EP2706125A4 - Kupferlegierungsfolienmaterial und herstellungsverfahren dafür - Google Patents

Kupferlegierungsfolienmaterial und herstellungsverfahren dafür

Info

Publication number
EP2706125A4
EP2706125A4 EP12779988.0A EP12779988A EP2706125A4 EP 2706125 A4 EP2706125 A4 EP 2706125A4 EP 12779988 A EP12779988 A EP 12779988A EP 2706125 A4 EP2706125 A4 EP 2706125A4
Authority
EP
European Patent Office
Prior art keywords
sheet material
copper alloy
alloy sheet
producing same
producing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP12779988.0A
Other languages
English (en)
French (fr)
Other versions
EP2706125A1 (de
Inventor
Takemi Isomatsu
Hiroshi Kaneko
Koji Sato
Tatsuhiko Eguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Publication of EP2706125A1 publication Critical patent/EP2706125A1/de
Publication of EP2706125A4 publication Critical patent/EP2706125A4/de
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/10—Alloys based on copper with silicon as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/02—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working in inert or controlled atmosphere or vacuum
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/10—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of nickel or cobalt or alloys based thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/02—Single bars, rods, wires, or strips

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Conductive Materials (AREA)
EP12779988.0A 2011-05-02 2012-04-27 Kupferlegierungsfolienmaterial und herstellungsverfahren dafür Withdrawn EP2706125A4 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011102996 2011-05-02
PCT/JP2012/061479 WO2012150702A1 (ja) 2011-05-02 2012-04-27 銅合金板材およびその製造方法

Publications (2)

Publication Number Publication Date
EP2706125A1 EP2706125A1 (de) 2014-03-12
EP2706125A4 true EP2706125A4 (de) 2014-11-19

Family

ID=47107888

Family Applications (1)

Application Number Title Priority Date Filing Date
EP12779988.0A Withdrawn EP2706125A4 (de) 2011-05-02 2012-04-27 Kupferlegierungsfolienmaterial und herstellungsverfahren dafür

Country Status (6)

Country Link
EP (1) EP2706125A4 (de)
JP (1) JP5261619B2 (de)
KR (1) KR101603393B1 (de)
CN (1) CN103443309B (de)
TW (1) TWI582249B (de)
WO (1) WO2012150702A1 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6085536B2 (ja) * 2013-08-05 2017-02-22 株式会社Ｓｈカッパープロダクツ 銅条、めっき付銅条、リードフレーム及びｌｅｄモジュール
CN105829556B (zh) * 2013-12-27 2018-02-06 古河电气工业株式会社 铜合金板材、连接器以及铜合金板材的制造方法
CN105829555B (zh) * 2013-12-27 2018-04-20 古河电气工业株式会社 铜合金板材、连接器以及铜合金板材的制造方法
KR102370860B1 (ko) 2014-03-25 2022-03-07 후루카와 덴키 고교 가부시키가이샤 구리합금 판재, 커넥터, 및 구리합금 판재의 제조방법
WO2015182776A1 (ja) * 2014-05-30 2015-12-03 古河電気工業株式会社 銅合金板材、銅合金板材からなるコネクタ、および銅合金板材の製造方法
CN105088009A (zh) * 2015-07-26 2015-11-25 邢桂生 一种铜合金框架带材及其制备方法
CN105088008A (zh) * 2015-07-26 2015-11-25 邢桂生 一种微合金化铜合金框架带材及其制备方法
CN113215439A (zh) * 2021-04-16 2021-08-06 安徽绿能技术研究院有限公司 一种高强度铜合金板材及其生产工艺

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1612285A1 (de) * 2004-07-01 2006-01-04 Dowa Mining Co., Ltd. Legierung auf Kupferbasis und Verfahren zur Herstellung
JP2008013836A (ja) * 2006-07-10 2008-01-24 Dowa Holdings Co Ltd 異方性の少ない高強度銅合金板材およびその製造法
JP2010222618A (ja) * 2009-03-23 2010-10-07 Nippon Mining & Metals Co Ltd Ｃｕ−Ｎｉ−Ｓｉ系銅合金圧延板及びそれを用いた電気部品
EP2298945A1 (de) * 2008-06-03 2011-03-23 The Furukawa Electric Co., Ltd. Folienmaterial aus kupferlegierung und herstellungsverfahren dafür

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4809602B2 (ja) 2004-05-27 2011-11-09 古河電気工業株式会社 銅合金
JP3856018B2 (ja) * 2004-06-03 2006-12-13 日立電線株式会社 高強度・高導電性銅合金の製造方法
JP3888366B2 (ja) 2004-06-08 2007-02-28 日立電線株式会社 銅合金の製造方法
JP4584692B2 (ja) * 2004-11-30 2010-11-24 株式会社神戸製鋼所 曲げ加工性に優れた高強度銅合金板およびその製造方法
JP4566048B2 (ja) 2005-03-31 2010-10-20 株式会社神戸製鋼所 曲げ加工性に優れた高強度銅合金板及びその製造方法
JP5520533B2 (ja) * 2009-07-03 2014-06-11 古河電気工業株式会社 銅合金材およびその製造方法
JP5525247B2 (ja) * 2009-08-04 2014-06-18 株式会社神戸製鋼所 高強度で曲げ加工性に優れた銅合金
JP5476149B2 (ja) 2010-02-10 2014-04-23 株式会社神戸製鋼所 強度異方性が小さく曲げ加工性に優れた銅合金

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1612285A1 (de) * 2004-07-01 2006-01-04 Dowa Mining Co., Ltd. Legierung auf Kupferbasis und Verfahren zur Herstellung
JP2008013836A (ja) * 2006-07-10 2008-01-24 Dowa Holdings Co Ltd 異方性の少ない高強度銅合金板材およびその製造法
EP2298945A1 (de) * 2008-06-03 2011-03-23 The Furukawa Electric Co., Ltd. Folienmaterial aus kupferlegierung und herstellungsverfahren dafür
JP2010222618A (ja) * 2009-03-23 2010-10-07 Nippon Mining & Metals Co Ltd Ｃｕ−Ｎｉ−Ｓｉ系銅合金圧延板及びそれを用いた電気部品

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2012150702A1 *

Also Published As

Publication number Publication date
TW201303048A (zh) 2013-01-16
TWI582249B (zh) 2017-05-11
EP2706125A1 (de) 2014-03-12
KR20140004748A (ko) 2014-01-13
KR101603393B1 (ko) 2016-03-14
CN103443309A (zh) 2013-12-11
CN103443309B (zh) 2017-01-18
JP5261619B2 (ja) 2013-08-14
JPWO2012150702A1 (ja) 2014-07-28
WO2012150702A1 (ja) 2012-11-08

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