A (de) |
CN (1) | CN102112641B (de) |
WO (1) | WO2010016428A1 (de) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011152104A1 (ja) * | 2010-06-03 | 2011-12-08 | Jx日鉱日石金属株式会社 | Cu-Co-Si系合金板及びその製造方法 |
WO2012026488A1 (ja) | 2010-08-24 | 2012-03-01 | Jx日鉱日石金属株式会社 | 電子材料用Cu-Co-Si系合金 |
JP2012201905A (ja) * | 2011-03-24 | 2012-10-22 | Jx Nippon Mining & Metals Corp | Co−Si系銅合金板 |
JP2012224898A (ja) * | 2011-04-18 | 2012-11-15 | Jx Nippon Mining & Metals Corp | 電子材料用Cu−Ni−Si系合金、Cu−Co−Si系合金及びその製造方法 |
TWI450985B (zh) * | 2011-03-28 | 2014-09-01 | Jx Nippon Mining & Metals Corp | Co-Si copper alloy plate |
CN104583430A (zh) * | 2012-07-26 | 2015-04-29 | 三菱电机株式会社 | 铜合金及其制造方法 |
US9460825B2 (en) | 2010-05-31 | 2016-10-04 | Jx Nippon Mining & Metals Corporation | Cu-Co-Si-based copper alloy for electronic materials, and method of manufacturing same |
US9499885B2 (en) | 2010-04-14 | 2016-11-22 | Jx Nippon Mining & Metals Corporation | Cu—Si—Co alloy for electronic materials, and method for producing same |
CN110415895A (zh) * | 2019-08-16 | 2019-11-05 | 仙桃科利科技发展有限公司 | 一种高传输率抗老化数据线的制作工艺 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
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JP5802150B2 (ja) * | 2012-02-24 | 2015-10-28 | 株式会社神戸製鋼所 | 銅合金 |
KR102005332B1 (ko) * | 2019-04-09 | 2019-10-01 | 주식회사 풍산 | 굽힘가공성이 우수한 Cu-Co-Si-Fe-P계 구리 합금 및 그 제조 방법 |
CN110205570B (zh) * | 2019-04-15 | 2021-01-01 | 丰山(连云港)新材料有限公司 | 一种电气电子部件用铜合金的热处理方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS63307232A (ja) * | 1987-06-04 | 1988-12-14 | Sumitomo Metal Mining Co Ltd | 銅合金 |
JPH02277735A (ja) * | 1989-04-20 | 1990-11-14 | Sumitomo Metal Mining Co Ltd | リードフレーム用銅合金 |
JP2000087158A (ja) * | 1998-09-11 | 2000-03-28 | Furukawa Electric Co Ltd:The | 半導体リードフレーム用銅合金 |
JP2007169764A (ja) * | 2005-12-26 | 2007-07-05 | Furukawa Electric Co Ltd:The | 銅合金 |
JP2008056977A (ja) * | 2006-08-30 | 2008-03-13 | Mitsubishi Electric Corp | 銅合金及びその製造方法 |
JP2008088512A (ja) | 2006-10-03 | 2008-04-17 | Nikko Kinzoku Kk | 電子材料用銅合金の製造方法 |
Family Cites Families (7)
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JP3408021B2 (ja) * | 1995-06-30 | 2003-05-19 | 古河電気工業株式会社 | 電子電気部品用銅合金およびその製造方法 |
JP3510469B2 (ja) * | 1998-01-30 | 2004-03-29 | 古河電気工業株式会社 | 導電性ばね用銅合金及びその製造方法 |
JP3739214B2 (ja) * | 1998-03-26 | 2006-01-25 | 株式会社神戸製鋼所 | 電子部品用銅合金板 |
JP3754011B2 (ja) * | 2002-09-04 | 2006-03-08 | デプト株式会社 | 電子部品用金属材料、電子部品、電子機器、金属材料の加工方法、電子部品の製造方法及び電子光学部品 |
EP1873267B1 (de) * | 2005-03-24 | 2014-07-02 | JX Nippon Mining & Metals Corporation | Kupferlegierung für elektronikmaterial |
JP4068626B2 (ja) * | 2005-03-31 | 2008-03-26 | 日鉱金属株式会社 | 電子材料用Cu−Ni−Si−Co−Cr系銅合金及びその製造方法 |
JP5355865B2 (ja) * | 2006-06-01 | 2013-11-27 | 古河電気工業株式会社 | 銅合金線材の製造方法および銅合金線材 |
-
2009
- 2009-07-30 KR KR1020117004941A patent/KR20110039372A/ko not_active Application Discontinuation
- 2009-07-30 JP JP2010523839A patent/JPWO2010016428A1/ja active Pending
- 2009-07-30 WO PCT/JP2009/063614 patent/WO2010016428A1/ja active Application Filing
- 2009-07-30 EP EP09804912A patent/EP2333127A4/de not_active Withdrawn
- 2009-07-30 CN CN200980130454.8A patent/CN102112641B/zh active Active
-
2011
- 2011-02-04 US US13/021,444 patent/US20110200480A1/en not_active Abandoned
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS63307232A (ja) * | 1987-06-04 | 1988-12-14 | Sumitomo Metal Mining Co Ltd | 銅合金 |
JPH02277735A (ja) * | 1989-04-20 | 1990-11-14 | Sumitomo Metal Mining Co Ltd | リードフレーム用銅合金 |
JP2000087158A (ja) * | 1998-09-11 | 2000-03-28 | Furukawa Electric Co Ltd:The | 半導体リードフレーム用銅合金 |
JP2007169764A (ja) * | 2005-12-26 | 2007-07-05 | Furukawa Electric Co Ltd:The | 銅合金 |
JP2008056977A (ja) * | 2006-08-30 | 2008-03-13 | Mitsubishi Electric Corp | 銅合金及びその製造方法 |
JP2008088512A (ja) | 2006-10-03 | 2008-04-17 | Nikko Kinzoku Kk | 電子材料用銅合金の製造方法 |
Non-Patent Citations (1)
Title |
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See also references of EP2333127A4 |
Cited By (17)
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---|---|---|---|---|
US9499885B2 (en) | 2010-04-14 | 2016-11-22 | Jx Nippon Mining & Metals Corporation | Cu—Si—Co alloy for electronic materials, and method for producing same |
US9460825B2 (en) | 2010-05-31 | 2016-10-04 | Jx Nippon Mining & Metals Corporation | Cu-Co-Si-based copper alloy for electronic materials, and method of manufacturing same |
EP2578708A1 (de) * | 2010-06-03 | 2013-04-10 | JX Nippon Mining & Metals Corporation | Legierungsfolie auf cu-co-si-basis sowie herstellungsverfahren dafür |
WO2011152104A1 (ja) * | 2010-06-03 | 2011-12-08 | Jx日鉱日石金属株式会社 | Cu-Co-Si系合金板及びその製造方法 |
EP2578708A4 (de) * | 2010-06-03 | 2014-04-09 | Jx Nippon Mining & Metals Corp | Legierungsfolie auf cu-co-si-basis sowie herstellungsverfahren dafür |
CN103052728B (zh) * | 2010-08-24 | 2015-07-08 | Jx日矿日石金属株式会社 | 电子材料用Cu-Co-Si系合金 |
CN103052728A (zh) * | 2010-08-24 | 2013-04-17 | Jx日矿日石金属株式会社 | 电子材料用Cu-Co-Si系合金 |
EP2607508A1 (de) * | 2010-08-24 | 2013-06-26 | JX Nippon Mining & Metals Corporation | Kupfer-kobalt-silicium-legierung für ein elektrodenmaterial |
EP2607508A4 (de) * | 2010-08-24 | 2014-04-09 | Jx Nippon Mining & Metals Corp | Kupfer-kobalt-silicium-legierung für ein elektrodenmaterial |
JP2012046774A (ja) * | 2010-08-24 | 2012-03-08 | Jx Nippon Mining & Metals Corp | 電子材料用Cu−Co−Si系合金 |
WO2012026488A1 (ja) | 2010-08-24 | 2012-03-01 | Jx日鉱日石金属株式会社 | 電子材料用Cu-Co-Si系合金 |
US10056166B2 (en) | 2010-08-24 | 2018-08-21 | Jx Nippon Mining & Metals Corporation | Copper-cobalt-silicon alloy for electrode material |
JP2012201905A (ja) * | 2011-03-24 | 2012-10-22 | Jx Nippon Mining & Metals Corp | Co−Si系銅合金板 |
TWI450985B (zh) * | 2011-03-28 | 2014-09-01 | Jx Nippon Mining & Metals Corp | Co-Si copper alloy plate |
JP2012224898A (ja) * | 2011-04-18 | 2012-11-15 | Jx Nippon Mining & Metals Corp | 電子材料用Cu−Ni−Si系合金、Cu−Co−Si系合金及びその製造方法 |
CN104583430A (zh) * | 2012-07-26 | 2015-04-29 | 三菱电机株式会社 | 铜合金及其制造方法 |
CN110415895A (zh) * | 2019-08-16 | 2019-11-05 | 仙桃科利科技发展有限公司 | 一种高传输率抗老化数据线的制作工艺 |
Also Published As
Publication number | Publication date |
---|---|
CN102112641A (zh) | 2011-06-29 |
EP2333127A1 (de) | 2011-06-15 |
CN102112641B (zh) | 2013-03-27 |
JPWO2010016428A1 (ja) | 2012-01-19 |
US20110200480A1 (en) | 2011-08-18 |
EP2333127A4 (de) | 2012-07-04 |
KR20110039372A (ko) | 2011-04-15 |
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