KR20090092324A - 양이온 민감성 층을 포함하는 복합 물품 - Google Patents

양이온 민감성 층을 포함하는 복합 물품

Info

Publication number
KR20090092324A
KR20090092324A KR1020097014761A KR20097014761A KR20090092324A KR 20090092324 A KR20090092324 A KR 20090092324A KR 1020097014761 A KR1020097014761 A KR 1020097014761A KR 20097014761 A KR20097014761 A KR 20097014761A KR 20090092324 A KR20090092324 A KR 20090092324A
Authority
KR
South Korea
Prior art keywords
substrate
composite article
silicon
silicone
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020097014761A
Other languages
English (en)
Korean (ko)
Inventor
디미트리스 엘리아스 캐솔리스
엘리자베스 맥퀴스턴
토마스 디. 버나드
나단 그리어
폴 샬크
Original Assignee
다우 코닝 코포레이션
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 다우 코닝 코포레이션 filed Critical 다우 코닝 코포레이션
Publication of KR20090092324A publication Critical patent/KR20090092324A/ko
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
    • C03C17/28—Surface treatment of glass, not in the form of fibres or filaments, by coating with organic material
    • C03C17/30—Surface treatment of glass, not in the form of fibres or filaments, by coating with organic material with silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
    • C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
    • C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
    • C03C17/42—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating of an organic material and at least one non-metal coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
    • H10P14/6326—Deposition processes
    • H10P14/6342—Liquid deposition, e.g. spin-coating, sol-gel techniques or spray coating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/66—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials
    • H10P14/668—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials the materials being characterised by the deposition precursor materials
    • H10P14/6681—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials the materials being characterised by the deposition precursor materials the precursor containing a compound comprising Si
    • H10P14/6684—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials the materials being characterised by the deposition precursor materials the precursor containing a compound comprising Si the compound comprising silicon and oxygen
    • H10P14/6686—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials the materials being characterised by the deposition precursor materials the precursor containing a compound comprising Si the compound comprising silicon and oxygen the compound being a molecule comprising at least one silicon-oxygen bond and the compound having hydrogen or an organic group attached to the silicon or oxygen, e.g. a siloxane
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/69—Inorganic materials
    • H10P14/692—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses
    • H10P14/6921—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon
    • H10P14/6922—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon the material containing Si, O and at least one of H, N, C, F or other non-metal elements, e.g. SiOC, SiOC:H or SiONC
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C2217/00—Coatings on glass
    • C03C2217/40—Coatings comprising at least one inhomogeneous layer
    • C03C2217/43—Coatings comprising at least one inhomogeneous layer consisting of a dispersed phase in a continuous phase
    • C03C2217/46—Coatings comprising at least one inhomogeneous layer consisting of a dispersed phase in a continuous phase characterized by the dispersed phase
    • C03C2217/465—Coatings comprising at least one inhomogeneous layer consisting of a dispersed phase in a continuous phase characterized by the dispersed phase having a specific shape
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C2217/00—Coatings on glass
    • C03C2217/40—Coatings comprising at least one inhomogeneous layer
    • C03C2217/43—Coatings comprising at least one inhomogeneous layer consisting of a dispersed phase in a continuous phase
    • C03C2217/46—Coatings comprising at least one inhomogeneous layer consisting of a dispersed phase in a continuous phase characterized by the dispersed phase
    • C03C2217/47—Coatings comprising at least one inhomogeneous layer consisting of a dispersed phase in a continuous phase characterized by the dispersed phase consisting of a specific material
    • C03C2217/475—Inorganic materials
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
    • Y10T428/264—Up to 3 mils
    • Y10T428/265—1 mil or less
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/266—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension of base or substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
    • Y10T428/31609—Particulate metal or metal compound-containing
    • Y10T428/31612—As silicone, silane or siloxane
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
  • Electroluminescent Light Sources (AREA)
KR1020097014761A 2006-12-20 2007-12-19 양이온 민감성 층을 포함하는 복합 물품 Ceased KR20090092324A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US87095106P 2006-12-20 2006-12-20
US60/870,951 2006-12-20

Publications (1)

Publication Number Publication Date
KR20090092324A true KR20090092324A (ko) 2009-08-31

Family

ID=39427573

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020097014761A Ceased KR20090092324A (ko) 2006-12-20 2007-12-19 양이온 민감성 층을 포함하는 복합 물품

Country Status (6)

Country Link
US (1) US20100051920A1 (https=)
EP (1) EP2095446A1 (https=)
JP (1) JP2010514139A (https=)
KR (1) KR20090092324A (https=)
CN (1) CN101589483B (https=)
WO (1) WO2008079275A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180123972A (ko) * 2017-05-10 2018-11-20 신에쓰 가가꾸 고교 가부시끼가이샤 다이 본딩용 실리콘 수지 조성물, 다이 본드재 및 광 반도체 장치
KR20200099989A (ko) * 2019-02-15 2020-08-25 신에쓰 가가꾸 고교 가부시끼가이샤 웨이퍼 레벨 광반도체 디바이스용 수지 조성물 및 해당 조성물을 사용한 웨이퍼 레벨 광반도체 디바이스

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2114670A1 (en) * 2007-02-22 2009-11-11 Dow Corning Corporation Composite article having excellent fire resistance
CN101646559A (zh) * 2007-02-22 2010-02-10 陶氏康宁公司 具有优良的耐火性和抗冲击性的复合制品及其制备方法
US20100093242A1 (en) * 2007-02-22 2010-04-15 Dimitris Elias Katsoulis Composite Article Having Excellent Fire Resistance
JP2012074512A (ja) * 2010-09-28 2012-04-12 Sekisui Chem Co Ltd 光半導体装置用ダイボンド材及びそれを用いた光半導体装置
JP6081774B2 (ja) * 2012-10-30 2017-02-15 東レ・ダウコーニング株式会社 硬化性シリコーン組成物、その硬化物、および光半導体装置
CN111718234A (zh) 2014-04-16 2020-09-29 科慕埃弗西有限公司 将氯氟丙烷和氯氟丙烯转化成更需要的氟丙烷和氟丙烯
JP6375226B2 (ja) * 2014-12-26 2018-08-15 富士フイルム株式会社 硬化性組成物、転写フィルム、画像表示装置の前面板、前面板一体型センサー、画像表示装置および画像表示装置の前面板の製造方法
US20180033614A1 (en) * 2016-07-27 2018-02-01 Versum Materials Us, Llc Compositions and Methods Using Same for Carbon Doped Silicon Containing Films
TW202242913A (zh) * 2021-04-23 2022-11-01 美商Ｄｄｐ 特殊電子材料 Ｕｓ 9有限責任公司 導電複合膜

Family Cites Families (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL131800C (https=) * 1965-05-17
US4087585A (en) * 1977-05-23 1978-05-02 Dow Corning Corporation Self-adhering silicone compositions and preparations thereof
US4260780A (en) * 1979-11-27 1981-04-07 The United States Of America As Represented By The Secretary Of The Air Force Phenylmethylpolysilane polymers and process for their preparation
US4276424A (en) * 1979-12-03 1981-06-30 Petrarch Systems Methods for the production of organic polysilanes
US4314956A (en) * 1980-07-23 1982-02-09 Dow Corning Corporation High yield silicon carbide pre-ceramic polymers
US4324901A (en) * 1981-04-29 1982-04-13 Wisconsin Alumni Research Foundation Soluble polysilastyrene and method for preparation
US4530879A (en) * 1983-03-04 1985-07-23 Minnesota Mining And Manufacturing Company Radiation activated addition reaction
US4510094A (en) * 1983-12-06 1985-04-09 Minnesota Mining And Manufacturing Company Platinum complex
FR2591587A1 (fr) * 1985-12-17 1987-06-19 Saint Gobain Vitrage Film organo-mineral depose sur un substrat en verre eventuellement revetu d'une ou plusieurs couches metalliques minces.
US4766176A (en) * 1987-07-20 1988-08-23 Dow Corning Corporation Storage stable heat curable organosiloxane compositions containing microencapsulated platinum-containing catalysts
JPH0214244A (ja) * 1988-06-30 1990-01-18 Toray Dow Corning Silicone Co Ltd 加熱硬化性オルガノポリシロキサン組成物
JP3029680B2 (ja) * 1991-01-29 2000-04-04 東レ・ダウコーニング・シリコーン株式会社 オルガノペンタシロキサンおよびその製造方法
US5266715A (en) * 1991-03-06 1993-11-30 Ciba-Geigy Corporation Glass coating with improved adhesion and weather resistance
JPH06329914A (ja) * 1993-05-18 1994-11-29 Toray Dow Corning Silicone Co Ltd 室温硬化性オルガノポリシロキサン組成物およびその製造方法
US5469961A (en) * 1994-08-15 1995-11-28 Chang; Chun Y. Combined minidisc box
JP3957760B2 (ja) * 1996-07-10 2007-08-15 統寶光電股▲ふん▼有限公司 有機発光素子用のカプセル封入材としてのシロキサンおよびシロキサン誘導体
JP3996969B2 (ja) * 1997-01-21 2007-10-24 東レ・ダウコーニング株式会社 シリコーンエラストマーコーティングシート状物およびその製造方法
EP1376224B1 (en) * 1997-08-08 2010-10-13 Dai Nippon Printing Co., Ltd. Structure for pattern formation, method for pattern formation, and application thereof
WO2000036665A1 (en) * 1998-12-16 2000-06-22 Battelle Memorial Institute Environmental barrier material for organic light emitting device and method of making
JP2000302487A (ja) * 1999-04-23 2000-10-31 Nippon Sheet Glass Co Ltd ガラス基板およびその製造方法
US6501219B1 (en) * 1999-07-29 2002-12-31 General Electric Company Shatter-resistant incandescent lamp, silicone coating composition, and method
DE10019355A1 (de) * 2000-04-18 2001-10-31 Schott Glas Glaskörper mit erhöhter Festigkeit
US6524598B2 (en) * 2000-07-10 2003-02-25 The Procter & Gamble Company Cosmetic compositions
US6534581B1 (en) * 2000-07-20 2003-03-18 Dow Corning Corporation Silicone composition and electrically conductive silicone adhesive formed therefrom
US6963168B2 (en) * 2000-08-23 2005-11-08 Idemitsu Kosan Co., Ltd. Organic EL display device having certain relationships among constituent element refractive indices
US6664137B2 (en) * 2001-03-29 2003-12-16 Universal Display Corporation Methods and structures for reducing lateral diffusion through cooperative barrier layers
JP2003163078A (ja) * 2001-11-28 2003-06-06 Hitachi Ltd 表示装置
JP3906985B2 (ja) * 2002-05-24 2007-04-18 三井化学株式会社 金属拡散バリア膜、金属拡散バリア膜の形成方法および半導体装置
WO2003104329A1 (ja) * 2002-06-05 2003-12-18 ダウコーニングアジア株式会社 ポリシロキサンフィルム及びその製造方法
CN1778002A (zh) * 2003-03-04 2006-05-24 陶氏康宁公司 有机发光二极管
JP2004361692A (ja) * 2003-04-07 2004-12-24 Dow Corning Asia Ltd 光伝送部材用硬化性オルガノポリシロキサン樹脂組成物、オルガノポリシロキサン樹脂硬化物からなる光伝送部材および光伝送部材の製造方法
JP4163567B2 (ja) * 2003-07-09 2008-10-08 株式会社 日立ディスプレイズ 発光型表示装置
US20070122631A1 (en) * 2003-11-13 2007-05-31 Akiji Higuchi Flexible substrate and coating liquid
US20050237462A1 (en) * 2004-04-26 2005-10-27 Eastman Kodak Company Alignment layer for liquid crystal display
JP5297589B2 (ja) * 2004-05-14 2013-09-25 東レ・ダウコーニング株式会社 オルガノポリシロキサン樹脂硬化物からなる独立フィルム、その製造方法および積層フィルム
EP1856206B1 (en) * 2005-02-16 2011-10-12 Dow Corning Corporation Reinforced silicone resin film and method of preparing same
KR101271662B1 (ko) * 2005-02-16 2013-06-05 다우 코닝 도레이 캄파니 리미티드 강화 실리콘 수지 필름 및 이의 제조방법
JP4636242B2 (ja) * 2005-04-21 2011-02-23 信越化学工業株式会社 光半導体素子封止材及び光半導体素子
US20090130463A1 (en) * 2005-10-05 2009-05-21 John Dean Albaugh Coated Substrates and Methods for their Preparation
KR101447272B1 (ko) * 2010-12-31 2014-10-08 제일모직주식회사 폴리카보네이트 수지 조성물 및 이를 포함하는 성형품
KR101997921B1 (ko) * 2011-09-05 2019-07-08 엘지전자 주식회사 태양전지 모듈

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180123972A (ko) * 2017-05-10 2018-11-20 신에쓰 가가꾸 고교 가부시끼가이샤 다이 본딩용 실리콘 수지 조성물, 다이 본드재 및 광 반도체 장치
KR20200099989A (ko) * 2019-02-15 2020-08-25 신에쓰 가가꾸 고교 가부시끼가이샤 웨이퍼 레벨 광반도체 디바이스용 수지 조성물 및 해당 조성물을 사용한 웨이퍼 레벨 광반도체 디바이스

Also Published As

Publication number Publication date
US20100051920A1 (en) 2010-03-04
WO2008079275A1 (en) 2008-07-03
JP2010514139A (ja) 2010-04-30
CN101589483A (zh) 2009-11-25
CN101589483B (zh) 2012-06-06
EP2095446A1 (en) 2009-09-02

Similar Documents

Publication Publication Date Title
KR20090092324A (ko) 양이온 민감성 층을 포함하는 복합 물품
JP5357046B2 (ja) 硬化シリコーン組成物で被覆またはラミネートされたガラス基板
JP5091249B2 (ja) 多層の硬化シリコーン樹脂組成物で被覆またはラミネートされたガラス基板
JP5253380B2 (ja) テルル化カドミウムベース光起電力デバイスおよびその調製方法
KR101261254B1 (ko) 강화 실리콘 수지 필름 및 이의 제조방법
CN101473448B (zh) 硒化铟铜基光伏器件及其制造方法
JP2015051635A (ja) 優れた耐火性を有する複合品
JP2014510801A (ja) シリコーン組成物、シリコーン接着剤、コーティングされた基材、及び積層された基材
KR20100137441A (ko) 실리콘 조성물, 실리콘 접착제, 피복된 기판 및 적층 기판
KR20090120468A (ko) 우수한 내화성을 갖는 복합체 물품
KR20090120484A (ko) 우수한 내화성과 내충격성을 갖는 복합체 물품과 그 제조 방법
JP2012526178A (ja) ビニル水素ポリシロキサン接着剤組成物

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

A201 Request for examination
PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

E601 Decision to refuse application
PE0601 Decision on rejection of patent

St.27 status event code: N-2-6-B10-B15-exm-PE0601

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

R18 Changes to party contact information recorded

Free format text: ST27 STATUS EVENT CODE: A-3-3-R10-R18-OTH-X000 (AS PROVIDED BY THE NATIONAL OFFICE)

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000