KR20100061026A - 금속범프를 갖는 인쇄회로기판 및 그 제조방법 - Google Patents
금속범프를 갖는 인쇄회로기판 및 그 제조방법 Download PDFInfo
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- KR20100061026A KR20100061026A KR1020080119895A KR20080119895A KR20100061026A KR 20100061026 A KR20100061026 A KR 20100061026A KR 1020080119895 A KR1020080119895 A KR 1020080119895A KR 20080119895 A KR20080119895 A KR 20080119895A KR 20100061026 A KR20100061026 A KR 20100061026A
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- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
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- H05K1/11—Printed elements for providing electric connections to or between printed circuits
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- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
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- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
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- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0367—Metallic bump or raised conductor not used as solder bump
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- H05K2203/03—Metal processing
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- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
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- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
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- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49147—Assembling terminal to base
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
- Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
- Y10T29/49222—Contact or terminal manufacturing by assembling plural parts forming array of contacts or terminals
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Abstract
Description
Claims (18)
- (A) 메탈 캐리어 상부에 금속범프형성용 홈부를 형성하는 단계;(B) 상기 홈부를 포함하여 상기 메탈 캐리어 상부에 배리어층을 형성하는 단계;(C) 상기 배리어층 상부에 상기 홈부를 충전하는 금속범프 및 회로패턴을 포함하는 상부회로층을 형성하는 단계;(D) 절연층을 제공하고 상기 회로층을 절연층 상부에 전사하는 단계; 및(E) 상기 메탈 캐리어 및 상기 배리어층을 제거하는 단계;를 포함하는 금속범프를 갖는 인쇄회로기판의 제조방법.
- 제1항에 있어서,상기 (E) 단계 이후에,상기 절연층 상부에 상기 금속범프를 노출하는 개방홀을 갖는 솔더 레지스트층을 형성하는 단계를 더 포함하는 것을 특징으로 하는 금속범프를 갖는 인쇄회로기판의 제조방법.
- 제1항에 있어서,상기 (A) 단계는,(ⅰ) 메탈 캐리어를 제공하는 단계;(ⅱ) 상기 매탈 캐리어 상부에 에칭 레지스트를 도포하는 단계;(ⅲ) 상기 에칭 레지스트에 홈부 형성용 개구부를 패터닝하는 단계;(ⅳ) 상기 홈부 형성용 개구부로 노출된 상기 메탈 캐리어를 에칭하여 홈부를 형성하는 단계; 및(ⅴ) 상기 에칭레지스트를 제거하는 단계;를 포함하는 것을 특징으로 하는 금속범프를 갖는 인쇄회로기판의 제조방법.
- 제1항에 있어서,상기 (B) 단계 이후에,상기 배리어층 상부에 시드층을 형성하는 단계를 더 포함하는 것을 특징으로 하는 금속범프를 갖는 인쇄회로기판의 제조방법.
- 제1항에 있어서,상기 (C) 단계는,(ⅰ) 상기 배리어층 상부에 도금레지스트를 도포하는 단계;(ⅱ) 상기 도금 레지스트에 상기 홈부의 적어도 일부를 노출하는 개구부를 포함하는 회로패턴 형성용 개구부를 패터닝하는 단계; 및(ⅲ) 상기 개구부를 도금하여 상기 홈부를 충전하는 금속범프 및 회로패턴을 포함하는 상부회로층을 형성하는 단계;를 포함하는 것을 특징으로 하는 금속범프를 갖는 인쇄회로기판의 제조방법.
- 제1항에 있어서,상기 메탈 캐리어 및 상기 회로층은 전기 전도성 금속으로 이루어지고 상기 배리어층은 상기 메탈 캐리어 및 상기 회로층은 전기 전도성 금속으로 이루어지고 상기 배리어층은 상기 매탈캐리어 및 상기 상부회로층을 이루는 금속과 선택적으로 에칭 가능한 금속으로 이루어지는 것을 특징으로 하는 금속범프를 갖는 인쇄회로기판의 제조방법.
- 제6항에 있어서,상기 매탈 캐리어는 구리로 이루어지고, 상기 상부회로층은 구리, 또는 주석(Sn), 주석(Sn)과 은(Ag)의 합금 중 어느 하나로 이루어지고, 상기 배리어층은 니켈로 이루어지는 것을 특징으로 하는 금속범프를 갖는 인쇄회로기판의 제조방법.
- (A) 제1 캐리어 상부에 금속범프형성용 홈부를 형성하고, 상기 홈부를 포함하여 상기 제1 캐리어 상부에 제1 배리어층을 형성하고, 상기 제1 배리어층 상부에 상기 홈부를 충전하는 금속범프 및 회로패턴을 포함하는 상부회로층을 형성하는 단계;(B) 제2 캐리어 상부에 제2 배리어층을 형성하고 상기 제2 배리어층 상부에 하부회로층을 형성하는 단계;(C) 절연층을 제공하고 상기 절연층의 상하면에 상기 상부회로층 및 상기 하 부회로층을 전사하는 단계;(D) 상기 제1 캐리어 및 상기 제2 캐리어를 제거하는 단계; 및(E) 상기 제1 배리어층 및 상기 제2 배리어층을 제거하는 단계;를 포함하는 금속범프를 갖는 인쇄회로기판의 제조방법.
- 제8항에 있어서,상기 (E) 단계 이후에,상기 절연층의 상하부에 솔더레지스트층을 형성하는 단계를 더 포함하는 것을 특징으로 하는 금속범프를 갖는 인쇄회로기판의 제조방법.
- 제8항에 있어서,상기 제1 캐리어, 제2 캐리어, 상부회로층 및 하부회로층은 전기 전도성 금속으로 이루어지고, 상기 제1 배리어층 및 제2 배리어층은 상기 제1 캐리어, 제2 캐리어, 상부회로층 및 하부회로층을 이루는 금속과 선택적으로 에칭 가능한 금속으로 이루어지는 것을 특징으로 하는 금속범프를 갖는 인쇄회로기판의 제조방법.
- 제8항에 있어서,상기 (D) 단계 이후에,상기 상부회로층 및 상기 하부회로층을 전기적으로 접속하는 비아를 형성하는 단계를 더 포함하는 것을 특징으로 하는 금속범프를 갖는 인쇄회로기판의 제조 방법.
- 절연층 상부에 매립된 전기 전도성 금속으로 이루어진 회로패턴을 포함하는 상부회로층; 및상기 회로패턴과 일체를 이루되 상기 회로패턴 상부로 돌출되며, 상기 절연층 상부로 돌출된 금속범프;를 포함하는 금속범프를 갖는 인쇄회로기판.
- 제12항에 있어서,상기 금속범프의 하면 중 일부분이 상기 회로패턴과 연결된 것을 특징으로 하는 금속범프를 갖는 인쇄회로기판.
- 제12항에 있어서,상기 절연층 상부에 형성되며 상기 금속범프를 노출하는 개방홀을 갖는 솔더 레지스트층을 더 포함하는 것을 특징으로 하는 금속범프를 갖는 인쇄회로기판.
- 제12항에 있어서,상기 절연층 하부에 매립된 하부회로층을 더 포함하는 것을 특징으로 하는 금속범프를 갖는 인쇄회로기판.
- 제12항에 있어서,상기 금속범프 상부에 형성되며 OSP 표면처리층 또는 니켈 및 금 도금층으로 이루어진 표면보호층을 더 포함하는 것을 특징으로 하는 금속범프를 갖는 인쇄회로기판.
- 제12항에 있어서,상기 회로패턴 및 상기 금속범프는 구리, 주석(Sn), 또는 주석(Sn)과 은(Ag)의 합금 중 어느 하나로 이루어진 것을 특징으로 하는 금속범프를 갖는 인쇄회로기판.
- 제15항에 있어서,상기 회로패턴과 상기 하부회로층을 전기적으로 연결하는 비아를 더 포함하는 것을 특징으로 하는 금속범프를 갖는 인쇄회로기판.
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
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KR1020080119895A KR101022912B1 (ko) | 2008-11-28 | 2008-11-28 | 금속범프를 갖는 인쇄회로기판 및 그 제조방법 |
US12/379,684 US8141241B2 (en) | 2008-11-28 | 2009-02-26 | Method of manufacturing a printed circuit board having metal bumps |
JP2009049589A JP5048005B2 (ja) | 2008-11-28 | 2009-03-03 | 金属バンプを持つプリント基板及びその製造方法 |
US13/373,387 US8464423B2 (en) | 2008-11-28 | 2011-11-14 | Method of manufacturing a printed circuit board having metal bumps |
US13/373,388 US20120061132A1 (en) | 2008-11-28 | 2011-11-14 | Printed circuit board having metal bumps |
US14/226,584 US20160242284A9 (en) | 2008-11-28 | 2014-03-26 | Printed circuit board having metal bumps |
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KR1020080119895A KR101022912B1 (ko) | 2008-11-28 | 2008-11-28 | 금속범프를 갖는 인쇄회로기판 및 그 제조방법 |
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KR20100061026A true KR20100061026A (ko) | 2010-06-07 |
KR101022912B1 KR101022912B1 (ko) | 2011-03-17 |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101235386B1 (ko) * | 2011-12-21 | 2013-02-20 | 주식회사 심텍 | 미세 피치 범프를 구비하는 인쇄회로기판 및 그 제조 방법 |
US10986726B2 (en) | 2017-05-15 | 2021-04-20 | Lg Innotek Co., Ltd. | Flexible circuit board for all-in-one chip on film, chip package including same, and electronic device including same |
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2008
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2009
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- 2009-03-03 JP JP2009049589A patent/JP5048005B2/ja active Active
-
2011
- 2011-11-14 US US13/373,387 patent/US8464423B2/en active Active
- 2011-11-14 US US13/373,388 patent/US20120061132A1/en not_active Abandoned
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2014
- 2014-03-26 US US14/226,584 patent/US20160242284A9/en not_active Abandoned
Cited By (2)
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KR101235386B1 (ko) * | 2011-12-21 | 2013-02-20 | 주식회사 심텍 | 미세 피치 범프를 구비하는 인쇄회로기판 및 그 제조 방법 |
US10986726B2 (en) | 2017-05-15 | 2021-04-20 | Lg Innotek Co., Ltd. | Flexible circuit board for all-in-one chip on film, chip package including same, and electronic device including same |
Also Published As
Publication number | Publication date |
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JP2010129998A (ja) | 2010-06-10 |
US20100132985A1 (en) | 2010-06-03 |
KR101022912B1 (ko) | 2011-03-17 |
US20120061132A1 (en) | 2012-03-15 |
US20120060365A1 (en) | 2012-03-15 |
US8464423B2 (en) | 2013-06-18 |
US20140202748A1 (en) | 2014-07-24 |
US8141241B2 (en) | 2012-03-27 |
JP5048005B2 (ja) | 2012-10-17 |
US20160242284A9 (en) | 2016-08-18 |
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