KR20100025546A - 발열체 탑재 부품의 장착 구조 - Google Patents

발열체 탑재 부품의 장착 구조 Download PDF

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Publication number
KR20100025546A
KR20100025546A KR1020097027401A KR20097027401A KR20100025546A KR 20100025546 A KR20100025546 A KR 20100025546A KR 1020097027401 A KR1020097027401 A KR 1020097027401A KR 20097027401 A KR20097027401 A KR 20097027401A KR 20100025546 A KR20100025546 A KR 20100025546A
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KR
South Korea
Prior art keywords
heating element
heat dissipation
dissipation member
heat
mounting
Prior art date
Application number
KR1020097027401A
Other languages
English (en)
Korean (ko)
Inventor
쯔요시 하세가와
Original Assignee
가부시끼가이샤 도시바
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시끼가이샤 도시바 filed Critical 가부시끼가이샤 도시바
Publication of KR20100025546A publication Critical patent/KR20100025546A/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/047—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being parallel to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
KR1020097027401A 2008-03-05 2008-12-10 발열체 탑재 부품의 장착 구조 KR20100025546A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2008-055438 2008-03-05
JP2008055438A JP2009212390A (ja) 2008-03-05 2008-03-05 発熱体搭載部品の取付構造

Publications (1)

Publication Number Publication Date
KR20100025546A true KR20100025546A (ko) 2010-03-09

Family

ID=41055627

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020097027401A KR20100025546A (ko) 2008-03-05 2008-12-10 발열체 탑재 부품의 장착 구조

Country Status (5)

Country Link
US (1) US20100186939A1 (ja)
EP (1) EP2251902A4 (ja)
JP (1) JP2009212390A (ja)
KR (1) KR20100025546A (ja)
WO (1) WO2009110045A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109219315A (zh) * 2018-09-04 2019-01-15 常州索维尔电子科技有限公司 具有半导体功率器件散热底座的机箱及组装方法

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4643703B2 (ja) 2008-11-21 2011-03-02 株式会社東芝 半導体装置の固定具及びその取付構造
JP5806464B2 (ja) * 2010-02-03 2015-11-10 株式会社東芝 半導体素子収納用パッケージ及びそれを用いた半導体装置
JP2011222564A (ja) * 2010-04-02 2011-11-04 Nec Personal Products Co Ltd ヒートシンク、放熱部材および電子機器
WO2011148662A1 (ja) * 2010-05-24 2011-12-01 シャープ株式会社 電子機器の放熱構造
JP5831273B2 (ja) * 2012-02-09 2015-12-09 三菱電機株式会社 半導体装置およびその製造方法
DE112013001612B4 (de) 2012-03-22 2022-05-12 Mitsubishi Electric Corporation Halbleiterbauteil und Verfahren zu dessen Herstellung
US9543227B2 (en) * 2013-12-27 2017-01-10 Mitsubishi Electric Corporation Semiconductor device
KR101734912B1 (ko) * 2015-03-02 2017-05-12 주식회사 엘엠에스 방열 시트
JP6612723B2 (ja) * 2016-12-07 2019-11-27 株式会社東芝 基板装置
US10825750B2 (en) * 2018-11-13 2020-11-03 Ge Aviation Systems Llc Method and apparatus for heat-dissipation in electronics

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60145647A (ja) 1984-01-10 1985-08-01 Fujitsu Ltd 発熱体モジユ−ルの放熱取付方法
JP2758273B2 (ja) 1991-01-17 1998-05-28 富士通株式会社 高周波平面回路モジュールの実装構造
JPH0711472Y2 (ja) * 1991-11-26 1995-03-15 サンケン電気株式会社 半導体装置
JP4416362B2 (ja) 2000-10-30 2010-02-17 株式会社クボタ 半導体素子用放熱性部品及び半導体装置
JP2002270745A (ja) 2001-03-12 2002-09-20 Hitachi Cable Ltd フィン付放熱材およびその製造方法
WO2003007376A1 (en) * 2001-07-09 2003-01-23 Daikin Industries, Ltd. Power module and air conditioner
JP2003273294A (ja) * 2002-01-09 2003-09-26 Nitto Denko Corp 熱伝導シートおよびこれを用いた半導体装置
JP2004063898A (ja) 2002-07-30 2004-02-26 Hitachi Cable Ltd 放熱材及びその製造方法
JP2006237103A (ja) 2005-02-23 2006-09-07 Kyocera Corp 熱伝導部材および電子装置
JP4617209B2 (ja) * 2005-07-07 2011-01-19 株式会社豊田自動織機 放熱装置
US7893449B2 (en) * 2005-12-14 2011-02-22 Showa Denko K.K. Gallium nitride based compound semiconductor light-emitting device having high emission efficiency and method of manufacturing the same
JP2008078564A (ja) * 2006-09-25 2008-04-03 Fujikura Ltd 放熱構造
JP5083261B2 (ja) * 2009-03-26 2012-11-28 三菱電機株式会社 半導体装置及びその製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109219315A (zh) * 2018-09-04 2019-01-15 常州索维尔电子科技有限公司 具有半导体功率器件散热底座的机箱及组装方法
CN109219315B (zh) * 2018-09-04 2023-12-01 常州是为电子有限公司 具有半导体功率器件散热底座的机箱及组装方法

Also Published As

Publication number Publication date
EP2251902A1 (en) 2010-11-17
WO2009110045A1 (ja) 2009-09-11
US20100186939A1 (en) 2010-07-29
EP2251902A4 (en) 2014-10-08
JP2009212390A (ja) 2009-09-17

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