KR20100092759A - 저유전율 및 저손실 특성을 가진 노르보넨계 중합체 및 이를 이용한 절연재 - Google Patents
저유전율 및 저손실 특성을 가진 노르보넨계 중합체 및 이를 이용한 절연재 Download PDFInfo
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- KR20100092759A KR20100092759A KR1020090012040A KR20090012040A KR20100092759A KR 20100092759 A KR20100092759 A KR 20100092759A KR 1020090012040 A KR1020090012040 A KR 1020090012040A KR 20090012040 A KR20090012040 A KR 20090012040A KR 20100092759 A KR20100092759 A KR 20100092759A
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F232/00—Copolymers of cyclic compounds containing no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic ring system
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F4/00—Polymerisation catalysts
- C08F4/42—Metals; Metal hydrides; Metallo-organic compounds; Use thereof as catalyst precursors
- C08F4/72—Metals; Metal hydrides; Metallo-organic compounds; Use thereof as catalyst precursors selected from metals not provided for in group C08F4/44
- C08F4/80—Metals; Metal hydrides; Metallo-organic compounds; Use thereof as catalyst precursors selected from metals not provided for in group C08F4/44 selected from iron group metals or platinum group metals
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F32/00—Homopolymers and copolymers of cyclic compounds having no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic ring system
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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- C08L45/00—Compositions of homopolymers or copolymers of compounds having no unsaturated aliphatic radicals in side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic or in a heterocyclic ring system; Compositions of derivatives of such polymers
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- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/307—Other macromolecular compounds
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
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- Engineering & Computer Science (AREA)
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- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)
Abstract
Description
d-스페이싱(d-spacing) | ||
중합체 | 제1 피크(Å) | 제2 피크(Å) |
PNB-ester-1-phenyl | 16.1 | 4.70 |
PNB-ester-2-phenyl | 16.8 | 4.74 |
PNB-ester-3-phenyl | 17.8 | 4.69 |
PNB | 8.6 | 4.80 |
시료 | X (mol%) |
Y (mol%) |
Mw (GPC) |
Mn (GPC) |
PDI | 수율 (%) |
A1 | 95 | 5 | 62,100 | 40,400 | 1.5 | 66 |
A2 | 90 | 10 | 63,100 | 34,600 | 1.8 | 70 |
A3 | 85 | 15 | 84,900 | 42,500 | 2.0 | 61 |
A4 | 80 | 20 | 98,000 | 41,900 | 2.3 | 66 |
B1 | 95 | 5 | 59,300 | 34,000 | 1.7 | 70 |
B2 | 90 | 10 | 61,500 | 33,300 | 1.8 | 66 |
B3 | 85 | 15 | 76,300 | 33,000 | 2.3 | 64 |
B4 | 80 | 20 | 68,300 | 29,700 | 2.3 | 59 |
시료 | 필름두께 (㎛) |
ε r (1GHz) |
tan δ !1GHz) |
Td1 (℃) 비경화 |
Td1 (℃) 경화 |
A1 | 410 | 2.51 | 1.60×10-3 | 287 | 313 |
A2 | 460 | 2.60 | 2.97×10-3 | 280 | 309 |
A3 | 430 | 2.79 | 4.10×10-3 | 263 | 301 |
A4 | 450 | 2.83 | 5.44×10-3 | 276 | 296 |
B1 | 450 | 2.61 | 4.61×10-4 | 299 | 320 |
B2 | 560 | 2.64 | 1.62×10-3 | 298 | 323 |
B3 | 480 | 2.73 | 2.49×10-3 | 280 | 313 |
B4 | 510 | 2.71 | 3.07×10-3 | 291 | 310 |
Claims (10)
- 화학식 1로 표시되는 반복 단위를 적어도 1종 포함하는 노르보넨계 중합체:[화학식 1]식 중,여기서, R5, R6 및 R7은 각각 독립적으로 수소, 치환 또는 비치환된 C1~C6의 알킬기, 지방족 이중고리(bicyclo) 또는 다중고리(multicyclo) 화합물로 치환된 C1~C6의 알킬기, 치환 또는 비치환된 C2~C6의 알케닐기 및 치환 또는 비치환된 C4~C31의 아릴알킬기로 이루어지는 군에서 선택되고, L은 C1~C3의 알킬기이다.
- 제1항에 있어서,상기 R5, R6 및 R7은 각각 독립적으로 수소, 메틸, 에틸, 프로필, 부틸, 펜틸 및 헥실기로 이루어지는 군에서 선택되는 것을 특징으로 하는 노르보넨계 중합체.
- 제1항에 있어서,상기 R1 내지 R4 중 적어도 하나의 말단에 아크릴기 또는 비닐기를 가지는 것을 특징으로 하는 노르보넨계 중합체.
- 제1항에 있어서,상기 화학식 1로 표시되는 반복 단위를 2종 이상으로 포함하는 공중합체인 것을 특징으로 하는 노르보넨계 중합체.
- 제6항에 있어서,상기 2종 이상의 반복 단위 중 적어도 하나는 상기 R1 내지 R4 중 적어도 하나의 말단에 아크릴기 또는 비닐기를 가지는 것을 특징으로 하는 노르보넨계 중합체.
- 제1항 내지 제8항 중 어느 한 항에 따른 노르보넨계 중합체를 이용하여 제조된 절연재.
- 제9항에 있어서,상기 절연재는 임베디드 인쇄회로기판용 또는 기능성 전자소자용 임을 특징으로 하는 절연재.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
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KR1020090012040A KR101100351B1 (ko) | 2009-02-13 | 2009-02-13 | 저유전율 및 저손실 특성을 가진 노르보넨계 중합체 및 이를 이용한 절연재 |
US12/534,433 US20100210803A1 (en) | 2009-02-13 | 2009-08-03 | Norbornene-based polymer having low dielectric constant and low-loss properties and insulating material using the same |
JP2009229172A JP2010189619A (ja) | 2009-02-13 | 2009-10-01 | 低誘電率及び低損失特性を有するノルボルネン系重合体及びこれを用いた絶縁材 |
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KR1020090012040A KR101100351B1 (ko) | 2009-02-13 | 2009-02-13 | 저유전율 및 저손실 특성을 가진 노르보넨계 중합체 및 이를 이용한 절연재 |
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KR20100092759A true KR20100092759A (ko) | 2010-08-23 |
KR101100351B1 KR101100351B1 (ko) | 2011-12-30 |
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US (1) | US20100210803A1 (ko) |
JP (1) | JP2010189619A (ko) |
KR (1) | KR101100351B1 (ko) |
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US20160311970A1 (en) | 2013-12-13 | 2016-10-27 | Transfert Plus, Société En Commandite | Insertion polynorbornene-based thermoset resins |
WO2018016527A1 (ja) * | 2016-07-22 | 2018-01-25 | 京セラ株式会社 | 有機絶縁体、金属張積層板および配線基板 |
US20190313642A1 (en) * | 2016-11-15 | 2019-10-17 | Albert-Ludwigs-Universität Freiburg | A simultaneously antimicrobial and protein-repellent polyzwitterion |
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US5705503A (en) * | 1995-05-25 | 1998-01-06 | Goodall; Brian Leslie | Addition polymers of polycycloolefins containing functional substituents |
US6232417B1 (en) * | 1996-03-07 | 2001-05-15 | The B. F. Goodrich Company | Photoresist compositions comprising polycyclic polymers with acid labile pendant groups |
JP4894986B2 (ja) * | 2001-01-24 | 2012-03-14 | Jsr株式会社 | ノルボルネン系環状オレフィン付加重合体の製造方法 |
JP4632009B2 (ja) * | 2001-03-30 | 2011-02-16 | Jsr株式会社 | 環状オレフィン系共重合体、この複合体、これらの架橋体、および光学材料 |
US8030425B2 (en) * | 2002-07-03 | 2011-10-04 | Promerus Llc | Photosensitive compositions based on polycyclic polymers for low stress, high temperature films |
WO2004007564A1 (en) * | 2002-07-10 | 2004-01-22 | Lg Chem, Ltd. | Method for preparing norbornene based addition polymer containing ester or acetyl functional group |
CN1281653C (zh) * | 2002-07-10 | 2006-10-25 | Lg化学株式会社 | 降冰片烯-酯基加成聚合物及该降冰片烯-酯基加成聚合物的制备方法 |
JP2006096812A (ja) * | 2004-09-28 | 2006-04-13 | Sumitomo Bakelite Co Ltd | 半導体表面保護膜用樹脂組成物、及びそれを用いた半導体装置 |
JP4696684B2 (ja) * | 2005-05-20 | 2011-06-08 | 住友ベークライト株式会社 | 光導波路および光導波路構造体 |
JP2008031319A (ja) * | 2006-07-28 | 2008-02-14 | Fujifilm Corp | ノルボルネン系重合体、フィルム、偏光板および液晶表示装置 |
US8153346B2 (en) * | 2007-02-23 | 2012-04-10 | Fujifilm Electronic Materials, U.S.A., Inc. | Thermally cured underlayer for lithographic application |
KR101046430B1 (ko) * | 2008-09-11 | 2011-07-05 | 삼성전기주식회사 | 저유전율 및 저손실 특성을 가진 노르보넨계 중합체, 이를이용한 절연재, 인쇄회로기판 및 기능성 소자 |
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2009
- 2009-02-13 KR KR1020090012040A patent/KR101100351B1/ko active IP Right Grant
- 2009-08-03 US US12/534,433 patent/US20100210803A1/en not_active Abandoned
- 2009-10-01 JP JP2009229172A patent/JP2010189619A/ja active Pending
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Publication number | Publication date |
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JP2010189619A (ja) | 2010-09-02 |
US20100210803A1 (en) | 2010-08-19 |
KR101100351B1 (ko) | 2011-12-30 |
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