201107256 六、發明說明： 【發明所屬之技術領域】 本發明係關於可於將二片基板貼合之貼合基板 板之端構件從另—暮杯以古脖疮八龄 土 法及貼合基板 暴扳以同精度分斷之貼合基板之分斷大 【先前技術】 有需要使將玻璃板等板狀之脆性材料二片貼合之貼八 基板之-基板從另-基板分斷之加卫之必要之場合。例如 貼合基板㈣出用於液晶顯示裝置之LCD等顯示面板之: 玻璃之場合’ II由分斷母玻璃之一基板之端構件而切出， 可使形成於内部之電極往外部露出，可與外部電極等以電 氣方式連接。藉此，可於從母玻璃切出顯示面板前進行作 動確認等。 例如在專利文獻1有揭示藉由沿使用劃線器形成之劃 線分斷而將已貼合之玻璃基板之一基板之端部分離，使形 成於另一基板之端部之電極露出之方法。 此外’在專利文獻2有揭示將基板保持為不會妨礙沿 基板之主面之移動，藉由沿分斷預定線加熱及冷卻玻璃基 板以使基板之内部產生熱應力，形成於基板之厚度方向貫 通之龜裂以分斷基板之方法。 專利文獻1 :日本特開平06-305757號公報 專利文獻2 :日本特開2007-191363號公報 【發明内容】 3 201107256 [發明欲解決之課題] 然而，即使為可於一基板形成既定之深度之龜裂，沿 形成之龜裂分斷一基板之場合’在拘束已貼合之基板彼此 之力即基板拘束力較大之場合，以往係產生將分斷後之一 基板從另一基板分離困難之狀況。此外，在藉由將貼合基 板之一基板雷射加熱及冷卻而形成於基板之厚度方向貫通 之龜裂以分斷玻璃基板之場合，在拘束已貼合之基板彼此 之力即基板拘束力較大之場合，於基板之厚度方向貫通之 龜裂之形成較困難。此種問題被認為是因已貼合之基板彼 此密著而產生，特別是以雷射加熱及冷卻分斷基板之場 合，殘留於基板之冷卻水之表面張力效果使已貼合之基板 間之基板拘束力更增大，分斷已貼合之基板或將已被分斷 之一基板從另一基板分離更加困難。 在專利文獻1雖係將構成貼合基板之一基板之端部沿 劃線分斷，但將分斷後之端構件分離之方法並未被揭示。 因此，即使在使設於顯示面板之端部之電極露出之加工之 場合'以二氧化碳雷射等分斷端部之一基板之場合，使分 斷後之端構件從另一基板分離困難之問題未解決。 此外，在專利文獻2在藉由雷射加熱及冷卻單板之義 板形成於基板之厚度方向貫通之龜裂以分斷基板之場人 以變形為不妨礙伴隨龜裂之形成之基板之位移之導引^件 夾持基板之端面。然而，關於分斷貼合基板之—基板之p 合之基板之位移並未被考慮。因此，在分斷貼合基板之 基板之場合，由於龜裂之形成因拘束已貼合基板彼此之力 即基板拘束力而受妨礙’故分斷困難之問題未解決。 201107256 本發明係鑑於上述事由而為，以提供可於將二片基板 貼合之貼合基板將一基板之端構件從另一基板以高精^分 斷之貼合基板之分斷方法及貼合基板為目的。 刀 [解決課題之手段] 為達成上述㈣，第i發明之貼合基板之分斷方法， 係將貼合由脆性材料構成之二片基板而成之貼合基板中一 基板之與另一基板對向之端部即端構件從該另—基板八 斷’其特徵在於：於前述端構件與對向於該端構件：另： 基板之間’以彼此相距3 mm以下之間隔配置間隔件；前述 述I槿杜&置係使配置有刚述間隔件之區域之面積達前 遂知構件之面積之70 %以上。 此外，第2發明之貼合基板之分斷方法係如第i發明 之貼合基板之分斷方法’其中，前述貼合基板為咖用基 板。 土 此外，第3發明之貼合基板之分斷方法係如第之發明 之貼合基板之分斷方法，其中， 、 刚述間隔件係從分斷前述 知構件之劃線往基板之端部以複數之行及列配置。 :外’第4發明之貼合基板之分斷方法係如第丨發明 之貼&基板之分斷方法，直中， 迪棋从 ，、中則述間隔件係從分斷前述 %構件之劃線往基板之端部以既定之分布密度配置。 其次，為達成上述目的，第2發明之 :::材料構成之二片基板貼合’其特徵在於··： = -基板於二一基板之端部即端構件與對向於該端構件之另 前述間㈣’以彼此相距3 _以下之間隔配置有間隔件； 隔件之配置，係使配晉右 便配置有則述間隔件之區域之面積 201107256 達前述端構件之面積之7 L υ /〇以上。 此外，帛6發明係如 述貼合基板為LCD用基板。 明之貼合基板，其中，前 此外，第7發明係如第 述間隔件係從分斷前述端構 之行及列配置。 6發明之貼合基板，其中，前 件之劃線往基板之端部以複數 其申，前 部以既定 此外，第8發明係如第 .+. „ . 罘5發明之貼合基板 述間隔件係從分斷前述端 做 t八右^ 件之畫彳、線往基板之却 之分布密度配置。 在第1發明、第2發明、第5發 脆性材料構成之二片基板貼合之貼合基板之月係將由 於另一基板之端部即端構件 — ^之對向 從另—基板分斷。於貼合基板 之舳構件之既定範圍以彼屮 站丄 彼此3 mm以下之間隔配置間隔件。 藉由將前述間隔件配晉兔 干己置為配置有前述間隔件之區域之面積 為從貼合基板被分斷之—基板之前述端構件之面積之70 % 以上’貼合基板之一基板與另一基板之間之基板拘束力於 貼合基板之端部亦確實降低…，可將一基板之對向於 另一基板之端冑即端構件板確實分斷及分離，於 例如LCD用之貼合基板，可將内部之端子確實往外部露 出。另外，「配置有間隔件之區域之面積」係指彼此以既 叱之間隔配置之間隔件群之中，連結配置於最外側之間隔 件之包絡線内之面積。 在第3發明及第7發明係藉由將間隔件從分斷前述端 構件之劃線往基板之端部以複數之行及列配置，使一基板 與另一基板之間之基板拘束力於貼合基板之端部亦確實降 201107256 低。因此’可將—基板之對向於另—基板之端部即端構件 從另一基板確實分斷及分離，可將内部之端子確實往外 露出。 第4發明及第8發明係藉由將間隔件從分斷前述端 構件之劃線往基板之端部以既定之分布密度配置使一基 板與另-基板之間之基板拘束力於貼合基板之端部亦破實 降低。因Λ ’可將一基板之對向於另一基板之端部即端構 件從另-基板確實分斷及分離，可將内部之端子確 部露出。 [發明之效果] 藉由上述構成，貼合基板之一基板與另一基板之間之 基板拘束力於貼合基板之端部亦確實降低，因此，可將一 基板之對向於另一基板之端部即端構件從另—基板確實分 斷及分離’於例如LCD用之貼合基板，可將内部之端子確 實往外部露出。 【實施方式】 以下基於顯示其實施型態之圖面詳細說明本發明。以 下，針對貼合基板係切出LCD用之顯示面板之母玻璃，從 貼合2片玻璃基板而形成之母玻璃切出4片用之顯示 面板之場合說明。 圖1係示意顯示本發明之實施形態之貼合基板之構成 之俯視圖。如目1所示’本實施型態之貼合基板】係將板 狀之脆性材料，例如玻璃板表裡2片貼合之母玻璃。在圖^ 之例係從母玻璃（貼合基板}1切出4片LCD用之顯示面板 201107256 1面0板：..u)。、於ΓΓ1之兩端，檢查4片LCD用之顯示 兩端之端構件::;2動狀態之檢查電腦延出至母玻璃k 7 2係示意顯示本發明之實施形態之 …y 七刀剖面圖。如圖2所示，貼合基板i係 之間隔祐璃基板21、22藉由間隔件1 2 3 4 5、1、.·.保持既定 内面“’隔捃封材4貼合。電極3係配置於玻璃基板22之 貝_，於作動狀態之檢查時係將玻璃基板21 沿劃線13分斷並使電極3往外部露出。 構件12 在本實施型態係藉由將間隔件5、5、... 隔以使上下2 w， 間 片之玻璃基板21 ' 22間之基板拘束力減少。 :圖2雖係示意顯示長方體形狀之間隔件，但使用圓柱形 狀球狀等其他形狀之間隔件亦可。 圖3係顯示間隔件5之形狀之立體圖。間隔件”系⑽ 2^5平：：度5 "爪之長方體形狀’在本實施型態係以 2.5mm間隔配置間隔件5、5、…。間隔件卜5、... 構件12之顯示面板10側依序配置。 5、5S..42=:之實㈣態之貼合基板1之間隔件 配置之不思圖。間隔件1、1、...係在端構件12 中，從劃線13側配置，從劃線13側以5行配置，間隔件$、 8 1 之間隔係配置為彼此距離2.5mm。間隔件5、5 2 間隔並不限於此’只要是3mm以下即可。 3 在使端構件12分斷之場合，係在沿劃線13形成劃線 4 槽後，給予荷重將端構件丨2分斷。由於端構件12因配 5 間隔件5、5、…而基板拘束力減少，故於沿劃線ο分斷之 201107256 場合，可容易將端構件12從玻璃基板22分離。另外，上 述之「劃線槽」係指以使用劃線輪之劃線加工 射加熱及冷卻玻璃基板21之雷射劃線加卫等形成:於= 之厚度方向不貫通之既定深度之龜裂。 ' 此外’在藉由沿劃線13加熱及冷卻麵基板η形成 於基板之厚度方向貫通之龜裂以分斷端構件12之尸人 於因配置間隔件5、5 '… 。，由 土板拘束力減y ’故端構件1 2 之位移不會受到妨礙，可沿劃線！ 3確實形成龜裂。 在此場合，配置有前述間隔件5、5、...之區域Μ 積為相當於前述端構件12之區域A1之面積之大致7〇%以 上較理想。其原因係、藉由大致為7G %以上，可將—方之 璃基板21確實分斷。另外，所謂「配置有前述間隔件5、5之… 之區域A2之面積」係指彼此以既^之間隔配置之間隔件群 =配置於最外側之間隔件5、5、...之包絡線内之 面積，如圖4間隔件5、5、…以列(m、n為自然數) 於如構件12之長邊方向全域整齊 、、 场合，係指配置有 “件5、5、·..之m行之量之面積…行之量之面積。 因此’間隔件5、5、...並不限於在電極3延出之區域 即電極區域從劃線13側行列狀 隔件5、5、.··之區域A2之面積為二二要配置有前述間 曲積為相§於則述端構件12之 二之面積之大致70 %以上之配置，並無特別限定， 由從劃線13將粒子狀之間隔件H、·..散佈於既 ^ ^而隨機配置亦可。,5係顯示本發施㈣ :基板1之間隔件5、5、·.·之其他配置之示意圖。 與圖4不同，間隔件5、5、...係從端構件12 9 201107256 13侧以既定之分布密度散佈於既定之範圍，間隔件$、$、... 之間隔係配置為彼此距離3mm以下。 圖6係本發明之實施形態之貼合基板之基板拘束力之 比較圖。® 6係顯示測定將_ # m平方高度5 "⑺之大致 長方體形狀之間隔件5 ' 5、...以2·5_間隔配置之貼合基 板1之2片之玻璃基板21、22間之基板拘束力之結果。於 測定中，將被以劃線13分斷之端構件12之一端往平行於 玻璃基板21之一面且與劃線13正交之方向拉以使 12從玻璃基板22分離，以拉力之最大值為基板拘束力。 此外’族群A係顯示未配置間隔件5、5、…之場合之 測定結果，族群B係顯示將間隔件5、5、...以2·5_間隔 配置於端構件12之大料面之場合之測定結果，族群c係 顯示將間隔件5、5、...以2.5mm間隔配置於端構件η之 大致全面之場合之測定結果，另彳，各族群未標斜線之測 定，:果係表示2片之玻璃基板2卜22間含有水分之場合之 測定結果，各料標斜線之敎結㈣表# 2片之玻璃基 板2 1、22間含有水分較少之場合之測定結果。 首先，比較標斜線之測定結果之場合，基板拘束力係 未配置間隔件5、5、··.之族群人之測定結果64最大，以下， 將間隔件5、5、...以2.5mm間隔配置於端構件Η之大致 半面之族群B之測定結果65、將間隔件5、5、…以25 間隔配置於端構件12之大致全面之族群c之測定結果: 依序減少。因此，配置間隔件5、5、·..之區域之佔有面積 越大’ 2片之玻璃基板21、22間之基板拘束力越小，容易 將一方之玻璃基板2 1之端構件1 2分離。 10 201107256 勿δ ，暴板拘束六 係未配置間隔件5、5、…之族群八之 米力 ^ . , j疋結果61與將間隔 件5、5、…以2.5mm間隔配置於端構件12之大致半 族群B之測定結果62無明顯差異。然而，㈣隔件5、5面之 以2.5mm間隔配置於端構件12之大 . 王®J之族群C之測定 結果63比其他測定結果減少。 〜 通常，2片之玻璃基板21、22間含有水分之場合 想像水分之表面張力會使玻璃基板21、22間之基板 變大。然而’從於將間隔件5、5、...以25_間隔配置於 端構件之大致全面之場合基板拘束力 其他測定結果減少可得知，在配置間隔件5、5、…之區域 之佔有面積之比例超過一定之比例之場合，不會受到表面 張力之影響’容易將-方之玻璃基板21之端構件Η分斷。 實驗上，將間隔件5、5、...以2.5_間隔配置於端構件12 之大致70%之面時基板拘束力開始減少。 如上述根據本實施型態，貼合基板之一基板與另一基 板之間之基板拘束力於貼合基板之端部亦確實降低，因 此可將-基板之對向於另一基板之端部即端構件從另— 基板確實分斷及分離，於例如LCD用之貼合基板，可將内 部之端子確實往外部露出。 另外，貼合基板並不限於包含LCD用之顯示面板之母 :璃’只要是冑2片脆性材料貼合且有將一基板之端構件 2之必要之貼合基板，並無特別限定。此外，並不限於 包含LCD用之顯示面板之母玻璃，於將顯示面板個別切出 支為用於顯不元件之驅動、作動確認等而將顯示面板$ 201107256 可期待同等之 為多種變形、 體之一方之玻璃基板之端構件分斷之場合亦 效果。另外，只要在本發明之主旨之範圍内可 置換等。 【圖式簡單說明】 圖1係示意顯示本發明之實施形態之貼合基板之構成 之俯視圖。 圖2係示意顯示本發明之實施形態之貼合基板之端構 件附近之構成之部分剖面圖。 圖3係顯示間隔件之形狀之立體圖。 圖4係顯示本發明之實施形態之貼合基板之間隔件之 配置之不意圖。 圖5係顯示本發明之實施形態之貼合基板之間隔件之 其他配置之示意圖。 圖6係本發明之實施形態之貼合基板之基板拘束力之 比較圖。 【主要元件符號說明】 1 母玻璃（貼合基板） 2 玻璃基板 3 電極 4 密封材 5 間隔件 顯示面板 12 端構件 12 201107256 13 劃線 13201107256 VI. Description of the Invention: [Technical Field] The present invention relates to an end member of a laminated substrate board which can be bonded to two substrates, and a squeezing eight-age soil method and a bonding substrate from another cup The breaking of the bonded substrate with the same precision is large [Prior Art] There is a need to make the plate-like brittle material such as a glass plate adhere to the eight substrates - the substrate is separated from the other substrate The occasion of the need for Wei. For example, a bonding substrate (4) is used for a display panel such as an LCD for a liquid crystal display device: In the case of glass, II is cut out by dividing an end member of one of the mother glass substrates, and the electrode formed inside can be exposed to the outside. Electrically connected to an external electrode or the like. Thereby, it is possible to confirm the operation before cutting out the display panel from the mother glass. For example, Patent Document 1 discloses a method of separating an end portion of a substrate on which a bonded glass substrate is separated by using a scribe line formed by using a scriber to expose an electrode formed at an end portion of another substrate. . Further, in Patent Document 2, it is disclosed that the substrate is held so as not to hinder the movement along the main surface of the substrate, and the glass substrate is heated and cooled along the predetermined line to cause thermal stress inside the substrate to be formed in the thickness direction of the substrate. A method of breaking a substrate by breaking through the crack. Patent Document 1: Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. No. 2007-191363. In the case where the crack is broken along the formed crack, when the substrate is restrained, that is, the substrate binding force is large, it is difficult to separate one of the substrates from the other substrate. situation. In addition, when a glass substrate is formed by laser-heating and cooling of one of the substrates of the bonded substrate to form a crack in the thickness direction of the substrate, the substrate is restrained by the force of the bonded substrates. In the larger case, it is difficult to form a crack that penetrates in the thickness direction of the substrate. This problem is thought to occur because the bonded substrates are adhered to each other, especially when the substrate is separated by laser heating and cooling, and the surface tension effect of the cooling water remaining on the substrate is between the bonded substrates. The substrate binding force is further increased, and it is more difficult to separate the bonded substrates or to separate one of the substrates that have been separated from the other substrate. In Patent Document 1, the end portion of the substrate constituting one of the bonded substrates is separated by a scribe line, but the method of separating the end members after the separation is not disclosed. Therefore, even in the case where the electrode provided at the end portion of the display panel is exposed, when one of the ends of the substrate is broken by a carbon dioxide laser, it is difficult to separate the separated end member from the other substrate. solve. Further, in Patent Document 2, a crack that penetrates the thickness direction of the substrate by a laser heating and cooling plate is used to break the substrate to deform the substrate so as not to hinder the displacement of the substrate accompanying the formation of the crack. The guiding member holds the end surface of the substrate. However, the displacement of the substrate in which the substrate is p-bonded to the bonded substrate is not considered. Therefore, when the substrate of the bonded substrate is separated, the formation of the crack is hindered by the constraint that the force of the bonded substrates is the substrate binding force, so that the problem of difficulty in breaking is not solved. 201107256 The present invention is directed to the above-mentioned problem, and provides a method and a method for attaching a substrate which can be bonded to a substrate on which a two-piece substrate is bonded, and an end member of one substrate is highly separated from another substrate. For the purpose of combining substrates. Knife [Means for Solving the Problem] In order to achieve the above-mentioned (4), the method for dividing the bonded substrate of the first aspect of the invention is to bond one substrate of the bonded substrate and the other substrate to the other substrate The opposite end portion, that is, the end member is broken from the other substrate, wherein the spacer member is disposed at an interval of 3 mm or less from each other between the end member and the opposite end member: The above-mentioned I 槿 Du & system is arranged such that the area of the region in which the spacer is disposed is 70% or more of the area of the front known member. Further, the method for dividing a bonded substrate according to the second aspect of the invention is the method for dividing a bonded substrate according to the first aspect of the invention, wherein the bonded substrate is a coffee substrate. Further, the method for dividing a bonded substrate according to the third aspect of the present invention is the method for dividing a bonded substrate according to the first aspect of the present invention, wherein the spacer is formed by cutting a line from the member to the end of the substrate Configured in multiple rows and columns. The method for breaking the bonded substrate of the fourth invention is the method for dividing the substrate of the second invention, and the method for dividing the substrate, wherein the spacer is separated from the % member. The scribe lines are arranged at the ends of the substrate at a predetermined distribution density. Next, in order to achieve the above object, the second invention is characterized in that: the two substrates of the material are bonded together, which are characterized in that: - the substrate is at the end of the two-piece substrate, that is, the end member and the opposite end member. In addition, the above-mentioned room (4) is provided with spacers at intervals of 3 _ or less from each other; the partition is arranged such that the area of the area in which the spacer is disposed is 201107256 up to 7 L of the area of the end member. /〇 above. Further, the invention of Fig. 6 is that the bonded substrate is a substrate for LCD. Further, in the seventh aspect of the invention, the spacer according to the seventh aspect of the invention is characterized in that the spacer is arranged in a row and a row in which the end structures are separated. In the laminated substrate of the invention, the scribe line of the front piece is applied to the end portion of the substrate in a plurality of portions, and the front portion is provided in a predetermined manner, and the eighth invention is in the form of a laminated substrate according to the invention of the first +. „5. The parts are arranged in a distribution density from the drawing of the first end, the line to the substrate, and the two substrates of the first invention, the second invention, and the fifth brittle material. The moon of the combined substrate is separated from the other substrate by the end of the other substrate, that is, the end member. The predetermined range of the members of the bonded substrate is arranged at intervals of 3 mm or less from each other. The area of the region in which the spacer is disposed with the spacer is 70% or more of the area of the end member of the substrate which is separated from the bonded substrate. The substrate restraining force between one of the substrates and the other substrate is also reduced at the end of the bonded substrate. The end plate of the substrate opposite to the other substrate can be surely separated and separated. For example, a bonding substrate for LCD can make the internal terminals go out. Is exposed. Further, "an area arranged the spacer area" means the group into one another spacer member disposed in both the hoot of the spacer, coupling arranged in the area within the envelope of the outer spacer member most. In the third invention and the seventh invention, the spacer is placed in a plurality of rows and columns from the end portions of the substrate from the scribe lines dividing the end members, so that the substrate between the one substrate and the other substrate is restrained. The end of the bonded substrate also drops to low 201107256. Therefore, the end member which is the opposite end of the substrate to the other substrate can be surely separated and separated from the other substrate, and the internal terminal can be surely exposed. According to the fourth invention and the eighth aspect of the invention, the spacer is disposed at a predetermined distribution density from the end portion of the substrate from the scribe line dividing the end member, and the substrate between the substrate and the other substrate is restrained to the bonded substrate. The end is also broken. Since the end member of one substrate opposite to the other substrate, that is, the end member is surely separated and separated from the other substrate, the internal terminal can be surely exposed. [Effects of the Invention] According to the above configuration, the substrate restraining force between one of the substrates on the bonded substrate and the other substrate is surely lowered at the end portion of the bonded substrate, so that one substrate can be opposed to the other substrate. The end member, that is, the end member is surely separated and separated from the other substrate, for example, to a bonded substrate for LCD, and the internal terminal can be surely exposed to the outside. [Embodiment] Hereinafter, the present invention will be described in detail based on the drawings showing the embodiments thereof. In the following, the mother glass of the display panel for LCD is cut out from the bonded substrate, and the display panel for cutting four sheets of the mother glass formed by bonding the two glass substrates is described. Fig. 1 is a plan view schematically showing the configuration of a bonded substrate according to an embodiment of the present invention. The bonded substrate of the present embodiment is a brittle material in the form of a plate, for example, a mother glass in which two sheets of a glass plate are bonded to each other. In the example of Fig. 2, four display panels for LCD are cut out from the mother glass (bonding substrate} 1 201107256 1 face 0 board: .. u). At the two ends of the ΓΓ1, check the end members of the display terminals of the four LCDs::; 2 Checking the dynamic state of the computer to the mother glass k 7 2 shows the embodiment of the present invention... y seven-knife profile Figure. As shown in Fig. 2, the spacer glass substrates 21 and 22 of the bonded substrate i are held by the spacers 1 2 3 4 5, 1, . . . to maintain the predetermined inner surface "the spacers 4 are bonded together. The glass substrate 22 is placed in the glass substrate 22, and the glass substrate 21 is separated along the scribe line 13 and exposed to the outside. The member 12 is in the present embodiment by the spacers 5, 5. Between the upper and lower sides, the substrate holding force between the glass substrates 21'22 of the upper and lower sides is reduced. Fig. 2 shows the spacers in the shape of a rectangular parallelepiped, but the spacing between other shapes such as a cylindrical shape is used. Fig. 3 is a perspective view showing the shape of the spacer 5. The spacer is "10" 2^5 flat: : degree 5 & "claw shape of the claws'. In this embodiment, the spacers 5 are arranged at intervals of 2.5 mm. , 5, .... The spacers 5, ... are arranged in the order of the display panel 10 side of the member 12. 5, 5S..42=: The real (four) state of the spacer of the substrate 1 is not considered. The spacers 1, 1, and ... are disposed in the end member 12 from the side of the scribe line 13 and arranged in five rows from the side of the scribe line 13, and the intervals of the spacers $, 8 1 are disposed at a distance of 2.5 mm from each other. The interval between the spacers 5 and 5 2 is not limited to this as long as it is 3 mm or less. 3 When the end member 12 is broken, after the scribe line 4 is formed along the scribe line 13, the end member 丨2 is divided by giving a load. Since the end member 12 is reduced in the substrate restraint force by the spacers 5, 5, ..., the end member 12 can be easily separated from the glass substrate 22 in the case of 201107256 which is broken along the scribe line. In addition, the above-mentioned "scratch groove" refers to a crack formed at a predetermined depth that does not penetrate in the thickness direction of the laser beam by heating and cooling the glass substrate 21 by using a scribing wheel. . Further, in the case where the surface of the substrate is heated and cooled by the scribe line 13, the crack is formed in the thickness direction of the substrate to divide the end member 12, and the spacers 5, 5' are disposed. , by the restraining force of the soil plate, the displacement of the y ′ end member 1 2 will not be hindered, and it can be traced along! 3 does form a crack. In this case, it is preferable that the area of the spacers 5, 5, ... is substantially equal to or larger than the area of the area A1 of the end member 12. The reason for this is that the glass substrate 21 can be surely separated by approximately 7 G% or more. In addition, the "area of the area A2 in which the spacers 5, 5 are disposed" means the group of spacers which are disposed at intervals of each other, and the envelopes of the spacers 5, 5, ... disposed on the outermost side. The area inside the line, as shown in Fig. 4, the spacers 5, 5, ... are in the column (m, n are natural numbers). If the entire length of the member 12 is neat, the case is assigned "pieces 5, 5, · The area of the amount of m rows is the area of the amount of rows. Therefore, the spacers 5, 5, ... are not limited to the row-shaped spacers 5 from the side of the scribe line 13 in the region where the electrode 3 is extended, that is, the electrode region. The area of the area A2 of 5, . . . is not particularly limited, and the area of the area A2 is set to be approximately 70% or more of the area of the second member 12 of the end member 12, and is not particularly limited. The line 13 may be arranged in a random arrangement in which the particle-shaped spacers H and . . . are arranged in a random manner. The fifth system shows the present configuration (four): a schematic view of other arrangements of the spacers 5, 5, ... of the substrate 1. Unlike FIG. 4, the spacers 5, 5, ... are interspersed from the end member 12 9 201107256 13 side at a predetermined distribution density within a predetermined range, and the spacers $, $, ... are spaced apart. Fig. 6 is a comparison diagram of the substrate restraining force of the bonded substrate according to the embodiment of the present invention. The ® 6 series shows a spacer 5 for measuring a substantially rectangular parallelepiped shape of _# m square height 5 " (7) '5. The result of the substrate restraining force between the two glass substrates 21 and 22 of the bonded substrate 1 which are arranged at intervals of 2. 5 mm. In the measurement, the end member which is broken by the scribe line 13 is used. One end of 12 is pulled parallel to one surface of the glass substrate 21 and perpendicular to the scribe line 13 to separate 12 from the glass substrate 22, and the maximum value of the tensile force is the substrate binding force. Further, the 'group A system shows the unconfigured spacers. In the case of the measurement results of 5, 5, ..., the group B shows the measurement results when the spacers 5, 5, ... are arranged at intervals of 2. 5 mm on the large surface of the end member 12, and the group c shows The measurement results of the case where the spacers 5, 5, ... are arranged at an interval of 2.5 mm at substantially the entire end member η, and the measurement of the unslanted lines of each group are as follows: the fruit system represents two glass substrates 2 The results of the measurement of 22 cases containing moisture, the slanting line of each material mark (4) Table # 2 glass base When the results of the measurement of the oblique line are compared between the plates 2 and 22, the substrate binding force is the maximum of the measurement results of the group of people 5, 5, and . Hereinafter, the measurement results 65 of the group B in which the spacers 5, 5, ... are disposed at intervals of 2.5 mm on the substantially half of the end member 、, and the spacers 5, 5, ... are disposed at the interval of the end member 12 at intervals of 25 As a result of the measurement of the population of the group c, the area of the spacers 5, 5, ... is larger. The smaller the substrate binding force between the two glass substrates 21 and 22 is, the easier it is. The end member 1 2 of one of the glass substrates 2 1 is separated. 10 201107256 Do not δ, the violent plate restrains the six-line unconfigured spacers 5, 5, ... the group of eight meters of force ^. , j 疋 results 61 and the spacers 5, 5, ... at 2.5mm intervals at the end member 12 There was no significant difference in the measurement result 62 of the approximate semi-group B. However, (4) The spacers 5 and 5 are arranged at an interval of 2.5 mm at the end member 12. The measurement result of the group C of the king® J is reduced by 63. ～ In general, when moisture is contained between two glass substrates 21 and 22, the surface tension between the glass substrates 21 and 22 is increased. However, it can be seen that the other measurement results of the substrate restraining force are reduced when the spacers 5, 5, ... are arranged at intervals of 25_ about the entire end member, and it is known that the spacers 5, 5, ... are disposed. When the ratio of the occupied area exceeds a certain ratio, it is not affected by the surface tension, and it is easy to break the end member of the glass substrate 21 of the square. Experimentally, when the spacers 5, 5, ... are disposed at an interval of 2.5 mm on substantially 70% of the surface of the end member 12, the substrate restraining force starts to decrease. According to the present embodiment, the substrate binding force between one of the substrates of the bonded substrate and the other substrate is also reduced at the end of the bonded substrate, so that the substrate can be oriented toward the end of the other substrate. That is, the end member is surely separated and separated from the other substrate. For example, for the laminated substrate for LCD, the internal terminal can be surely exposed to the outside. Further, the bonded substrate is not limited to the mother glass including the display panel for LCD, and the glass is not particularly limited as long as it is a sheet of brittle material and has a substrate to which the end member 2 of one substrate is required. In addition, it is not limited to the mother glass including the display panel for LCD, and the display panel $201107256 can be expected to be equivalent to a variety of deformations, and the display panel can be individually cut out and used for driving and confirming the display of components. The case where the end member of one of the glass substrates is broken is also effective. Further, it may be replaced or the like within the scope of the gist of the invention. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a plan view schematically showing a configuration of a bonded substrate according to an embodiment of the present invention. Fig. 2 is a partial cross-sectional view showing the configuration of the vicinity of the end member of the bonded substrate according to the embodiment of the present invention. Figure 3 is a perspective view showing the shape of the spacer. Fig. 4 is a view showing the arrangement of the spacers of the bonded substrate according to the embodiment of the present invention. Fig. 5 is a view showing another arrangement of a spacer for a bonded substrate according to an embodiment of the present invention. Fig. 6 is a view showing a comparison of the substrate restraining force of the bonded substrate according to the embodiment of the present invention. [Description of main component symbols] 1 Mother glass (bonded substrate) 2 Glass substrate 3 Electrode 4 Sealing material 5 Spacer Display panel 12 End member 12 201107256 13 Line 13