KR20100102738A - 배리어 층의 무전해 증착 - Google Patents

배리어 층의 무전해 증착 Download PDF

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Publication number
KR20100102738A
KR20100102738A KR1020107018826A KR20107018826A KR20100102738A KR 20100102738 A KR20100102738 A KR 20100102738A KR 1020107018826 A KR1020107018826 A KR 1020107018826A KR 20107018826 A KR20107018826 A KR 20107018826A KR 20100102738 A KR20100102738 A KR 20100102738A
Authority
KR
South Korea
Prior art keywords
solution
deposition
reducing agent
mol
metal surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020107018826A
Other languages
English (en)
Korean (ko)
Inventor
라인문트 멜리스
Original Assignee
바스프 에스이
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 바스프 에스이 filed Critical 바스프 에스이
Publication of KR20100102738A publication Critical patent/KR20100102738A/ko
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/48—Coating with alloys
    • C23C18/50—Coating with alloys with alloys based on iron, cobalt or nickel

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
KR1020107018826A 2008-01-24 2009-01-20 배리어 층의 무전해 증착 Ceased KR20100102738A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP08150612.3 2008-01-24
EP08150612 2008-01-24

Publications (1)

Publication Number Publication Date
KR20100102738A true KR20100102738A (ko) 2010-09-24

Family

ID=40901477

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020107018826A Ceased KR20100102738A (ko) 2008-01-24 2009-01-20 배리어 층의 무전해 증착

Country Status (9)

Country Link
US (1) US20110059611A1 (cg-RX-API-DMAC10.html)
EP (1) EP2255024A2 (cg-RX-API-DMAC10.html)
JP (1) JP2011510177A (cg-RX-API-DMAC10.html)
KR (1) KR20100102738A (cg-RX-API-DMAC10.html)
CN (1) CN101925691A (cg-RX-API-DMAC10.html)
IL (1) IL206719A (cg-RX-API-DMAC10.html)
RU (1) RU2492279C2 (cg-RX-API-DMAC10.html)
TW (1) TW200949010A (cg-RX-API-DMAC10.html)
WO (1) WO2009092706A2 (cg-RX-API-DMAC10.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150140242A (ko) * 2014-06-05 2015-12-15 램 리써치 코포레이션 적어도 두 개의 보레인 환원제를 갖는 무전해 도금

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011000758A1 (en) 2009-06-30 2011-01-06 Basf Se Aqueous alkaline cleaning compositions and methods of their use
US20110192316A1 (en) * 2010-02-05 2011-08-11 E-Chem Enterprise Corp. Electroless plating solution for providing solar cell electrode
US8895441B2 (en) 2012-02-24 2014-11-25 Lam Research Corporation Methods and materials for anchoring gapfill metals
ES2826441T3 (es) * 2017-06-02 2021-05-18 Atotech Deutschland Gmbh Baños de metalizado no electrolítico de aleación de níquel, un método de deposición de aleaciones de níquel, depósitos de aleación de níquel y usos de dichos depósitos de aleación de níquel formados
EP3743541A1 (en) * 2018-01-25 2020-12-02 Université de Mons Nickel alloy plating
SG11202103872PA (en) 2018-11-06 2021-05-28 Atotech Deutschland Gmbh Electroless nickel plating solution

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4002778A (en) * 1973-08-15 1977-01-11 E. I. Du Pont De Nemours And Company Chemical plating process
US6645567B2 (en) * 2001-12-19 2003-11-11 Intel Corporation Electroless plating bath composition and method of using
US6605874B2 (en) * 2001-12-19 2003-08-12 Intel Corporation Method of making semiconductor device using an interconnect
US6902605B2 (en) * 2003-03-06 2005-06-07 Blue29, Llc Activation-free electroless solution for deposition of cobalt and method for deposition of cobalt capping/passivation layer on copper
EP1627098A1 (de) * 2003-05-09 2006-02-22 Basf Aktiengesellschaft Zusammensetzungen zur stromlosen abscheidung tern rer materi alien f r die halbleiterindustrie
US6924232B2 (en) * 2003-08-27 2005-08-02 Freescale Semiconductor, Inc. Semiconductor process and composition for forming a barrier material overlying copper
US7531463B2 (en) * 2003-10-20 2009-05-12 Novellus Systems, Inc. Fabrication of semiconductor interconnect structure
US7268074B2 (en) * 2004-06-14 2007-09-11 Enthone, Inc. Capping of metal interconnects in integrated circuit electronic devices
US7332193B2 (en) * 2004-10-18 2008-02-19 Enthone, Inc. Cobalt and nickel electroless plating in microelectronic devices
US7176133B2 (en) * 2004-11-22 2007-02-13 Freescale Semiconductor, Inc. Controlled electroless plating
US7476616B2 (en) * 2004-12-13 2009-01-13 Fsi International, Inc. Reagent activator for electroless plating
US20060188659A1 (en) * 2005-02-23 2006-08-24 Enthone Inc. Cobalt self-initiated electroless via fill for stacked memory cells
US7410899B2 (en) * 2005-09-20 2008-08-12 Enthone, Inc. Defectivity and process control of electroless deposition in microelectronics applications
US7658790B1 (en) * 2007-07-03 2010-02-09 Intermolecular, Inc. Concentrated electroless solution for selective deposition of cobalt-based capping/barrier layers

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150140242A (ko) * 2014-06-05 2015-12-15 램 리써치 코포레이션 적어도 두 개의 보레인 환원제를 갖는 무전해 도금

Also Published As

Publication number Publication date
US20110059611A1 (en) 2011-03-10
WO2009092706A3 (en) 2010-01-07
IL206719A0 (en) 2010-12-30
RU2010134880A (ru) 2012-02-27
EP2255024A2 (en) 2010-12-01
TW200949010A (en) 2009-12-01
CN101925691A (zh) 2010-12-22
IL206719A (en) 2014-06-30
WO2009092706A2 (en) 2009-07-30
JP2011510177A (ja) 2011-03-31
RU2492279C2 (ru) 2013-09-10

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Legal Events

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PA0105 International application

Patent event date: 20100824

Patent event code: PA01051R01D

Comment text: International Patent Application

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A201 Request for examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20140117

Comment text: Request for Examination of Application

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PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20150324

Patent event code: PE09021S01D

E601 Decision to refuse application
PE0601 Decision on rejection of patent

Patent event date: 20151230

Comment text: Decision to Refuse Application

Patent event code: PE06012S01D

Patent event date: 20150324

Comment text: Notification of reason for refusal

Patent event code: PE06011S01I