CN102067280B - 用于控制到处理室中的气体输送的时间尺度的方法 - Google Patents

用于控制到处理室中的气体输送的时间尺度的方法 Download PDF

Info

Publication number
CN102067280B
CN102067280B CN2009801243953A CN200980124395A CN102067280B CN 102067280 B CN102067280 B CN 102067280B CN 2009801243953 A CN2009801243953 A CN 2009801243953A CN 200980124395 A CN200980124395 A CN 200980124395A CN 102067280 B CN102067280 B CN 102067280B
Authority
CN
China
Prior art keywords
gas species
gas
overshoot
mass flow
flow controller
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN2009801243953A
Other languages
English (en)
Chinese (zh)
Other versions
CN102067280A (zh
Inventor
冈苏·云
伊克巴尔·A·谢里夫
库尔特·乔根森
罗伯特·沙拉安
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research Corp
Original Assignee
Lam Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Research Corp filed Critical Lam Research Corp
Publication of CN102067280A publication Critical patent/CN102067280A/zh
Application granted granted Critical
Publication of CN102067280B publication Critical patent/CN102067280B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D7/00—Control of flow
    • G05D7/06—Control of flow characterised by the use of electric means
    • G05D7/0617—Control of flow characterised by the use of electric means specially adapted for fluid materials
    • G05D7/0629—Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means
    • G05D7/0635—Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means by action on throttling means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/7722—Line condition change responsive valves
    • Y10T137/7758—Pilot or servo controlled
    • Y10T137/7761—Electrically actuated valve

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Automation & Control Theory (AREA)
  • Fluid Mechanics (AREA)
  • Drying Of Semiconductors (AREA)
  • Chemical Vapour Deposition (AREA)
  • Feeding, Discharge, Calcimining, Fusing, And Gas-Generation Devices (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Accessories For Mixers (AREA)
CN2009801243953A 2008-06-20 2009-06-12 用于控制到处理室中的气体输送的时间尺度的方法 Active CN102067280B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US7453908P 2008-06-20 2008-06-20
US61/074,539 2008-06-20
US12/477,196 US8340827B2 (en) 2008-06-20 2009-06-03 Methods for controlling time scale of gas delivery into a processing chamber
US12/477,196 2009-06-03
PCT/US2009/047279 WO2009155221A2 (en) 2008-06-20 2009-06-12 Methods for controlling time scale of gas delivery into a processing chamber

Publications (2)

Publication Number Publication Date
CN102067280A CN102067280A (zh) 2011-05-18
CN102067280B true CN102067280B (zh) 2013-04-03

Family

ID=41432039

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2009801243953A Active CN102067280B (zh) 2008-06-20 2009-06-12 用于控制到处理室中的气体输送的时间尺度的方法

Country Status (6)

Country Link
US (1) US8340827B2 (https=)
JP (1) JP2011524948A (https=)
KR (1) KR20110019376A (https=)
CN (1) CN102067280B (https=)
TW (1) TWI477938B (https=)
WO (1) WO2009155221A2 (https=)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5346628B2 (ja) 2009-03-11 2013-11-20 株式会社堀場エステック マスフローコントローラの検定システム、検定方法、検定用プログラム
US8770215B1 (en) * 2011-07-20 2014-07-08 Daniel T. Mudd Low flow injector to deliver a low flow of gas to a remote location
US9188989B1 (en) 2011-08-20 2015-11-17 Daniel T. Mudd Flow node to deliver process gas using a remote pressure measurement device
US9958302B2 (en) 2011-08-20 2018-05-01 Reno Technologies, Inc. Flow control system, method, and apparatus
US9690301B2 (en) 2012-09-10 2017-06-27 Reno Technologies, Inc. Pressure based mass flow controller
DE102013109210A1 (de) * 2013-08-20 2015-02-26 Aixtron Se Evakuierbare Kammer, insbesondere mit einem Spülgas spülbare Beladeschleuse
US9580360B2 (en) 2014-04-07 2017-02-28 Lam Research Corporation Monolithic ceramic component of gas delivery system and method of making and use thereof
TWI693638B (zh) 2014-04-07 2020-05-11 美商蘭姆研究公司 獨立於配置的氣體輸送系統
US10557197B2 (en) 2014-10-17 2020-02-11 Lam Research Corporation Monolithic gas distribution manifold and various construction techniques and use cases therefor
US10022689B2 (en) 2015-07-24 2018-07-17 Lam Research Corporation Fluid mixing hub for semiconductor processing tool
US10118263B2 (en) 2015-09-02 2018-11-06 Lam Researech Corporation Monolithic manifold mask and substrate concepts
US10215317B2 (en) 2016-01-15 2019-02-26 Lam Research Corporation Additively manufactured gas distribution manifold
US9879795B2 (en) 2016-01-15 2018-01-30 Lam Research Corporation Additively manufactured gas distribution manifold
US10453721B2 (en) 2016-03-15 2019-10-22 Applied Materials, Inc. Methods and assemblies for gas flow ratio control
US11144075B2 (en) 2016-06-30 2021-10-12 Ichor Systems, Inc. Flow control system, method, and apparatus
US10303189B2 (en) 2016-06-30 2019-05-28 Reno Technologies, Inc. Flow control system, method, and apparatus
US10679880B2 (en) 2016-09-27 2020-06-09 Ichor Systems, Inc. Method of achieving improved transient response in apparatus for controlling flow and system for accomplishing same
US10838437B2 (en) 2018-02-22 2020-11-17 Ichor Systems, Inc. Apparatus for splitting flow of process gas and method of operating same
JP6762218B2 (ja) * 2016-12-13 2020-09-30 株式会社堀場エステック 流量算出システム及び流量算出方法
US10663337B2 (en) 2016-12-30 2020-05-26 Ichor Systems, Inc. Apparatus for controlling flow and method of calibrating same
US10866135B2 (en) * 2018-03-26 2020-12-15 Applied Materials, Inc. Methods, systems, and apparatus for mass flow verification based on rate of pressure decay
US10760944B2 (en) * 2018-08-07 2020-09-01 Lam Research Corporation Hybrid flow metrology for improved chamber matching
US11841715B2 (en) 2020-10-22 2023-12-12 Applied Materials, Inc. Piezo position control flow ratio control
WO2022186971A1 (en) 2021-03-03 2022-09-09 Ichor Systems, Inc. Fluid flow control system comprising a manifold assembly
CN117660944B (zh) * 2024-01-30 2024-04-23 浙江大学 一种可实现原子精度制造的化学气相沉积自动化装备

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101014917A (zh) * 2004-07-09 2007-08-08 迅捷公司 用于流量测量和确认质量流量控制器有效性的方法和系统

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6193811B1 (en) * 1999-03-03 2001-02-27 Applied Materials, Inc. Method for improved chamber bake-out and cool-down
WO2000063756A1 (en) 1999-04-16 2000-10-26 Fujikin Incorporated Parallel bypass type fluid feeding device, and method and device for controlling fluid variable type pressure system flow rate used for the device
US6363958B1 (en) * 1999-05-10 2002-04-02 Parker-Hannifin Corporation Flow control of process gas in semiconductor manufacturing
US6632322B1 (en) * 2000-06-30 2003-10-14 Lam Research Corporation Switched uniformity control
US7354555B2 (en) 2002-05-08 2008-04-08 Taiwan Semiconductor Manufacturing Co., Ltd. Gas flow control system with interlock
CA2605950C (en) * 2004-04-23 2013-06-11 Stephan Boehm Method and apparatus for changing the concentration of a target gas at the blood compartment of a patient's lung during artificial ventilation
US7216019B2 (en) 2004-07-08 2007-05-08 Celerity, Inc. Method and system for a mass flow controller with reduced pressure sensitivity
WO2006043551A1 (ja) * 2004-10-19 2006-04-27 Tokyo Electron Limited プラズマスパッタリングによる成膜方法及び成膜装置
US7756599B2 (en) * 2004-10-28 2010-07-13 Tokyo Electron Limited Substrate processing apparatus, program for performing operation and control method thereof, and computer readable storage medium storing the program
US7368000B2 (en) * 2004-12-22 2008-05-06 The Boc Group Plc Treatment of effluent gases
US7854821B2 (en) * 2005-06-02 2010-12-21 Tokyo Electron Limited Substrate processing apparatus
US20070021935A1 (en) * 2005-07-12 2007-01-25 Larson Dean J Methods for verifying gas flow rates from a gas supply system into a plasma processing chamber
US7896967B2 (en) * 2006-02-06 2011-03-01 Tokyo Electron Limited Gas supply system, substrate processing apparatus and gas supply method
JP4911982B2 (ja) * 2006-02-06 2012-04-04 東京エレクトロン株式会社 ガス供給装置，基板処理装置，ガス供給方法及びガス供給制御方法
JP4733738B2 (ja) * 2006-03-20 2011-07-27 株式会社日立国際電気 半導体装置の製造方法および基板処理装置
US20080153311A1 (en) * 2006-06-28 2008-06-26 Deenesh Padhi Method for depositing an amorphous carbon film with improved density and step coverage
JP5028193B2 (ja) * 2007-09-05 2012-09-19 株式会社日立ハイテクノロジーズ 半導体製造装置における被処理体の搬送方法
US20090084987A1 (en) * 2007-09-28 2009-04-02 Varian Semiconductor Equipment Associates, Inc. Charge neutralization in a plasma processing apparatus

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101014917A (zh) * 2004-07-09 2007-08-08 迅捷公司 用于流量测量和确认质量流量控制器有效性的方法和系统

Also Published As

Publication number Publication date
JP2011524948A (ja) 2011-09-08
CN102067280A (zh) 2011-05-18
WO2009155221A3 (en) 2010-03-25
US8340827B2 (en) 2012-12-25
WO2009155221A2 (en) 2009-12-23
US20090319071A1 (en) 2009-12-24
TW201017357A (en) 2010-05-01
KR20110019376A (ko) 2011-02-25
TWI477938B (zh) 2015-03-21

Similar Documents

Publication Publication Date Title
CN102067280B (zh) 用于控制到处理室中的气体输送的时间尺度的方法
JP2021508129A (ja) 遮断弁を用いたパルスガス供給方法および装置
TWI834640B (zh) 用於基板處理的質流控制器
US7673645B2 (en) Gas delivery method and system including a flow ratio controller using a multiple antisymmetric optimal control arrangement
US7437944B2 (en) Method and apparatus for pressure and mix ratio control
KR102748085B1 (ko) 유체 제어 시스템
KR101817162B1 (ko) 고속 펄스 가스 이송 시스템 및 방법
JP2005535894A (ja) 試料希釈装置および試料希釈方法
US11519070B2 (en) Vaporization device, film formation device, program for a concentration control mechanism, and concentration control method
JP2000077394A (ja) 半導体製造装置
US8770215B1 (en) Low flow injector to deliver a low flow of gas to a remote location
US7107128B2 (en) System for controlling fluid flow
US8389053B2 (en) Method of cleaning powdery source supply system, storage medium, substrate processing system and substrate processing method
US20200018736A1 (en) Concentration detection method and pressure-type flow rate control device
US20210138482A1 (en) Field flow fractionation device
US20230129479A1 (en) Flow rate control device and flow rate control method
KR102329548B1 (ko) 챔버 배기량 자동 조절 시스템
JP6556850B2 (ja) ガスの多重供給方法及びガスの多重供給装置
JPS62204528A (ja) ドライプロセス処理装置
CN100543623C (zh) 一种新型质量流量控制器在线校验设备
US7087443B2 (en) Optimized temperature controller for cold mass introduction
JP2000042390A (ja) 液体希釈装置
JP2002093773A (ja) 基板処理装置
JPH05315290A (ja) ガス流量制御装置
CN103977740A (zh) 一种物料混合系统

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant