EP2484787A4 - Kupferlegierung auf cu-ni-si-co-basis für ein elektronisches material und herstellungsverfahren dafür - Google Patents

Kupferlegierung auf cu-ni-si-co-basis für ein elektronisches material und herstellungsverfahren dafür

Info

Publication number
EP2484787A4
EP2484787A4 EP09849834.8A EP09849834A EP2484787A4 EP 2484787 A4 EP2484787 A4 EP 2484787A4 EP 09849834 A EP09849834 A EP 09849834A EP 2484787 A4 EP2484787 A4 EP 2484787A4
Authority
EP
European Patent Office
Prior art keywords
copper alloy
electronic material
producing same
producing
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP09849834.8A
Other languages
English (en)
French (fr)
Other versions
EP2484787A1 (de
EP2484787B1 (de
Inventor
Hiroshi Kuwagaki
Naohiko Era
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JX Nippon Mining and Metals Corp
Original Assignee
JX Nippon Mining and Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JX Nippon Mining and Metals Corp filed Critical JX Nippon Mining and Metals Corp
Publication of EP2484787A1 publication Critical patent/EP2484787A1/de
Publication of EP2484787A4 publication Critical patent/EP2484787A4/de
Application granted granted Critical
Publication of EP2484787B1 publication Critical patent/EP2484787B1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Conductive Materials (AREA)
EP09849834.8A 2009-09-28 2009-09-28 Cu-ni-si-co kupferlegierung für ein elektronisches material und herstellungsverfahren dafür Active EP2484787B1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2009/066794 WO2011036804A1 (ja) 2009-09-28 2009-09-28 電子材料用Ｃｕ－Ｎｉ－Ｓｉ－Ｃｏ系銅合金及びその製造方法

Publications (3)

Publication Number Publication Date
EP2484787A1 EP2484787A1 (de) 2012-08-08
EP2484787A4 true EP2484787A4 (de) 2013-06-05
EP2484787B1 EP2484787B1 (de) 2015-01-07

Family

ID=43795574

Family Applications (1)

Application Number Title Priority Date Filing Date
EP09849834.8A Active EP2484787B1 (de) 2009-09-28 2009-09-28 Cu-ni-si-co kupferlegierung für ein elektronisches material und herstellungsverfahren dafür

Country Status (5)

Country Link
EP (1) EP2484787B1 (de)
JP (1) JP5506806B2 (de)
KR (1) KR20120054099A (de)
CN (1) CN102549180A (de)
WO (1) WO2011036804A1 (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8821477B2 (en) 2007-08-06 2014-09-02 Boston Scientific Scimed, Inc. Alternative micromachined structures
US8795254B2 (en) 2008-12-10 2014-08-05 Boston Scientific Scimed, Inc. Medical devices with a slotted tubular member having improved stress distribution
JP2013523282A (ja) 2010-03-31 2013-06-17 ボストン サイエンティフィック サイムド，インコーポレイテッド 曲げ剛性プロファイルを有するガイドワイヤ
JP6246454B2 (ja) * 2011-11-02 2017-12-13 Ｊｘ金属株式会社 Ｃｕ−Ｎｉ−Ｓｉ系合金及びその製造方法
JP5770113B2 (ja) * 2012-01-13 2015-08-26 Jx日鉱日石金属株式会社 金属箔複合体、並びに成形体及びその製造方法
US9901706B2 (en) 2014-04-11 2018-02-27 Boston Scientific Scimed, Inc. Catheters and catheter shafts
JP6310004B2 (ja) * 2016-05-27 2018-04-11 Ｊｘ金属株式会社 電子部品用Ｃｕ−Ｃｏ−Ｎｉ−Ｓｉ合金
CN106244849A (zh) * 2016-10-13 2016-12-21 龙岩学院 一种超声波强化高性能铜合金的制备方法
CN108642419A (zh) * 2018-05-31 2018-10-12 太原晋西春雷铜业有限公司 一种折弯性优良的铜镍硅合金带材及其制备方法
JP7451964B2 (ja) * 2019-01-16 2024-03-19 株式会社プロテリアル Ｃｕ合金板およびその製造方法
CN110195166A (zh) * 2019-04-17 2019-09-03 宁波兴业盛泰集团有限公司 一种引线框架用抗折弯CuNiCoSi系合金及其制造方法
CN112410646A (zh) * 2020-10-16 2021-02-26 扬州千裕电气有限公司 一种电子复合材料
CN113234958A (zh) * 2021-04-25 2021-08-10 江苏青益金属科技股份有限公司 适用于石油输送管道恒温包套的合金线材及其制备方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040079456A1 (en) * 2002-07-02 2004-04-29 Onlin Corporation Copper alloy containing cobalt, nickel and silicon
EP1876250A1 (de) * 2005-03-31 2008-01-09 Nippon Mining & Metals Co., Ltd. Kupferlegierung auf cu-ni-si-co-cr-basis für elektronikmaterial und herstellungsverfahren dafür
JP2008106356A (ja) * 2006-09-27 2008-05-08 Dowa Metaltech Kk 銅合金板材およびその製造法
US20080190524A1 (en) * 2007-02-13 2008-08-14 Weilin Gao Cu-Ni-Si-based copper alloy sheet material and method of manufacturing same
JP2008266783A (ja) * 2007-03-26 2008-11-06 Furukawa Electric Co Ltd:The 電気・電子機器用銅合金およびその製造方法
JP2009007666A (ja) * 2007-05-31 2009-01-15 Furukawa Electric Co Ltd:The 電気・電子機器用銅合金
WO2009082695A1 (en) * 2007-12-21 2009-07-02 Gbc Metals Llc Copper-nickel-silicon alloys

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01122264A (ja) 1987-11-05 1989-05-15 Nec Corp 画像出力装置
JP3408021B2 (ja) 1995-06-30 2003-05-19 古河電気工業株式会社 電子電気部品用銅合金およびその製造方法
WO2006101172A1 (ja) 2005-03-24 2006-09-28 Nippon Mining & Metals Co., Ltd. 電子材料用銅合金
JP4596490B2 (ja) * 2008-03-31 2010-12-08 Ｊｘ日鉱日石金属株式会社 電子材料用Ｃｕ−Ｎｉ−Ｓｉ−Ｃｏ系銅合金及びその製造方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040079456A1 (en) * 2002-07-02 2004-04-29 Onlin Corporation Copper alloy containing cobalt, nickel and silicon
EP1876250A1 (de) * 2005-03-31 2008-01-09 Nippon Mining & Metals Co., Ltd. Kupferlegierung auf cu-ni-si-co-cr-basis für elektronikmaterial und herstellungsverfahren dafür
JP2008106356A (ja) * 2006-09-27 2008-05-08 Dowa Metaltech Kk 銅合金板材およびその製造法
US20080190524A1 (en) * 2007-02-13 2008-08-14 Weilin Gao Cu-Ni-Si-based copper alloy sheet material and method of manufacturing same
JP2008266783A (ja) * 2007-03-26 2008-11-06 Furukawa Electric Co Ltd:The 電気・電子機器用銅合金およびその製造方法
JP2009007666A (ja) * 2007-05-31 2009-01-15 Furukawa Electric Co Ltd:The 電気・電子機器用銅合金
WO2009082695A1 (en) * 2007-12-21 2009-07-02 Gbc Metals Llc Copper-nickel-silicon alloys

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
H.-A. KUHN ET AL: "A new high performance copper based alloy for electro-mechanical connectors", MATERIALWISSENSCHAFT UND WERKSTOFFTECHNIK, vol. 38, no. 8, 1 August 2007 (2007-08-01), pages 624 - 634, XP055060686, ISSN: 0933-5137, DOI: 10.1002/mawe.200700152 *
See also references of WO2011036804A1 *

Also Published As

Publication number Publication date
EP2484787A1 (de) 2012-08-08
WO2011036804A1 (ja) 2011-03-31
KR20120054099A (ko) 2012-05-29
JPWO2011036804A1 (ja) 2013-02-14
CN102549180A (zh) 2012-07-04
EP2484787B1 (de) 2015-01-07
JP5506806B2 (ja) 2014-05-28

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