DE102008011862A1 - Miniaturgehäuse, Trägeranordnung mit mindestens einem Miniaturgehäuse, sowie ein Verfahren zur Herstellung einer Trägeranordnung - Google Patents
Miniaturgehäuse, Trägeranordnung mit mindestens einem Miniaturgehäuse, sowie ein Verfahren zur Herstellung einer Trägeranordnung Download PDFInfo
- Publication number
- DE102008011862A1 DE102008011862A1 DE102008011862A DE102008011862A DE102008011862A1 DE 102008011862 A1 DE102008011862 A1 DE 102008011862A1 DE 102008011862 A DE102008011862 A DE 102008011862A DE 102008011862 A DE102008011862 A DE 102008011862A DE 102008011862 A1 DE102008011862 A1 DE 102008011862A1
- Authority
- DE
- Germany
- Prior art keywords
- carrier
- housing
- miniature
- housing body
- connection devices
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
- H05K1/183—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components mounted in and supported by recessed areas of the PCBs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10439—Position of a single component
- H05K2201/10446—Mounted on an edge
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10651—Component having two leads, e.g. resistor, capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by abutting or pinching; Mechanical auxiliary parts therefor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/8506—Containers
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Metallurgy (AREA)
- Manufacturing & Machinery (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Casings For Electric Apparatus (AREA)
- Led Device Packages (AREA)
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102008011862A DE102008011862A1 (de) | 2008-02-29 | 2008-02-29 | Miniaturgehäuse, Trägeranordnung mit mindestens einem Miniaturgehäuse, sowie ein Verfahren zur Herstellung einer Trägeranordnung |
| JP2010547949A JP2011513956A (ja) | 2008-02-29 | 2009-02-18 | 小型ケーシングおよび少なくとも1つの小型ケーシングを備えた支持体装置 |
| PCT/DE2009/000248 WO2009106051A2 (de) | 2008-02-29 | 2009-02-18 | Miniaturgehäuse und trägeranordnung mit mindestens einem miniaturgehäuse |
| US12/920,305 US8633408B2 (en) | 2008-02-29 | 2009-02-18 | Miniature housing and support arrangement having at least one miniature housing |
| CN2009801066588A CN101960620B (zh) | 2008-02-29 | 2009-02-18 | 小型壳体和带有至少一个小型壳体的支承装置 |
| KR1020107018290A KR20100127758A (ko) | 2008-02-29 | 2009-02-18 | 초소형 하우징 및 적어도 하나의 초소형 하우징을 포함한 지지 장치 |
| EP09714225A EP2248190A2 (de) | 2008-02-29 | 2009-02-18 | Miniaturgehäuse und trägeranordnung mit mindestens einem miniaturgehäuse |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102008011862A DE102008011862A1 (de) | 2008-02-29 | 2008-02-29 | Miniaturgehäuse, Trägeranordnung mit mindestens einem Miniaturgehäuse, sowie ein Verfahren zur Herstellung einer Trägeranordnung |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE102008011862A1 true DE102008011862A1 (de) | 2009-09-03 |
Family
ID=40874967
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE102008011862A Withdrawn DE102008011862A1 (de) | 2008-02-29 | 2008-02-29 | Miniaturgehäuse, Trägeranordnung mit mindestens einem Miniaturgehäuse, sowie ein Verfahren zur Herstellung einer Trägeranordnung |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8633408B2 (https=) |
| EP (1) | EP2248190A2 (https=) |
| JP (1) | JP2011513956A (https=) |
| KR (1) | KR20100127758A (https=) |
| CN (1) | CN101960620B (https=) |
| DE (1) | DE102008011862A1 (https=) |
| WO (1) | WO2009106051A2 (https=) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102011004508A1 (de) * | 2011-02-22 | 2012-08-23 | Siemens Aktiengesellschaft | Vorrichtung und Verfahren zum Kontaktieren eines LED-Chips |
| WO2013013964A1 (de) * | 2011-07-25 | 2013-01-31 | Osram Ag | Trägervorrichtung, elektrische vorrichtung mit einer trägervorrichtung und verfahren zur herstellung dieser |
| WO2014122029A1 (de) * | 2013-02-08 | 2014-08-14 | Osram Opto Semiconductors Gmbh | Vorrichtung mit zumindest einem optoelektronischen halbleiterbauelement |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2792128B2 (ja) * | 1989-08-02 | 1998-08-27 | 株式会社豊田自動織機製作所 | ジェットルームにおける緯入れ制御方法 |
| US8486761B2 (en) | 2010-03-25 | 2013-07-16 | Koninklijke Philips Electronics N.V. | Hybrid combination of substrate and carrier mounted light emitting devices |
| US8319247B2 (en) * | 2010-03-25 | 2012-11-27 | Koninklijke Philips Electronics N.V. | Carrier for a light emitting device |
| JP6358132B2 (ja) * | 2015-03-03 | 2018-07-18 | オムロン株式会社 | 立体回路構造体 |
| EP3239665A1 (de) * | 2016-04-25 | 2017-11-01 | Weickmann & Weickmann PartmbB | Sensorgehäuse |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05327021A (ja) * | 1992-05-26 | 1993-12-10 | Sharp Corp | 光学装置 |
| DE19751911A1 (de) * | 1997-11-22 | 1999-06-02 | Vishay Semiconductor Gmbh | Leuchtdiode mit einem hermetisch dichten Gehäuse und Verfahren zu deren Herstellung |
| DE10140831A1 (de) * | 2001-08-21 | 2003-03-13 | Osram Opto Semiconductors Gmbh | Leiterrahmen und Gehäuse für ein strahlungsemittierendes Bauelement, strahlungsemittierendes Bauelement und Anzeige- und/oder Beleuchtungsanordnung mit strahlungsemittierenden Bauelementen |
| EP1396891A2 (en) * | 2002-09-05 | 2004-03-10 | Nichia Corporation | Semiconductor device and optical device using the same |
| DE102004047061A1 (de) * | 2004-09-28 | 2006-04-06 | Osram Opto Semiconductors Gmbh | Gehäuse für mindestens einen optoelektronischen Halbleiterchip, Verfahren zum Herstellen einer von Vielzahl Gehäusen, optoelektronisches Bauelement und Verfahren zum Herstellen eines optoelektronischen Bauelements |
| WO2006123917A1 (en) * | 2005-05-20 | 2006-11-23 | Luxpia Co., Ltd. | Light emitting diode package having a reflector cup by metal thin film and its manufacturing method |
| WO2006126809A1 (en) * | 2005-05-26 | 2006-11-30 | Luxpia Co., Ltd. | Very small light emitting diode package and manufacturing methods of it |
| WO2007055486A1 (en) * | 2005-11-09 | 2007-05-18 | Alti-Electronics Co., Ltd. | Led of side view type and the method for manufacturing the same |
| DE202007014910U1 (de) * | 2007-08-29 | 2007-12-27 | Harvatek Corp. | Packungsaufbau eines LED-Chips mit hoher Lichtausbeute in seitlicher Richtung |
| WO2008038978A1 (en) * | 2006-09-29 | 2008-04-03 | Seoul Semiconductor Co., Ltd. | Light emitting diode package |
| DE102007006583A1 (de) * | 2007-02-09 | 2008-08-28 | Wen-Kung Sung | Verfahren zum Herstellen einer seitlich leuchtenden Diode und deren Aufbau |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01100561A (ja) | 1987-10-14 | 1989-04-18 | Canon Inc | 圧力定着性カプセルトナー |
| JPH0339863A (ja) | 1989-07-07 | 1991-02-20 | Arusu Japan:Kk | 太陽熱温水装置 |
| JPH0339863U (https=) * | 1989-08-30 | 1991-04-17 | ||
| DE59402033D1 (de) | 1993-09-30 | 1997-04-17 | Siemens Ag | Zweipoliges SMT-Miniatur-Gehäuse für Halbleiterbauelemente und Verfahren zu dessen Herstellung |
| US5506445A (en) | 1994-06-24 | 1996-04-09 | Hewlett-Packard Company | Optical transceiver module |
| JP4178653B2 (ja) | 1999-02-26 | 2008-11-12 | 日立化成工業株式会社 | 電気泳動用チップとその製造方法、該電気泳動用チップを用いた電気泳動装置及び荷電性物質の分離方法 |
| AU3226101A (en) * | 2000-02-09 | 2001-08-20 | Nippon Leiz Corporation | Light source |
| DE10122705B4 (de) * | 2000-05-11 | 2012-07-26 | Mitutoyo Corp. | Einrichtung mit funktionalem Bauelement und Verfahren zu seiner Herstellung |
| EP1217291B1 (en) | 2000-12-21 | 2007-05-30 | Gamesman Limited | Lamps |
| US6578986B2 (en) * | 2001-06-29 | 2003-06-17 | Permlight Products, Inc. | Modular mounting arrangement and method for light emitting diodes |
| JP4211359B2 (ja) * | 2002-03-06 | 2009-01-21 | 日亜化学工業株式会社 | 半導体装置の製造方法 |
| JP3699414B2 (ja) * | 2002-03-29 | 2005-09-28 | ローム株式会社 | バックライトモジュールの接続構造 |
| US7531844B2 (en) | 2002-09-30 | 2009-05-12 | Sanyo Electric Co., Ltd. | Light emitting element |
| US7692206B2 (en) * | 2002-12-06 | 2010-04-06 | Cree, Inc. | Composite leadframe LED package and method of making the same |
| KR100550856B1 (ko) * | 2003-06-03 | 2006-02-10 | 삼성전기주식회사 | 발광 다이오드(led) 소자의 제조 방법 |
| KR100586944B1 (ko) * | 2003-12-26 | 2006-06-07 | 삼성전기주식회사 | 고출력 발광다이오드 패키지 및 제조방법 |
| TWM258416U (en) * | 2004-06-04 | 2005-03-01 | Lite On Technology Corp | Power LED package module |
| US7285802B2 (en) * | 2004-12-21 | 2007-10-23 | 3M Innovative Properties Company | Illumination assembly and method of making same |
| KR100593945B1 (ko) * | 2005-05-30 | 2006-06-30 | 삼성전기주식회사 | 고출력 led 패키지 및 그 제조방법 |
| KR100691179B1 (ko) * | 2005-06-01 | 2007-03-09 | 삼성전기주식회사 | 측면 발광형 엘이디 패키지 및 그 제조 방법 |
| KR100638874B1 (ko) * | 2005-07-06 | 2006-10-27 | 삼성전기주식회사 | Led 광원이 도광판에 삽입된 백라이트 장치의광원-도광판 구조 및 이를 포함하는 백라이트 장치 |
| JP4739851B2 (ja) * | 2005-07-29 | 2011-08-03 | スタンレー電気株式会社 | 表面実装型半導体装置 |
| US20070230182A1 (en) * | 2006-03-28 | 2007-10-04 | Yun Tai | Led module |
| JP5060172B2 (ja) | 2007-05-29 | 2012-10-31 | 岩谷産業株式会社 | 半導体発光装置 |
-
2008
- 2008-02-29 DE DE102008011862A patent/DE102008011862A1/de not_active Withdrawn
-
2009
- 2009-02-18 JP JP2010547949A patent/JP2011513956A/ja active Pending
- 2009-02-18 CN CN2009801066588A patent/CN101960620B/zh not_active Expired - Fee Related
- 2009-02-18 US US12/920,305 patent/US8633408B2/en not_active Expired - Fee Related
- 2009-02-18 KR KR1020107018290A patent/KR20100127758A/ko not_active Ceased
- 2009-02-18 EP EP09714225A patent/EP2248190A2/de not_active Withdrawn
- 2009-02-18 WO PCT/DE2009/000248 patent/WO2009106051A2/de not_active Ceased
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05327021A (ja) * | 1992-05-26 | 1993-12-10 | Sharp Corp | 光学装置 |
| DE19751911A1 (de) * | 1997-11-22 | 1999-06-02 | Vishay Semiconductor Gmbh | Leuchtdiode mit einem hermetisch dichten Gehäuse und Verfahren zu deren Herstellung |
| DE10140831A1 (de) * | 2001-08-21 | 2003-03-13 | Osram Opto Semiconductors Gmbh | Leiterrahmen und Gehäuse für ein strahlungsemittierendes Bauelement, strahlungsemittierendes Bauelement und Anzeige- und/oder Beleuchtungsanordnung mit strahlungsemittierenden Bauelementen |
| EP1396891A2 (en) * | 2002-09-05 | 2004-03-10 | Nichia Corporation | Semiconductor device and optical device using the same |
| DE102004047061A1 (de) * | 2004-09-28 | 2006-04-06 | Osram Opto Semiconductors Gmbh | Gehäuse für mindestens einen optoelektronischen Halbleiterchip, Verfahren zum Herstellen einer von Vielzahl Gehäusen, optoelektronisches Bauelement und Verfahren zum Herstellen eines optoelektronischen Bauelements |
| WO2006123917A1 (en) * | 2005-05-20 | 2006-11-23 | Luxpia Co., Ltd. | Light emitting diode package having a reflector cup by metal thin film and its manufacturing method |
| WO2006126809A1 (en) * | 2005-05-26 | 2006-11-30 | Luxpia Co., Ltd. | Very small light emitting diode package and manufacturing methods of it |
| WO2007055486A1 (en) * | 2005-11-09 | 2007-05-18 | Alti-Electronics Co., Ltd. | Led of side view type and the method for manufacturing the same |
| WO2008038978A1 (en) * | 2006-09-29 | 2008-04-03 | Seoul Semiconductor Co., Ltd. | Light emitting diode package |
| DE102007006583A1 (de) * | 2007-02-09 | 2008-08-28 | Wen-Kung Sung | Verfahren zum Herstellen einer seitlich leuchtenden Diode und deren Aufbau |
| DE202007014910U1 (de) * | 2007-08-29 | 2007-12-27 | Harvatek Corp. | Packungsaufbau eines LED-Chips mit hoher Lichtausbeute in seitlicher Richtung |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102011004508A1 (de) * | 2011-02-22 | 2012-08-23 | Siemens Aktiengesellschaft | Vorrichtung und Verfahren zum Kontaktieren eines LED-Chips |
| WO2013013964A1 (de) * | 2011-07-25 | 2013-01-31 | Osram Ag | Trägervorrichtung, elektrische vorrichtung mit einer trägervorrichtung und verfahren zur herstellung dieser |
| US9445503B2 (en) | 2011-07-25 | 2016-09-13 | Osram Gmbh | Carrier device, electrical device having a carrier device and method for producing same |
| WO2014122029A1 (de) * | 2013-02-08 | 2014-08-14 | Osram Opto Semiconductors Gmbh | Vorrichtung mit zumindest einem optoelektronischen halbleiterbauelement |
| US9972759B2 (en) | 2013-02-08 | 2018-05-15 | Osram Opto Semiconductors Gmbh | Optoelectronic semiconductor device having contact track with relieved thermo-mechanical stress |
Also Published As
| Publication number | Publication date |
|---|---|
| EP2248190A2 (de) | 2010-11-10 |
| KR20100127758A (ko) | 2010-12-06 |
| US8633408B2 (en) | 2014-01-21 |
| JP2011513956A (ja) | 2011-04-28 |
| CN101960620B (zh) | 2013-06-12 |
| US20110100707A1 (en) | 2011-05-05 |
| WO2009106051A3 (de) | 2009-12-30 |
| CN101960620A (zh) | 2011-01-26 |
| WO2009106051A2 (de) | 2009-09-03 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| OM8 | Search report available as to paragraph 43 lit. 1 sentence 1 patent law | ||
| R119 | Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee | ||
| R079 | Amendment of ipc main class |
Free format text: PREVIOUS MAIN CLASS: H01L0033000000 Ipc: H01L0033620000 |