IL206719A - Electroless deposition of barrier layers - Google Patents

Electroless deposition of barrier layers

Info

Publication number
IL206719A
IL206719A IL206719A IL20671910A IL206719A IL 206719 A IL206719 A IL 206719A IL 206719 A IL206719 A IL 206719A IL 20671910 A IL20671910 A IL 20671910A IL 206719 A IL206719 A IL 206719A
Authority
IL
Israel
Prior art keywords
solution
deposition
reducing agent
mol
nickel
Prior art date
Application number
IL206719A
Other languages
English (en)
Hebrew (he)
Other versions
IL206719A0 (en
Original Assignee
Basf Se
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Basf Se filed Critical Basf Se
Publication of IL206719A0 publication Critical patent/IL206719A0/en
Publication of IL206719A publication Critical patent/IL206719A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/48—Coating with alloys
    • C23C18/50—Coating with alloys with alloys based on iron, cobalt or nickel

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
IL206719A 2008-01-24 2010-06-30 Electroless deposition of barrier layers IL206719A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP08150612 2008-01-24
PCT/EP2009/050589 WO2009092706A2 (en) 2008-01-24 2009-01-20 Electroless deposition of barrier layers

Publications (2)

Publication Number Publication Date
IL206719A0 IL206719A0 (en) 2010-12-30
IL206719A true IL206719A (en) 2014-06-30

Family

ID=40901477

Family Applications (1)

Application Number Title Priority Date Filing Date
IL206719A IL206719A (en) 2008-01-24 2010-06-30 Electroless deposition of barrier layers

Country Status (9)

Country Link
US (1) US20110059611A1 (cg-RX-API-DMAC10.html)
EP (1) EP2255024A2 (cg-RX-API-DMAC10.html)
JP (1) JP2011510177A (cg-RX-API-DMAC10.html)
KR (1) KR20100102738A (cg-RX-API-DMAC10.html)
CN (1) CN101925691A (cg-RX-API-DMAC10.html)
IL (1) IL206719A (cg-RX-API-DMAC10.html)
RU (1) RU2492279C2 (cg-RX-API-DMAC10.html)
TW (1) TW200949010A (cg-RX-API-DMAC10.html)
WO (1) WO2009092706A2 (cg-RX-API-DMAC10.html)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011000758A1 (en) 2009-06-30 2011-01-06 Basf Se Aqueous alkaline cleaning compositions and methods of their use
US20110192316A1 (en) * 2010-02-05 2011-08-11 E-Chem Enterprise Corp. Electroless plating solution for providing solar cell electrode
US8895441B2 (en) 2012-02-24 2014-11-25 Lam Research Corporation Methods and materials for anchoring gapfill metals
US9551074B2 (en) * 2014-06-05 2017-01-24 Lam Research Corporation Electroless plating solution with at least two borane containing reducing agents
ES2826441T3 (es) * 2017-06-02 2021-05-18 Atotech Deutschland Gmbh Baños de metalizado no electrolítico de aleación de níquel, un método de deposición de aleaciones de níquel, depósitos de aleación de níquel y usos de dichos depósitos de aleación de níquel formados
EP3743541A1 (en) * 2018-01-25 2020-12-02 Université de Mons Nickel alloy plating
SG11202103872PA (en) 2018-11-06 2021-05-28 Atotech Deutschland Gmbh Electroless nickel plating solution

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4002778A (en) * 1973-08-15 1977-01-11 E. I. Du Pont De Nemours And Company Chemical plating process
US6645567B2 (en) * 2001-12-19 2003-11-11 Intel Corporation Electroless plating bath composition and method of using
US6605874B2 (en) * 2001-12-19 2003-08-12 Intel Corporation Method of making semiconductor device using an interconnect
US6902605B2 (en) * 2003-03-06 2005-06-07 Blue29, Llc Activation-free electroless solution for deposition of cobalt and method for deposition of cobalt capping/passivation layer on copper
EP1627098A1 (de) * 2003-05-09 2006-02-22 Basf Aktiengesellschaft Zusammensetzungen zur stromlosen abscheidung tern rer materi alien f r die halbleiterindustrie
US6924232B2 (en) * 2003-08-27 2005-08-02 Freescale Semiconductor, Inc. Semiconductor process and composition for forming a barrier material overlying copper
US7531463B2 (en) * 2003-10-20 2009-05-12 Novellus Systems, Inc. Fabrication of semiconductor interconnect structure
US7268074B2 (en) * 2004-06-14 2007-09-11 Enthone, Inc. Capping of metal interconnects in integrated circuit electronic devices
US7332193B2 (en) * 2004-10-18 2008-02-19 Enthone, Inc. Cobalt and nickel electroless plating in microelectronic devices
US7176133B2 (en) * 2004-11-22 2007-02-13 Freescale Semiconductor, Inc. Controlled electroless plating
US7476616B2 (en) * 2004-12-13 2009-01-13 Fsi International, Inc. Reagent activator for electroless plating
US20060188659A1 (en) * 2005-02-23 2006-08-24 Enthone Inc. Cobalt self-initiated electroless via fill for stacked memory cells
US7410899B2 (en) * 2005-09-20 2008-08-12 Enthone, Inc. Defectivity and process control of electroless deposition in microelectronics applications
US7658790B1 (en) * 2007-07-03 2010-02-09 Intermolecular, Inc. Concentrated electroless solution for selective deposition of cobalt-based capping/barrier layers

Also Published As

Publication number Publication date
US20110059611A1 (en) 2011-03-10
WO2009092706A3 (en) 2010-01-07
IL206719A0 (en) 2010-12-30
RU2010134880A (ru) 2012-02-27
EP2255024A2 (en) 2010-12-01
TW200949010A (en) 2009-12-01
CN101925691A (zh) 2010-12-22
WO2009092706A2 (en) 2009-07-30
JP2011510177A (ja) 2011-03-31
RU2492279C2 (ru) 2013-09-10
KR20100102738A (ko) 2010-09-24

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