KR20110019376A - 처리 챔버로의 가스 전달의 시간 스케일을 제어하기 위한 방법 - Google Patents

처리 챔버로의 가스 전달의 시간 스케일을 제어하기 위한 방법 Download PDF

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Publication number
KR20110019376A
KR20110019376A KR1020107028548A KR20107028548A KR20110019376A KR 20110019376 A KR20110019376 A KR 20110019376A KR 1020107028548 A KR1020107028548 A KR 1020107028548A KR 20107028548 A KR20107028548 A KR 20107028548A KR 20110019376 A KR20110019376 A KR 20110019376A
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KR
South Korea
Prior art keywords
gas species
mfc
overshoot
flow rate
gas
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Ceased
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KR1020107028548A
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English (en)
Korean (ko)
Inventor
군수 윤
이크발 에이 샤리프
커트 조겐센
로버트 카라탄
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램 리써치 코포레이션
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Publication of KR20110019376A publication Critical patent/KR20110019376A/ko
Ceased legal-status Critical Current

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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05DSYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D7/00Control of flow
    • G05D7/06Control of flow characterised by the use of electric means
    • G05D7/0617Control of flow characterised by the use of electric means specially adapted for fluid materials
    • G05D7/0629Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means
    • G05D7/0635Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means by action on throttling means
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01FMEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F1/00Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00Fluid handling
    • Y10T137/7722Line condition change responsive valves
    • Y10T137/7758Pilot or servo controlled
    • Y10T137/7761Electrically actuated valve

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Automation & Control Theory (AREA)
  • Fluid Mechanics (AREA)
  • Drying Of Semiconductors (AREA)
  • Chemical Vapour Deposition (AREA)
  • Feeding, Discharge, Calcimining, Fusing, And Gas-Generation Devices (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Accessories For Mixers (AREA)
KR1020107028548A 2008-06-20 2009-06-12 처리 챔버로의 가스 전달의 시간 스케일을 제어하기 위한 방법 Ceased KR20110019376A (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US7453908P 2008-06-20 2008-06-20
US61/074,539 2008-06-20
US12/477,196 US8340827B2 (en) 2008-06-20 2009-06-03 Methods for controlling time scale of gas delivery into a processing chamber
US12/477,196 2009-06-03

Publications (1)

Publication Number Publication Date
KR20110019376A true KR20110019376A (ko) 2011-02-25

Family

ID=41432039

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020107028548A Ceased KR20110019376A (ko) 2008-06-20 2009-06-12 처리 챔버로의 가스 전달의 시간 스케일을 제어하기 위한 방법

Country Status (6)

Country Link
US (1) US8340827B2 (https=)
JP (1) JP2011524948A (https=)
KR (1) KR20110019376A (https=)
CN (1) CN102067280B (https=)
TW (1) TWI477938B (https=)
WO (1) WO2009155221A2 (https=)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5346628B2 (ja) 2009-03-11 2013-11-20 株式会社堀場エステック マスフローコントローラの検定システム、検定方法、検定用プログラム
US8770215B1 (en) * 2011-07-20 2014-07-08 Daniel T. Mudd Low flow injector to deliver a low flow of gas to a remote location
US9958302B2 (en) 2011-08-20 2018-05-01 Reno Technologies, Inc. Flow control system, method, and apparatus
US9188989B1 (en) 2011-08-20 2015-11-17 Daniel T. Mudd Flow node to deliver process gas using a remote pressure measurement device
WO2014040002A2 (en) 2012-09-10 2014-03-13 Mudd Daniel T Pressure based mass flow controller
DE102013109210A1 (de) * 2013-08-20 2015-02-26 Aixtron Se Evakuierbare Kammer, insbesondere mit einem Spülgas spülbare Beladeschleuse
US9580360B2 (en) 2014-04-07 2017-02-28 Lam Research Corporation Monolithic ceramic component of gas delivery system and method of making and use thereof
US10128087B2 (en) 2014-04-07 2018-11-13 Lam Research Corporation Configuration independent gas delivery system
US10557197B2 (en) 2014-10-17 2020-02-11 Lam Research Corporation Monolithic gas distribution manifold and various construction techniques and use cases therefor
US10022689B2 (en) 2015-07-24 2018-07-17 Lam Research Corporation Fluid mixing hub for semiconductor processing tool
US10118263B2 (en) 2015-09-02 2018-11-06 Lam Researech Corporation Monolithic manifold mask and substrate concepts
US10215317B2 (en) 2016-01-15 2019-02-26 Lam Research Corporation Additively manufactured gas distribution manifold
US9879795B2 (en) 2016-01-15 2018-01-30 Lam Research Corporation Additively manufactured gas distribution manifold
US10453721B2 (en) 2016-03-15 2019-10-22 Applied Materials, Inc. Methods and assemblies for gas flow ratio control
US10303189B2 (en) 2016-06-30 2019-05-28 Reno Technologies, Inc. Flow control system, method, and apparatus
US11144075B2 (en) 2016-06-30 2021-10-12 Ichor Systems, Inc. Flow control system, method, and apparatus
US10679880B2 (en) 2016-09-27 2020-06-09 Ichor Systems, Inc. Method of achieving improved transient response in apparatus for controlling flow and system for accomplishing same
US10838437B2 (en) 2018-02-22 2020-11-17 Ichor Systems, Inc. Apparatus for splitting flow of process gas and method of operating same
JP6762218B2 (ja) * 2016-12-13 2020-09-30 株式会社堀場エステック 流量算出システム及び流量算出方法
US10663337B2 (en) 2016-12-30 2020-05-26 Ichor Systems, Inc. Apparatus for controlling flow and method of calibrating same
US10866135B2 (en) * 2018-03-26 2020-12-15 Applied Materials, Inc. Methods, systems, and apparatus for mass flow verification based on rate of pressure decay
US10760944B2 (en) * 2018-08-07 2020-09-01 Lam Research Corporation Hybrid flow metrology for improved chamber matching
US11841715B2 (en) 2020-10-22 2023-12-12 Applied Materials, Inc. Piezo position control flow ratio control
US11899477B2 (en) 2021-03-03 2024-02-13 Ichor Systems, Inc. Fluid flow control system comprising a manifold assembly

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6193811B1 (en) * 1999-03-03 2001-02-27 Applied Materials, Inc. Method for improved chamber bake-out and cool-down
KR100427563B1 (ko) * 1999-04-16 2004-04-27 가부시키가이샤 후지킨 병렬분류형 유체공급장치와, 이것에 사용하는 유체가변형압력식 유량제어방법 및 유체가변형 압력식 유량제어장치
US6363958B1 (en) * 1999-05-10 2002-04-02 Parker-Hannifin Corporation Flow control of process gas in semiconductor manufacturing
US6632322B1 (en) * 2000-06-30 2003-10-14 Lam Research Corporation Switched uniformity control
US7354555B2 (en) * 2002-05-08 2008-04-08 Taiwan Semiconductor Manufacturing Co., Ltd. Gas flow control system with interlock
WO2005102432A1 (en) * 2004-04-23 2005-11-03 Boehm Stephan Method and apparatus for changing the concentration of a target gas at the blood compartment of a patient's lung during artificial ventilation
US7216019B2 (en) * 2004-07-08 2007-05-08 Celerity, Inc. Method and system for a mass flow controller with reduced pressure sensitivity
US7412986B2 (en) * 2004-07-09 2008-08-19 Celerity, Inc. Method and system for flow measurement and validation of a mass flow controller
CN101044259B (zh) * 2004-10-19 2010-07-07 东京毅力科创株式会社 等离子体溅射成膜方法和成膜装置
US7756599B2 (en) * 2004-10-28 2010-07-13 Tokyo Electron Limited Substrate processing apparatus, program for performing operation and control method thereof, and computer readable storage medium storing the program
US7368000B2 (en) * 2004-12-22 2008-05-06 The Boc Group Plc Treatment of effluent gases
US7854821B2 (en) * 2005-06-02 2010-12-21 Tokyo Electron Limited Substrate processing apparatus
US20070021935A1 (en) * 2005-07-12 2007-01-25 Larson Dean J Methods for verifying gas flow rates from a gas supply system into a plasma processing chamber
JP4911982B2 (ja) * 2006-02-06 2012-04-04 東京エレクトロン株式会社 ガス供給装置,基板処理装置,ガス供給方法及びガス供給制御方法
US7896967B2 (en) * 2006-02-06 2011-03-01 Tokyo Electron Limited Gas supply system, substrate processing apparatus and gas supply method
US8304328B2 (en) * 2006-03-20 2012-11-06 Hitachi Kokusai Electric Inc. Manufacturing method of semiconductor device and substrate processing apparatus
US20080153311A1 (en) * 2006-06-28 2008-06-26 Deenesh Padhi Method for depositing an amorphous carbon film with improved density and step coverage
JP5028193B2 (ja) * 2007-09-05 2012-09-19 株式会社日立ハイテクノロジーズ 半導体製造装置における被処理体の搬送方法
US20090084987A1 (en) * 2007-09-28 2009-04-02 Varian Semiconductor Equipment Associates, Inc. Charge neutralization in a plasma processing apparatus

Also Published As

Publication number Publication date
WO2009155221A2 (en) 2009-12-23
US20090319071A1 (en) 2009-12-24
TW201017357A (en) 2010-05-01
US8340827B2 (en) 2012-12-25
CN102067280A (zh) 2011-05-18
CN102067280B (zh) 2013-04-03
JP2011524948A (ja) 2011-09-08
TWI477938B (zh) 2015-03-21
WO2009155221A3 (en) 2010-03-25

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