EP2508635A4 - Kupferlegierungsfolie und herstellungsverfahren dafür - Google Patents

Kupferlegierungsfolie und herstellungsverfahren dafür

Info

Publication number
EP2508635A4
EP2508635A4 EP10834585.1A EP10834585A EP2508635A4 EP 2508635 A4 EP2508635 A4 EP 2508635A4 EP 10834585 A EP10834585 A EP 10834585A EP 2508635 A4 EP2508635 A4 EP 2508635A4
Authority
EP
European Patent Office
Prior art keywords
copper alloy
alloy sheet
producing same
producing
same
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP10834585.1A
Other languages
English (en)
French (fr)
Other versions
EP2508635B1 (de
EP2508635A1 (de
Inventor
Hiroshi Kaneko
Koji Sato
Tatsuhiko Eguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Publication of EP2508635A1 publication Critical patent/EP2508635A1/de
Publication of EP2508635A4 publication Critical patent/EP2508635A4/de
Application granted granted Critical
Publication of EP2508635B1 publication Critical patent/EP2508635B1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
EP10834585.1A 2009-12-02 2010-12-01 Kupferlegierungsfolie und herstellungsverfahren dafür Active EP2508635B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009274994 2009-12-02
PCT/JP2010/071518 WO2011068135A1 (ja) 2009-12-02 2010-12-01 銅合金板材およびその製造方法

Publications (3)

Publication Number Publication Date
EP2508635A1 EP2508635A1 (de) 2012-10-10
EP2508635A4 true EP2508635A4 (de) 2015-11-25
EP2508635B1 EP2508635B1 (de) 2017-08-23

Family

ID=44114981

Family Applications (1)

Application Number Title Priority Date Filing Date
EP10834585.1A Active EP2508635B1 (de) 2009-12-02 2010-12-01 Kupferlegierungsfolie und herstellungsverfahren dafür

Country Status (6)

Country Link
US (1) US20120267013A1 (de)
EP (1) EP2508635B1 (de)
JP (1) JP4885332B2 (de)
KR (1) KR101419147B1 (de)
CN (1) CN102695811B (de)
WO (1) WO2011068135A1 (de)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
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CN102630251B (zh) * 2009-12-02 2017-03-15 古河电气工业株式会社 具有低杨氏模量的铜合金板材及其制造方法
EP3009523B1 (de) 2010-05-14 2018-08-29 Mitsubishi Materials Corporation Kupferlegierung für eine elektronische vorrichtung, verfahren zu deren herstellung und gerolltes material daraus
JP4987155B1 (ja) * 2011-03-09 2012-07-25 Ｊｘ日鉱日石金属株式会社 Ｃｕ−Ｎｉ−Ｓｉ系合金及びその製造方法
TWI556488B (zh) * 2011-08-05 2016-11-01 Furukawa Electric Co Ltd Calender copper foil for secondary battery collector and its manufacturing method
JP5117604B1 (ja) * 2011-08-29 2013-01-16 Ｊｘ日鉱日石金属株式会社 Ｃｕ−Ｎｉ−Ｓｉ系合金及びその製造方法
JP5995421B2 (ja) * 2011-10-11 2016-09-21 古河電気工業株式会社 銅合金条およびその製造方法
JP6246454B2 (ja) * 2011-11-02 2017-12-13 Ｊｘ金属株式会社 Ｃｕ−Ｎｉ−Ｓｉ系合金及びその製造方法
JP5903838B2 (ja) 2011-11-07 2016-04-13 三菱マテリアル株式会社 電子機器用銅合金、電子機器用銅素材、電子機器用銅合金の製造方法、電子機器用銅合金塑性加工材及び電子機器用部品
JP5903842B2 (ja) * 2011-11-14 2016-04-13 三菱マテリアル株式会社 銅合金、銅合金塑性加工材及び銅合金塑性加工材の製造方法
JP5916418B2 (ja) * 2012-02-13 2016-05-11 古河電気工業株式会社 銅合金板材およびその製造方法
JP5802150B2 (ja) * 2012-02-24 2015-10-28 株式会社神戸製鋼所 銅合金
JP5610643B2 (ja) * 2012-03-28 2014-10-22 Jx日鉱日石金属株式会社 Ｃｕ−Ｎｉ−Ｓｉ系銅合金条及びその製造方法
JP6126791B2 (ja) * 2012-04-24 2017-05-10 Ｊｘ金属株式会社 Ｃｕ−Ｎｉ−Ｓｉ系銅合金
ES2593624T3 (es) * 2012-10-10 2016-12-12 Kme Germany Gmbh & Co. Kg Material para componentes de contacto eléctrico
KR101274063B1 (ko) * 2013-01-22 2013-06-12 한국기계연구원 배향된 석출물을 가지는 금속복합재료 및 이의 제조방법
JP6317967B2 (ja) * 2014-03-25 2018-04-25 Ｄｏｗａメタルテック株式会社 Ｃｕ−Ｎｉ−Ｃｏ−Ｓｉ系銅合金板材およびその製造方法並びに通電部品
KR102370860B1 (ko) * 2014-03-25 2022-03-07 후루카와 덴키 고교 가부시키가이샤 구리합금 판재, 커넥터, 및 구리합금 판재의 제조방법
KR20160117210A (ko) 2015-03-30 2016-10-10 제이엑스금속주식회사 Cu-Ni-Si 계 압연 구리 합금 및 그 제조 방법
CN107406915B (zh) * 2015-05-20 2019-07-05 古河电气工业株式会社 铜合金板材及其制造方法
CN105088010B (zh) * 2015-08-31 2017-08-25 河南科技大学 一种高强高导稀土铜锆合金及其制备方法
JP2017089003A (ja) * 2015-11-03 2017-05-25 株式会社神戸製鋼所 放熱部品用銅合金板
JP6618945B2 (ja) * 2017-03-24 2019-12-11 Ｊｘ金属株式会社 電子材料用銅合金
JP7145847B2 (ja) * 2017-04-26 2022-10-03 古河電気工業株式会社 銅合金板材およびその製造方法
CN107794406B (zh) * 2017-10-16 2019-05-17 北京科技大学 一种高强高导铜镍硅合金的生产工艺
JP2019077889A (ja) * 2017-10-19 2019-05-23 Ｊｘ金属株式会社 電子材料用銅合金
KR101875806B1 (ko) * 2017-11-28 2018-08-02 주식회사 풍산 자동차 및 전자부품용 구리-티타늄계 동합금재의 제조 방법 및 이로부터 제조된 동합금재
KR101875807B1 (ko) * 2018-03-14 2018-07-06 주식회사 풍산 고강도 및 굽힘가공성이 우수한 자동차 및 전기전자 부품용 동합금재의 제조 방법
CN111918746B (zh) * 2018-03-29 2022-06-17 古河电气工业株式会社 包层材料及其制造方法
JP6629400B1 (ja) * 2018-08-30 2020-01-15 Ｊｘ金属株式会社 時効処理前のチタン銅板、プレス加工品およびプレス加工品の製造方法
KR102021442B1 (ko) 2019-07-26 2019-09-16 주식회사 풍산 강도와 도전율이 우수한 동합금 판재의 제조 방법 및 이로부터 제조된 동합금 판재
CN112030030B (zh) * 2020-08-06 2021-09-10 国网江西省电力有限公司电力科学研究院 一种高强高导铜合金线材及其制备方法
CN112410611A (zh) * 2020-11-10 2021-02-26 北京中超伟业信息安全技术股份有限公司 一种用于安全加密芯片引线框架的铜合金板材及其制备方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1967596A1 (de) * 2007-02-13 2008-09-10 Dowa Metaltech Co., Ltd. Cu-Ni-Si-basiertes Kupferlegierungsfolienmaterial und Herstellungsverfahren dafür
US20090301614A1 (en) * 2007-09-28 2009-12-10 Nippon Mining & Metals Co., Ltd. Cu-ni-si-co copper alloy for electronic materials and method for manufacturing same

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JPS6187838A (ja) * 1984-10-03 1986-05-06 Kobe Steel Ltd 熱間加工性の優れた銅合金
US5486244A (en) * 1992-11-04 1996-01-23 Olin Corporation Process for improving the bend formability of copper alloys
JP3739214B2 (ja) 1998-03-26 2006-01-25 株式会社神戸製鋼所 電子部品用銅合金板
JP4809602B2 (ja) 2004-05-27 2011-11-09 古河電気工業株式会社 銅合金
JP4166197B2 (ja) 2004-06-30 2008-10-15 日鉱金属株式会社 ＢａｄＷａｙの曲げ加工性が優れたＣｕ−Ｎｉ−Ｓｉ系銅合金条
JP4584692B2 (ja) 2004-11-30 2010-11-24 株式会社神戸製鋼所 曲げ加工性に優れた高強度銅合金板およびその製造方法
JP4566048B2 (ja) 2005-03-31 2010-10-20 株式会社神戸製鋼所 曲げ加工性に優れた高強度銅合金板及びその製造方法
JP4408275B2 (ja) 2005-09-29 2010-02-03 日鉱金属株式会社 強度と曲げ加工性に優れたＣｕ−Ｎｉ−Ｓｉ系合金
JP5028657B2 (ja) 2006-07-10 2012-09-19 Ｄｏｗａメタルテック株式会社 異方性の少ない高強度銅合金板材およびその製造法
JP4143662B2 (ja) * 2006-09-25 2008-09-03 日鉱金属株式会社 Ｃｕ−Ｎｉ−Ｓｉ系合金
CN100584975C (zh) * 2006-11-23 2010-01-27 北京有色金属研究总院 一种铜基合金及其制备方法
US20080190523A1 (en) * 2007-02-13 2008-08-14 Weilin Gao Cu-Ni-Si-based copper alloy sheet material and method of manufacturing same
JP4981748B2 (ja) 2007-05-31 2012-07-25 古河電気工業株式会社 電気・電子機器用銅合金
JP5050753B2 (ja) * 2007-09-20 2012-10-17 日立電線株式会社 めっき性に優れた電気・電子部品用銅合金の製造方法
JP4968533B2 (ja) * 2007-11-30 2012-07-04 日立電線株式会社 電気・電子部品用銅合金材
CN102105610B (zh) * 2008-06-03 2013-05-29 古河电气工业株式会社 铜合金板材及其制造方法
CN102630251B (zh) * 2009-12-02 2017-03-15 古河电气工业株式会社 具有低杨氏模量的铜合金板材及其制造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1967596A1 (de) * 2007-02-13 2008-09-10 Dowa Metaltech Co., Ltd. Cu-Ni-Si-basiertes Kupferlegierungsfolienmaterial und Herstellungsverfahren dafür
US20090301614A1 (en) * 2007-09-28 2009-12-10 Nippon Mining & Metals Co., Ltd. Cu-ni-si-co copper alloy for electronic materials and method for manufacturing same

Also Published As

Publication number Publication date
WO2011068135A1 (ja) 2011-06-09
JPWO2011068135A1 (ja) 2013-04-18
EP2508635B1 (de) 2017-08-23
JP4885332B2 (ja) 2012-02-29
KR20120104544A (ko) 2012-09-21
US20120267013A1 (en) 2012-10-25
CN102695811B (zh) 2014-04-02
EP2508635A1 (de) 2012-10-10
CN102695811A (zh) 2012-09-26
KR101419147B1 (ko) 2014-07-11

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