KR20100132448A - Method for dividing bonded substrate and bonded substrate - Google Patents

Abstract

PURPOSE: A method for dividing a laminated substrate is provided to divide one side of a laminated substrate by creating thermal stress and to separate an edge member of one substrate from the other substrate. CONSTITUTION: A method for dividing a laminated substrate comprises a step for dividing an edge member(12) which is an end part facing one substrate, from one substrate. The other substrate of a laminated substrate comprises 2 substrates made of brittle materials. Spacers(5) are arranged between the edge member and the other substrate in an interval of 3mm or less.

Description

Separation method of bonded substrate and bonded substrate {METHOD FOR DIVIDING BONDED SUBSTRATE AND BONDED SUBSTRATE}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a joining method and a joining substrate of a bonded substrate, in which a edge member of one substrate can be divided with high accuracy from the other substrate in a bonded substrate in which two substrates are bonded.

The process of dividing one board | substrate of the joining board | substrate which bonded two sheets of plate-shaped brittle materials, such as a glass plate, from another board | substrate may be needed. For example, when a bonded substrate is mother glass which cuts out display panels, such as LCD used for a liquid crystal display device, the electrode formed inside is cut out by dividing and cutting off the edge member of one board | substrate of a mother glass. Can be exposed, and can be electrically connected to an external electrode or the like. Thereby, operation confirmation etc. can be performed before cutting out a display panel from mother glass.

For example, in patent document 1, the edge part of one board | substrate of the bonded glass substrate is isolate | separated by dividing along the scribe line formed using the scriber, and the electrode formed in the edge part of the other board | substrate. A method of exposing is disclosed.

Moreover, in patent document 2, a board | substrate is supported so that it may not interfere with the movement along the main surface of a board | substrate, heats and cools a glass substrate along a division planned line, and produces thermal stress in the inside of a board | substrate, and penetrates in the thickness direction of a board | substrate. Disclosed is a method of forming a crack to split a glass substrate.

Japanese Patent Application Laid-Open No. 06-305757 Japanese Patent Laid-Open No. 2007-191363

However, even when a crack having a predetermined depth is formed on one substrate and the one substrate can be divided along the formed crack, when the substrate restraint force, which is a force that restrains the bonded substrates, is large, the divided one substrate is separated from the other substrate. It was difficult to separate from one board | substrate. In addition, in the case of forming a crack penetrating in the thickness direction of the substrate by laser heating and cooling one substrate of the bonded substrate and dividing the glass substrate, when the substrate restraint force, which is a force that restrains the bonded substrates, is large, the thickness direction of the substrate It was difficult to form cracks to penetrate through. This problem is considered to occur when the bonded substrates are in close contact with each other. Particularly, when the substrate is divided by laser heating and cooling, the substrate restraint force between the bonded substrates is reduced by the surface tension effect of the cooling water remaining on the substrate. It becomes larger and it becomes more difficult to divide the joined board | substrate or to separate the divided board | substrate from the other board | substrate.

In patent document 1, although the edge part of one board | substrate which comprises a joining board | substrate is divided along a scribe line, the method of separating a segmented edge member is not disclosed. Therefore, in the case of exposing the electrode formed at the end of the display panel, even when one substrate at the end is divided by a CO ₂ laser or the like, the problem that it is difficult to separate the divided edge member from the other substrate is eliminated. It doesn't work.

Moreover, in patent document 2, when forming and dividing the crack which penetrates in the thickness direction of a board | substrate by laser-heating and cooling a board | substrate of a single plate, it deform | transforms so that it may not disturb the displacement of the board accompanying formation of a crack. A cross section of the substrate is sandwiched by a guide member. However, the displacement of the substrate in the case of dividing one substrate of the bonded substrate is not considered. Therefore, in the case of dividing one substrate of the bonded substrate, the formation of cracks is hindered by the substrate restraint force, which is a force that restrains the bonded substrates, so that the problem of difficulty in dividing is not solved.

This invention is made | formed in view of such a situation, In the bonded substrate which joined two board | substrates, the edge member by which the edge part of one board | substrate was divided | segmented can be easily isolate | separated from the other board | substrate, and also the thermal stress to a board | substrate is It is an object of the present invention to provide a method for dividing a bonded substrate and a bonded substrate, which can generate a substrate to separate one substrate of the bonded substrate.

In order to achieve the above object, the method for dividing a bonded substrate according to the first aspect of the present invention provides an edge member that is an end portion of the one substrate of the bonded substrate, in which two substrates made of brittle material are bonded to the other substrate. In the method of dividing a bonded substrate separated from one substrate, spacers are arranged at intervals of 3 mm or less between the edge member and the other substrate facing the edge member, and the spacers are arranged in the The said spacer is arrange | positioned so that area may become 70% or more of the area of the said edge member.

In addition, in the method of dividing the bonded substrate according to the second invention, in the first invention, the bonded substrate is an LCD substrate.

In the method of dividing the bonded substrate according to the third invention, in the second invention, the spacer is arranged in a plurality of rows and columns from the scribe line for dividing the edge member toward the end of the substrate.

In the method of dividing the bonded substrate according to the fourth aspect of the invention, in the first aspect of the invention, the spacer is disposed at a predetermined distribution density from the scribe line for dividing the edge member toward the end portion of the substrate.

Next, in order to achieve the above object, the bonded substrate according to the fifth aspect of the present invention is a bonded substrate in which two substrates made of a brittle material are bonded, the edge member being an end portion of the one substrate facing the other substrate. The spacers are arranged at intervals of 3 mm or less from each other with the other substrate facing the edge member, and the area of the region where the spacer is disposed is 70% or more of the area of the edge member. The spacer is disposed.

Moreover, in the junction board which concerns on 6th invention, in the 5th invention, the said junction board is a board | substrate for LCD, It is characterized by the above-mentioned.

In the sixth invention, the bonded substrate according to the seventh invention is characterized in that the spacers are arranged in a plurality of rows and columns from the scribe line separating the edge member toward the end of the substrate.

Further, in the bonded substrate according to the eighth invention, in the fifth invention, the spacer is arranged at a predetermined distribution density from the scribe line for dividing the edge member toward the end of the substrate.

In 1st invention, 2nd invention, 5th invention, and 6th invention, the other board | substrate is an edge member which is the edge part which opposes the other board | substrate of one board | substrate of the bonded board | substrate which joined two board | substrates which consist of brittle materials. Segment from The spacers are arranged at predetermined intervals of 3 mm or less in a predetermined range of the edge member of the bonded substrate. By arranging the spacers so that the area of the region where the spacers are arranged is 70% or more of the area of the edge member of one of the substrates separated from the bonded substrate, the substrate restraint force between the one substrate and the other substrate of the bonded substrate, It is also reliably reduced at the end of the bonded substrate. Therefore, the edge member of one board | substrate which opposes the other board | substrate can be reliably divided and isolate | separated from the other board | substrate, For example, in the bonding board | substrate for LCD, an internal terminal can be reliably exposed to the outside. Can be. In addition, the "area of the area | region in which the spacer is arrange | positioned" means the area in the envelope which connects the spacer arrange | positioned at the outermost among the spacer groups arrange | positioned at predetermined space | interval mutually.

In 3rd invention and 7th invention, the board | substrate restraint force between one board | substrate and the other board | substrate is arrange | positioned by arrange | positioning a spacer in a plurality of rows and columns toward the edge part of a board | substrate from the scribe line which divides an edge member. It is also reliably reduced at the end. Therefore, the edge member of one board | substrate which opposes the other board | substrate can be reliably divided and separated from the other board | substrate, and an internal terminal can be reliably exposed to the exterior.

In 4th invention and 8th invention, a board | substrate restraint force between one board | substrate and the other board | substrate is arrange | positioned by arrange | positioning a spacer with predetermined distribution density toward the edge part of a board | substrate from the scribe line which divides an edge member. It is also reliably reduced at the end. Therefore, the edge member of one board | substrate which opposes the other board | substrate can be reliably divided and separated from the other board | substrate, and an internal terminal can be reliably exposed to the exterior.

By the said structure, the board | substrate restraint force between one board | substrate and the other board | substrate of a bonding board | substrate is reliably reduced also in the edge part of a bonding board | substrate. Therefore, the edge member of one board | substrate which opposes the other board | substrate can be reliably divided and isolate | separated from the other board | substrate, For example, in the bonding board | substrate for LCD, an internal terminal can be reliably exposed to the outside. Can be.

1 is a plan view schematically showing the configuration of a bonded substrate according to an embodiment of the present invention.
It is a partial sectional drawing which shows typically the structure of the edge member vicinity of the bonded substrate which concerns on embodiment of this invention.
3 is a perspective view showing the shape of the spacer.
It is a schematic diagram which shows arrangement | positioning of the spacer of the bonded substrate which concerns on embodiment of this invention.
It is a schematic diagram which shows the other arrangement | positioning of the spacer of the bonded substrate which concerns on embodiment of this invention.
6 is a comparison diagram of the substrate restraint force of the bonded substrate according to the embodiment of the present invention.

(Form to carry out invention)

EMBODIMENT OF THE INVENTION Below, this invention is demonstrated in detail based on drawing which shows embodiment. Hereinafter, the bonding board | substrate is a mother glass which cuts out the display panel for LCDs, and demonstrates the case where the display panels for four LCDs are cut out from the mother glass formed by bonding two glass substrates.

1: is a top view which shows typically the structure of the bonded substrate which concerns on embodiment of this invention. As shown in FIG. 1, the bonding board | substrate 1 which concerns on this embodiment is mother glass which bonded together two sheets of plate-shaped brittle material, for example, a glass plate. In the example of FIG. 1, four display panels 10, 10, ... for LCDs are cut out from the mother glass (bonded substrate) 1. At both ends of the mother glass 1, inspection electrodes for inspecting the movable states of the four display panels 10, 10,... For the LCDs are edge members 12 and 12 at both ends of the mother glass 1. Extends to

2 is a partial cross-sectional view schematically showing the configuration of the vicinity of the edge member 12 of the bonded substrate 1 according to the embodiment of the present invention. As shown in FIG. 2, the bonding substrate 1 is bonded through the sealing member 4 while the upper and lower glass substrates 21 and 22 maintain a predetermined interval by the spacers 5, 5,... It is. The electrode 3 is arrange | positioned at the inner surface side of the glass substrate 22, and at the time of the inspection of a movable state, the edge member 12 of the glass substrate 21 is divided along the scribe line 13, and the electrode 3 ) To the outside.

In this embodiment, the board | substrate restraint force between two glass substrates 21 and 22 of upper and lower sheets is reduced by arrange | positioning the spacers 5, 5, ... at a fixed interval. In FIG. 2, although the rectangular parallelepiped spacer is shown typically, you may use the spacer of other shapes, such as column shape and spherical shape.

3 is a perspective view showing the shape of the spacer 5. The spacers 5 have a rectangular parallelepiped shape having a height of 5 μm in 100 μm squares, and in the present embodiment, the spacers 5, 5,... Are arranged at intervals of 2.5 mm. The spacers 5, 5,... Are arranged in sequence from the display panel 10 side of the edge member 12.

4 is a schematic diagram showing the arrangement of the spacers 5, 5, ... of the bonded substrate 1 according to the embodiment of the present invention. The spacers 5, 5,... Are arranged from the scribe line 13 side among the edge members 12, and are arranged in five rows from the scribe line 13 side, and the interval between the spacers 5, 5 is provided. Are disposed so as to be 2.5 mm from each other. The space | interval of the spacers 5 and 5 is not limited to this, It should just be 3 mm or less.

In the case of dividing the edge member 12, the scribe groove is formed along the scribe line 13, and then the edge member 12 is divided by applying a load. Since the edge restraint member 12 reduces the substrate restraint force by arranging the spacers 5, 5,..., When the edge member 12 is divided along the scribe line 13, the edge member 12 is easily attached to the glass substrate 22. ) Can be separated. In addition, the above-mentioned "scribing groove" is penetrated in the thickness direction of the board | substrate formed by scribing process using a scribing wheel, laser scribing process which laser-heats and cools the glass substrate 21 along a scribe line, for example. It means a crack of a predetermined depth that does not.

In addition, in the case where the edge member 12 is divided by forming a crack penetrating in the thickness direction of the substrate by heating and cooling the glass substrate 21 along the scribe line 13, the spacers 5, 5,... Since the substrate restraining force is reduced by the arrangement, cracks can be reliably formed along the scribe line 13 without disturbing the displacement of the edge member 12.

In this case, it is preferable that the area of the area | region A2 in which the spacers 5, 5, ... are arrange | positioned is approximately 70% or more of the area of the area | region A1 corresponded to the edge member 12. As shown in FIG. This is because it is possible to reliably divide one glass substrate 21 by being approximately 70% or more. In addition, "the area of the area | region A2 in which the spacers 5, 5, ... are arrange | positioned" means the spacers 5, 5, ... arrange | positioned at the outermost side among the spacer group arrange | positioned at predetermined space | intervals mutually. The area inside the enclosing line is shown, and spacers 5, 5, ... are arranged regularly throughout the longitudinal direction of the edge member 12 in m rows and n columns (m and n are natural numbers) as shown in FIG. In this case, it means the area of m rows in which the spacers 5, 5, ... are arranged, that is, the area of 5 rows.

Therefore, the spacers 5, 5, ... are not limited to being arranged in a matrix form from the scribe line 13 side in the electrode region, which is the region where the electrode 3 extends, and the spacers 5, 5, The area of the area A2 where the ... is arranged is not particularly limited as long as the area becomes approximately 70% or more of the area of the area A1 corresponding to the edge member 12. For example, the scribe line ( You may arrange | position randomly by disperse | distributing particle | grain spacer 5, 5, ... in a predetermined range from the 13) side. FIG. 5: is a schematic diagram which shows the other arrangement | positioning of the spacers 5, 5, ... of the bonded substrate 1 which concerns on embodiment of this invention.

Unlike in FIG. 4, the spacers 5, 5,... Are dispersed at a predetermined distribution density in a predetermined range from the scribe line 13 side of the edge member 12, and the intervals of the spacers 5, 5 are It is arrange | positioned so that it may become 3 mm or less mutually.

6 is a comparison diagram of the substrate restraint force of the bonded substrate 1 according to the embodiment of the present invention. FIG. 6 shows a space between two glass substrates 21 and 22 of the bonded substrate 1 in which spacers 5, 5,... Which are substantially rectangular parallelepiped having a height of 5 μm in 100 μm directions are arranged at 2.5 mm intervals. The result of measuring the board | substrate restraint force is shown. In the measurement, one end of the edge member 12 segmented by the scribe line 13 is parallel to one surface of the glass substrate 21, and in addition, the edge member 12 is pulled in a direction orthogonal to the scribe line 13. Separated from the glass substrate 22, the maximum value of the tensile force was made into the board | substrate restraining force.

In addition, the group A shows the measurement result when the spacers 5, 5, ... are not arranged, and the group B shows the spacers 5, 5, ... approximately 2.5 mm apart from the edge member 12. ), The group C shows the measurement results in the case where the spacers 5, 5, ... are disposed almost at the entire surface of the edge member 12 at 2.5 mm intervals. In addition, the measurement result which is not hatched for each group shows the measurement result when water is contained between two glass substrates 21 and 22, and the measurement result which is hatched shows two glass substrates 21 and 22 The measurement result when there is little moisture contained in) is shown, respectively.

First, in the case of comparing the measurement results which are hatched, the substrate binding force is the largest in the measurement result 64 of the group A in which the spacers 5, 5, ... are not arranged, and the spacers 5, 5,... ) And the spacers 5, 5,... Of the group B having approximately 2.5 mm spaced apart from the edge member 12 at about 2.5 mm, and the spacers 5, 5,... It decreases sequentially by the measurement result 66 of group C. Therefore, the larger the ratio of the area occupied by the area in which the spacers 5, 5, ... are disposed, the smaller the substrate restraint force between the two glass substrates 21, 22 becomes, and the edge member of the one glass substrate 2 becomes smaller. Obviously, it becomes easy to separate (12).

In addition, when comparing the measurement result which is not hatched, the board | substrate restraint force is 2.5 to the measurement result 61 of the group A which does not arrange the spacers 5, 5, ..., and the spacers 5, 5, .... The measurement result 62 of the group B, which is roughly the other side of the edge member 12 at the mm interval, is not so changed. However, the measurement result 63 of the group C which arrange | positioned the spacers 5, 5, ... on the substantially whole surface of the edge member 12 by 2.5 mm space | interval is reduced compared with another measurement result.

Usually, when moisture is contained between two glass substrates 21 and 22, it is assumed that the board | substrate restraint force between glass substrates 21 and 22 becomes large by the surface tension of moisture. However, in the case where the spacers 5, 5,... Are disposed on the entire surface of the edge member 12, the spacers 5, 5,... Are arranged in that the substrate restraining force is reduced in comparison with other measurement results. When the ratio of the area which one area | region occupies exceeds a fixed ratio, it turns out that it is easy to segment the edge member 12 of one glass substrate 2, without being influenced by surface tension. Experimentally, the board | substrate restraining force is reduced from the time of arrange | positioning the spacers 5, 5, ... on the surface of approximately 70% of the edge member 12 by 2.5 mm space | interval.

As mentioned above, according to this embodiment, the board | substrate restraint force between one board | substrate and the other board | substrate of a bonded substrate is reliably reduced also in the edge part of a bonded substrate. Therefore, the edge member of one board | substrate which opposes the other board | substrate can be reliably divided and isolate | separated from the other board | substrate, For example, in the bonding board | substrate for LCD, an internal terminal can be reliably exposed to the outside. Can be.

In addition, a bonding board | substrate is not limited to the mother glass containing the display panel for LCD, It is not specifically limited if it is a bonding board which bonds two brittle materials, and needs to isolate the edge member of one board | substrate. . In addition, it is not limited to the mother glass containing the display panel for LCDs, When each display panel is cut out and it divides the edge member of one glass substrate of a display panel unit | piece in order to use for driving, operation confirmation, etc. of a display element. The same effect can be expected also in. In addition, it goes without saying that various kinds of modifications, substitutions and the like are possible within the scope of the gist of the present invention.

1: mother glass (bonding substrate)
2: glass substrate
3: electrode
4: sealing material
5: spacer
10: display panel
12: edge member
13: scribe line

Claims (8)

In the splitting method of the bonded substrate which divides the edge member which is an edge part which opposes the other board | substrate of one board | substrate of the bonded board | substrate which joined two board | substrates which consist of brittle materials from the said other board | substrate,
Spacers are disposed at intervals of 3 mm or less between the edge member and the other substrate facing the edge member,
The said board | substrate division method of arrange | positioning so that the area of the area | region where the said spacer is arrange | positioned may be 70% or more of the area of the said edge member. The method of claim 1,
And said bonding substrate is a substrate for LCD. The method of claim 2,
And the spacer is arranged in a plurality of rows and columns from the scribe line separating the edge member toward the end of the substrate. The method of claim 1,
And the spacer is arranged at a predetermined distribution density from the scribe line separating the edge member toward the end of the substrate. In the bonded substrate which bonded two board | substrates which consist of brittle materials,
Spacers are arranged at intervals of 3 mm or less between an edge member of one substrate, which is an end portion facing the other substrate, and the other substrate facing the edge member,
The bonding substrate is arrange | positioned so that the area of the area | region where the said spacer is arrange | positioned may become 70% or more of the area of the said edge member. The method of claim 5,
The bonded substrate is a bonded substrate, characterized in that the substrate for LCD. The method of claim 6,
The spacer is arranged in a plurality of rows and columns from the scribe line separating the edge member toward the end of the substrate. The method of claim 5,
And the spacer is arranged at a predetermined distribution density from the scribe line separating the edge member toward the end of the substrate.

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