KR20100127758A - 초소형 하우징 및 적어도 하나의 초소형 하우징을 포함한 지지 장치 - Google Patents

초소형 하우징 및 적어도 하나의 초소형 하우징을 포함한 지지 장치 Download PDF

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Publication number
KR20100127758A
KR20100127758A KR1020107018290A KR20107018290A KR20100127758A KR 20100127758 A KR20100127758 A KR 20100127758A KR 1020107018290 A KR1020107018290 A KR 1020107018290A KR 20107018290 A KR20107018290 A KR 20107018290A KR 20100127758 A KR20100127758 A KR 20100127758A
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KR
South Korea
Prior art keywords
housing
carrier
housing body
recess
microminiature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020107018290A
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English (en)
Korean (ko)
Inventor
찰스 리
펭 셍
제니 주
Original Assignee
오스람 옵토 세미컨덕터스 게엠베하
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 오스람 옵토 세미컨덕터스 게엠베하 filed Critical 오스람 옵토 세미컨덕터스 게엠베하
Publication of KR20100127758A publication Critical patent/KR20100127758A/ko
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/183—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components mounted in and supported by recessed areas of the PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10446—Mounted on an edge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10651—Component having two leads, e.g. resistor, capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by abutting or pinching; Mechanical auxiliary parts therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Casings For Electric Apparatus (AREA)
  • Led Device Packages (AREA)
KR1020107018290A 2008-02-29 2009-02-18 초소형 하우징 및 적어도 하나의 초소형 하우징을 포함한 지지 장치 Ceased KR20100127758A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102008011862A DE102008011862A1 (de) 2008-02-29 2008-02-29 Miniaturgehäuse, Trägeranordnung mit mindestens einem Miniaturgehäuse, sowie ein Verfahren zur Herstellung einer Trägeranordnung
DE102008011862.1 2008-02-29

Publications (1)

Publication Number Publication Date
KR20100127758A true KR20100127758A (ko) 2010-12-06

Family

ID=40874967

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020107018290A Ceased KR20100127758A (ko) 2008-02-29 2009-02-18 초소형 하우징 및 적어도 하나의 초소형 하우징을 포함한 지지 장치

Country Status (7)

Country Link
US (1) US8633408B2 (https=)
EP (1) EP2248190A2 (https=)
JP (1) JP2011513956A (https=)
KR (1) KR20100127758A (https=)
CN (1) CN101960620B (https=)
DE (1) DE102008011862A1 (https=)
WO (1) WO2009106051A2 (https=)

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US8486761B2 (en) 2010-03-25 2013-07-16 Koninklijke Philips Electronics N.V. Hybrid combination of substrate and carrier mounted light emitting devices
US8319247B2 (en) * 2010-03-25 2012-11-27 Koninklijke Philips Electronics N.V. Carrier for a light emitting device
DE102011004508A1 (de) * 2011-02-22 2012-08-23 Siemens Aktiengesellschaft Vorrichtung und Verfahren zum Kontaktieren eines LED-Chips
DE102011079708B4 (de) 2011-07-25 2022-08-11 Osram Gmbh Trägervorrichtung, elektrische vorrichtung mit einer trägervorrichtung und verfahren zur herstellung dieser
DE102013101260A1 (de) * 2013-02-08 2014-08-14 Osram Opto Semiconductors Gmbh Vorrichtung mit zumindest einem optoelektronischen Halbleiterbauelement
JP6358132B2 (ja) * 2015-03-03 2018-07-18 オムロン株式会社 立体回路構造体
EP3239665A1 (de) * 2016-04-25 2017-11-01 Weickmann & Weickmann PartmbB Sensorgehäuse

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JPH0339863A (ja) 1989-07-07 1991-02-20 Arusu Japan:Kk 太陽熱温水装置
JPH0339863U (https=) * 1989-08-30 1991-04-17
JP2802411B2 (ja) * 1992-05-26 1998-09-24 シャープ株式会社 光学装置
DE59402033D1 (de) 1993-09-30 1997-04-17 Siemens Ag Zweipoliges SMT-Miniatur-Gehäuse für Halbleiterbauelemente und Verfahren zu dessen Herstellung
US5506445A (en) 1994-06-24 1996-04-09 Hewlett-Packard Company Optical transceiver module
DE19751911A1 (de) * 1997-11-22 1999-06-02 Vishay Semiconductor Gmbh Leuchtdiode mit einem hermetisch dichten Gehäuse und Verfahren zu deren Herstellung
JP4178653B2 (ja) 1999-02-26 2008-11-12 日立化成工業株式会社 電気泳動用チップとその製造方法、該電気泳動用チップを用いた電気泳動装置及び荷電性物質の分離方法
AU3226101A (en) * 2000-02-09 2001-08-20 Nippon Leiz Corporation Light source
DE10122705B4 (de) * 2000-05-11 2012-07-26 Mitutoyo Corp. Einrichtung mit funktionalem Bauelement und Verfahren zu seiner Herstellung
EP1217291B1 (en) 2000-12-21 2007-05-30 Gamesman Limited Lamps
US6578986B2 (en) * 2001-06-29 2003-06-17 Permlight Products, Inc. Modular mounting arrangement and method for light emitting diodes
DE10140831A1 (de) * 2001-08-21 2003-03-13 Osram Opto Semiconductors Gmbh Leiterrahmen und Gehäuse für ein strahlungsemittierendes Bauelement, strahlungsemittierendes Bauelement und Anzeige- und/oder Beleuchtungsanordnung mit strahlungsemittierenden Bauelementen
JP4211359B2 (ja) * 2002-03-06 2009-01-21 日亜化学工業株式会社 半導体装置の製造方法
JP3699414B2 (ja) * 2002-03-29 2005-09-28 ローム株式会社 バックライトモジュールの接続構造
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KR100691179B1 (ko) * 2005-06-01 2007-03-09 삼성전기주식회사 측면 발광형 엘이디 패키지 및 그 제조 방법
KR100638874B1 (ko) * 2005-07-06 2006-10-27 삼성전기주식회사 Ｌｅｄ 광원이 도광판에 삽입된 백라이트 장치의광원-도광판 구조 및 이를 포함하는 백라이트 장치
JP4739851B2 (ja) * 2005-07-29 2011-08-03 スタンレー電気株式会社 表面実装型半導体装置
KR100637476B1 (ko) * 2005-11-09 2006-10-23 알티전자 주식회사 측면발광 다이오드 및 그 제조방법
US20070230182A1 (en) * 2006-03-28 2007-10-04 Yun Tai Led module
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DE102007006583A1 (de) * 2007-02-09 2008-08-28 Wen-Kung Sung Verfahren zum Herstellen einer seitlich leuchtenden Diode und deren Aufbau
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Also Published As

Publication number Publication date
EP2248190A2 (de) 2010-11-10
US8633408B2 (en) 2014-01-21
JP2011513956A (ja) 2011-04-28
CN101960620B (zh) 2013-06-12
DE102008011862A1 (de) 2009-09-03
US20110100707A1 (en) 2011-05-05
WO2009106051A3 (de) 2009-12-30
CN101960620A (zh) 2011-01-26
WO2009106051A2 (de) 2009-09-03

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