EP2578708A4 - Legierungsfolie auf cu-co-si-basis sowie herstellungsverfahren dafür - Google Patents
Legierungsfolie auf cu-co-si-basis sowie herstellungsverfahren dafürInfo
- Publication number
- EP2578708A4 EP2578708A4 EP11789514.4A EP11789514A EP2578708A4 EP 2578708 A4 EP2578708 A4 EP 2578708A4 EP 11789514 A EP11789514 A EP 11789514A EP 2578708 A4 EP2578708 A4 EP 2578708A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- production
- based alloy
- alloy sheet
- sheet
- alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
- H01B1/026—Alloys based on copper
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010127943A JP4708497B1 (ja) | 2010-06-03 | 2010-06-03 | Cu−Co−Si系合金板及びその製造方法 |
PCT/JP2011/057216 WO2011152104A1 (ja) | 2010-06-03 | 2011-03-24 | Cu-Co-Si系合金板及びその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
EP2578708A1 EP2578708A1 (de) | 2013-04-10 |
EP2578708A4 true EP2578708A4 (de) | 2014-04-09 |
Family
ID=44292620
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP11789514.4A Withdrawn EP2578708A4 (de) | 2010-06-03 | 2011-03-24 | Legierungsfolie auf cu-co-si-basis sowie herstellungsverfahren dafür |
Country Status (6)
Country | Link |
---|---|
US (1) | US20130092297A1 (de) |
EP (1) | EP2578708A4 (de) |
JP (1) | JP4708497B1 (de) |
CN (1) | CN102666890B (de) |
TW (1) | TWI422693B (de) |
WO (1) | WO2011152104A1 (de) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5437519B1 (ja) | 2013-07-31 | 2014-03-12 | Jx日鉱日石金属株式会社 | Cu−Co−Si系銅合金条及びその製造方法 |
JP5437520B1 (ja) * | 2013-07-31 | 2014-03-12 | Jx日鉱日石金属株式会社 | Cu−Co−Si系銅合金条及びその製造方法 |
JP6294037B2 (ja) * | 2013-09-18 | 2018-03-14 | 株式会社Maruwa | 複合型ノイズフィルタ |
CN106414811B (zh) * | 2014-05-30 | 2019-05-28 | 古河电气工业株式会社 | 电触点材料、电触点材料的制造方法和端子 |
JP6306632B2 (ja) | 2016-03-31 | 2018-04-04 | Jx金属株式会社 | 電子材料用銅合金 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009096546A1 (ja) * | 2008-01-31 | 2009-08-06 | The Furukawa Electric Co., Ltd. | 電気電子部品用銅合金材およびその製造方法 |
JP2009242932A (ja) * | 2008-03-31 | 2009-10-22 | Nippon Mining & Metals Co Ltd | 電子材料用Cu−Ni−Si−Co系銅合金及びその製造方法 |
WO2010013790A1 (ja) * | 2008-07-31 | 2010-02-04 | 古河電気工業株式会社 | 電気電子部品用銅合金材料とその製造方法 |
WO2010016428A1 (ja) * | 2008-08-05 | 2010-02-11 | 古河電気工業株式会社 | 電気・電子部品用銅合金材 |
JP2010059543A (ja) * | 2008-08-05 | 2010-03-18 | Furukawa Electric Co Ltd:The | 銅合金材料 |
EP2386665A1 (de) * | 2008-12-12 | 2011-11-16 | JX Nippon Mining & Metals Corporation | Ni-Si-Co-KUPFERLEGIERUNG UND HERSTELLUNGSVERFAHREN DAFÜR |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7182823B2 (en) | 2002-07-05 | 2007-02-27 | Olin Corporation | Copper alloy containing cobalt, nickel and silicon |
CN100439530C (zh) * | 2004-12-24 | 2008-12-03 | 株式会社神户制钢所 | 具有弯曲性和应力弛豫性能的铜合金 |
EP1873267B1 (de) * | 2005-03-24 | 2014-07-02 | JX Nippon Mining & Metals Corporation | Kupferlegierung für elektronikmaterial |
JP2007169765A (ja) | 2005-12-26 | 2007-07-05 | Furukawa Electric Co Ltd:The | 銅合金とその製造方法 |
JP5085908B2 (ja) * | 2006-10-03 | 2012-11-28 | Jx日鉱日石金属株式会社 | 電子材料用銅合金及びその製造方法 |
JP4937815B2 (ja) * | 2007-03-30 | 2012-05-23 | Jx日鉱日石金属株式会社 | 電子材料用Cu−Ni−Si−Co系銅合金及びその製造方法 |
-
2010
- 2010-06-03 JP JP2010127943A patent/JP4708497B1/ja active Active
-
2011
- 2011-03-24 CN CN201180003593.1A patent/CN102666890B/zh active Active
- 2011-03-24 EP EP11789514.4A patent/EP2578708A4/de not_active Withdrawn
- 2011-03-24 US US13/581,715 patent/US20130092297A1/en not_active Abandoned
- 2011-03-24 WO PCT/JP2011/057216 patent/WO2011152104A1/ja active Application Filing
- 2011-04-18 TW TW100113320A patent/TWI422693B/zh active
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100326573A1 (en) * | 2008-01-30 | 2010-12-30 | Kuniteru Mihara | Copper alloy material for electric/electronic component and method for manufacturing the same |
WO2009096546A1 (ja) * | 2008-01-31 | 2009-08-06 | The Furukawa Electric Co., Ltd. | 電気電子部品用銅合金材およびその製造方法 |
JP2009242932A (ja) * | 2008-03-31 | 2009-10-22 | Nippon Mining & Metals Co Ltd | 電子材料用Cu−Ni−Si−Co系銅合金及びその製造方法 |
WO2010013790A1 (ja) * | 2008-07-31 | 2010-02-04 | 古河電気工業株式会社 | 電気電子部品用銅合金材料とその製造方法 |
US20110186192A1 (en) * | 2008-07-31 | 2011-08-04 | The Furukawa Electric Co., Ltd. | Copper alloy material for electric/electronic parts and method of producing the same |
WO2010016428A1 (ja) * | 2008-08-05 | 2010-02-11 | 古河電気工業株式会社 | 電気・電子部品用銅合金材 |
JP2010059543A (ja) * | 2008-08-05 | 2010-03-18 | Furukawa Electric Co Ltd:The | 銅合金材料 |
US20110200480A1 (en) * | 2008-08-05 | 2011-08-18 | The Furukawa Electric Co., Ltd. | Copper alloy material for electric/electronic parts |
EP2386665A1 (de) * | 2008-12-12 | 2011-11-16 | JX Nippon Mining & Metals Corporation | Ni-Si-Co-KUPFERLEGIERUNG UND HERSTELLUNGSVERFAHREN DAFÜR |
Non-Patent Citations (1)
Title |
---|
See also references of WO2011152104A1 * |
Also Published As
Publication number | Publication date |
---|---|
JP4708497B1 (ja) | 2011-06-22 |
WO2011152104A1 (ja) | 2011-12-08 |
CN102666890A (zh) | 2012-09-12 |
EP2578708A1 (de) | 2013-04-10 |
TW201200606A (en) | 2012-01-01 |
CN102666890B (zh) | 2014-05-07 |
US20130092297A1 (en) | 2013-04-18 |
JP2011252216A (ja) | 2011-12-15 |
TWI422693B (zh) | 2014-01-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 20130103 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR |
|
DAX | Request for extension of the european patent (deleted) | ||
A4 | Supplementary search report drawn up and despatched |
Effective date: 20140311 |
|
RIC1 | Information provided on ipc code assigned before grant |
Ipc: C22F 1/08 20060101ALI20140304BHEP Ipc: H01B 1/02 20060101ALI20140304BHEP Ipc: C22C 9/06 20060101AFI20140304BHEP |
|
17Q | First examination report despatched |
Effective date: 20150323 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION HAS BEEN WITHDRAWN |
|
18W | Application withdrawn |
Effective date: 20160128 |