KR20090082469A - 발광다이오드 어셈블리 및 그 제조방법 - Google Patents
발광다이오드 어셈블리 및 그 제조방법Info
- Publication number
- KR20090082469A KR20090082469A KR1020097011885A KR20097011885A KR20090082469A KR 20090082469 A KR20090082469 A KR 20090082469A KR 1020097011885 A KR1020097011885 A KR 1020097011885A KR 20097011885 A KR20097011885 A KR 20097011885A KR 20090082469 A KR20090082469 A KR 20090082469A
- Authority
- KR
- South Korea
- Prior art keywords
- led
- lens
- emitting surface
- array
- phosphor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/852—Encapsulations
- H10H20/853—Encapsulations characterised by their shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
- H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
Landscapes
- Led Device Packages (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US85821106P | 2006-11-09 | 2006-11-09 | |
| US60/858,211 | 2006-11-09 | ||
| US11/800,977 | 2007-05-07 | ||
| US11/800,977 US7737636B2 (en) | 2006-11-09 | 2007-05-07 | LED assembly with an LED and adjacent lens and method of making same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20090082469A true KR20090082469A (ko) | 2009-07-30 |
Family
ID=39368374
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020097011885A Ceased KR20090082469A (ko) | 2006-11-09 | 2007-05-08 | 발광다이오드 어셈블리 및 그 제조방법 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US7737636B2 (enExample) |
| EP (1) | EP2098099A4 (enExample) |
| JP (1) | JP2010509769A (enExample) |
| KR (1) | KR20090082469A (enExample) |
| WO (1) | WO2008063216A2 (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20210083587A (ko) | 2019-12-27 | 2021-07-07 | 에스엘 주식회사 | 렌즈어셈블리 및 이의 제작방법 |
| KR20230049311A (ko) | 2021-10-06 | 2023-04-13 | 주식회사 싸이너스 | 양면 패턴 쉴드 기능을 갖는 mla 소자 및 제조 방법 |
Families Citing this family (43)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8300042B2 (en) | 2001-06-05 | 2012-10-30 | Microsoft Corporation | Interactive video display system using strobed light |
| US8035612B2 (en) * | 2002-05-28 | 2011-10-11 | Intellectual Ventures Holding 67 Llc | Self-contained interactive video display system |
| US7710391B2 (en) * | 2002-05-28 | 2010-05-04 | Matthew Bell | Processing an image utilizing a spatially varying pattern |
| US20050122308A1 (en) * | 2002-05-28 | 2005-06-09 | Matthew Bell | Self-contained interactive video display system |
| AU2003301043A1 (en) * | 2002-12-13 | 2004-07-09 | Reactrix Systems | Interactive directed light/sound system |
| JP4794453B2 (ja) | 2003-10-24 | 2011-10-19 | インテレクチュアル ベンチャーズ ホールディング 67 エルエルシー | インタラクティブ・ビデオ・ディスプレイ・システムを管理する方法及びシステム |
| US9128519B1 (en) | 2005-04-15 | 2015-09-08 | Intellectual Ventures Holding 67 Llc | Method and system for state-based control of objects |
| US8081822B1 (en) | 2005-05-31 | 2011-12-20 | Intellectual Ventures Holding 67 Llc | System and method for sensing a feature of an object in an interactive video display |
| US8098277B1 (en) | 2005-12-02 | 2012-01-17 | Intellectual Ventures Holding 67 Llc | Systems and methods for communication between a reactive video system and a mobile communication device |
| US20080064131A1 (en) * | 2006-09-12 | 2008-03-13 | Mutual-Tek Industries Co., Ltd. | Light emitting apparatus and method for the same |
| JP2009032882A (ja) * | 2007-07-26 | 2009-02-12 | Sanken Electric Co Ltd | 半導体発光素子及び半導体発光素子製造方法 |
| KR101141087B1 (ko) | 2007-09-14 | 2012-07-12 | 인텔렉츄얼 벤처스 홀딩 67 엘엘씨 | 제스처-기반 사용자 상호작용의 프로세싱 |
| KR101361575B1 (ko) * | 2007-09-17 | 2014-02-13 | 삼성전자주식회사 | 발광 다이오드 패키지 및 그 제조방법 |
| US8159682B2 (en) | 2007-11-12 | 2012-04-17 | Intellectual Ventures Holding 67 Llc | Lens system |
| TW201442280A (zh) | 2007-11-30 | 2014-11-01 | Univ California | 利用表面粗糙之高度光取出效率之氮化物基發光二極體 |
| US20100039500A1 (en) * | 2008-02-15 | 2010-02-18 | Matthew Bell | Self-Contained 3D Vision System Utilizing Stereo Camera and Patterned Illuminator |
| US8259163B2 (en) * | 2008-03-07 | 2012-09-04 | Intellectual Ventures Holding 67 Llc | Display with built in 3D sensing |
| US8595218B2 (en) | 2008-06-12 | 2013-11-26 | Intellectual Ventures Holding 67 Llc | Interactive display management systems and methods |
| KR101039957B1 (ko) | 2008-11-18 | 2011-06-09 | 엘지이노텍 주식회사 | 발광 장치 및 이를 구비한 디스플레이 장치 |
| TWI462350B (zh) * | 2008-12-24 | 2014-11-21 | 財團法人工業技術研究院 | 多晶發光二極體 |
| US20110089447A1 (en) * | 2009-10-19 | 2011-04-21 | Wu-Cheng Kuo | Light-emiting device chip with micro-lenses and method for fabricating the same |
| KR20110043864A (ko) * | 2009-10-22 | 2011-04-28 | 포항공과대학교 산학협력단 | 색 혼합 렌즈 및 이를 가지는 액정 표시 장치 |
| US10500770B2 (en) * | 2010-03-02 | 2019-12-10 | So-Semi Technologies, Llc | LED packaging with integrated optics and methods of manufacturing the same |
| CN101814572A (zh) * | 2010-03-05 | 2010-08-25 | 矽畿科技股份有限公司 | 光二极管封装结构 |
| CN102906877A (zh) * | 2010-05-27 | 2013-01-30 | 奥斯兰姆施尔凡尼亚公司 | 包括全氮化物发光二极管的发光二极管光源 |
| JP2012028749A (ja) * | 2010-07-22 | 2012-02-09 | Seoul Opto Devices Co Ltd | 発光ダイオード |
| TW201208143A (en) * | 2010-08-06 | 2012-02-16 | Semileds Optoelectronics Co | White LED device and manufacturing method thereof |
| US8534901B2 (en) | 2010-09-13 | 2013-09-17 | Teledyne Reynolds, Inc. | Collimating waveguide apparatus and method |
| US8608328B2 (en) | 2011-05-06 | 2013-12-17 | Teledyne Technologies Incorporated | Light source with secondary emitter conversion element |
| DE102011078572B4 (de) * | 2011-07-04 | 2016-06-02 | Osram Gmbh | Beleuchtungsvorrichtung |
| US9115865B1 (en) | 2012-06-19 | 2015-08-25 | Forever Gifts, Inc. | Lighting device having light-distributing void |
| US20140307431A1 (en) * | 2013-04-16 | 2014-10-16 | Xeralux, Inc. | Field Configurable Industrial LED Light Fixture |
| DE102013209919B4 (de) * | 2013-05-28 | 2025-06-26 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronisches Bauelement mit einem Gehäuse mit mehreren Öffnungen |
| US20150133753A1 (en) * | 2013-11-14 | 2015-05-14 | General Electric Company | Arrays of emitters for pulse oximetry devices and methods of making the same |
| US9465175B2 (en) * | 2014-07-23 | 2016-10-11 | Sifotonics Technologies Co., Ltd. | Integrated lens-array-on-substrate for optical coupling system and fabrication method thereof |
| US10066160B2 (en) | 2015-05-01 | 2018-09-04 | Intematix Corporation | Solid-state white light generating lighting arrangements including photoluminescence wavelength conversion components |
| US20180073686A1 (en) * | 2016-09-14 | 2018-03-15 | Osram Sylvania Inc. | Solid state lighting device with electronically adjustable light beam distribution |
| DE102016224090B4 (de) * | 2016-12-05 | 2024-03-28 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronisches Bauelement, Modul mit mindestens zwei optoelektronischen Bauelementen und Verfahren zum Herstellen eines optoelektronischen Bauelements |
| DE102018101786A1 (de) * | 2018-01-26 | 2019-08-01 | Osram Opto Semiconductors Gmbh | Lichtemittierendes Halbleiterbauteil |
| CN109411460B (zh) * | 2018-12-20 | 2024-03-29 | 广州美锐健康产业股份有限公司 | 多光谱固态发光器件及多光谱照射光源 |
| GB2593181B (en) * | 2020-03-17 | 2023-11-15 | Plessey Semiconductors Ltd | Micro-LED device |
| KR102857693B1 (ko) * | 2020-10-13 | 2025-09-10 | 주식회사 루멘스 | 칩 스케일 패키지 엘이디 및 그 제조방법 |
| CN117832363B (zh) * | 2024-03-04 | 2024-06-25 | 山东云海国创云计算装备产业创新中心有限公司 | 一种自带导光的光电极、神经电极及制备方法 |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04239781A (ja) * | 1991-01-23 | 1992-08-27 | Eastman Kodak Japan Kk | Ledアレイチップ |
| JP2787388B2 (ja) * | 1992-03-06 | 1998-08-13 | シャープ株式会社 | 発光装置のレンズ成形方法 |
| JPH06151972A (ja) * | 1992-11-09 | 1994-05-31 | Omron Corp | レンズ・オン・チップ型発光装置及びその製造方法 |
| JPH07115244A (ja) * | 1993-10-19 | 1995-05-02 | Toyota Motor Corp | 半導体レーザー及びその製造方法 |
| US5803579A (en) * | 1996-06-13 | 1998-09-08 | Gentex Corporation | Illuminator assembly incorporating light emitting diodes |
| JP3407608B2 (ja) * | 1997-07-28 | 2003-05-19 | 日亜化学工業株式会社 | 発光ダイオード及びその形成方法 |
| US6501091B1 (en) * | 1998-04-01 | 2002-12-31 | Massachusetts Institute Of Technology | Quantum dot white and colored light emitting diodes |
| US6429583B1 (en) * | 1998-11-30 | 2002-08-06 | General Electric Company | Light emitting device with ba2mgsi2o7:eu2+, ba2sio4:eu2+, or (srxcay ba1-x-y)(a1zga1-z)2sr:eu2+phosphors |
| JP2001111109A (ja) * | 1999-10-07 | 2001-04-20 | Sharp Corp | 窒化ガリウム系化合物半導体発光素子 |
| JP4114364B2 (ja) * | 2001-11-08 | 2008-07-09 | 日亜化学工業株式会社 | 発光装置およびその製造方法 |
| JP2005175417A (ja) * | 2003-07-28 | 2005-06-30 | Ricoh Co Ltd | 発光素子アレイ、光書込ユニットおよび画像形成装置 |
| JP4093943B2 (ja) * | 2003-09-30 | 2008-06-04 | 三洋電機株式会社 | 発光素子およびその製造方法 |
| EP1733077B1 (en) * | 2004-01-15 | 2018-04-18 | Samsung Electronics Co., Ltd. | Nanocrystal doped matrixes |
| JP4543712B2 (ja) * | 2004-03-17 | 2010-09-15 | 日亜化学工業株式会社 | 発光装置の製造方法 |
| JP2006049657A (ja) * | 2004-08-06 | 2006-02-16 | Citizen Electronics Co Ltd | Ledランプ |
| US7532405B2 (en) * | 2004-10-06 | 2009-05-12 | Panasonic Corporation | Micro lens, micro lens array, and method of manufacturing the same |
| TWI239671B (en) * | 2004-12-30 | 2005-09-11 | Ind Tech Res Inst | LED applied with omnidirectional reflector |
| DE102005019375A1 (de) * | 2005-02-28 | 2006-09-07 | Osram Opto Semiconductors Gmbh | LED-Array |
| KR100790741B1 (ko) * | 2006-09-07 | 2008-01-02 | 삼성전기주식회사 | 엘이디 패키지용 렌즈의 제작 방법 |
-
2007
- 2007-05-07 US US11/800,977 patent/US7737636B2/en not_active Expired - Fee Related
- 2007-05-08 EP EP07794684A patent/EP2098099A4/en not_active Withdrawn
- 2007-05-08 KR KR1020097011885A patent/KR20090082469A/ko not_active Ceased
- 2007-05-08 JP JP2009536220A patent/JP2010509769A/ja active Pending
- 2007-05-08 WO PCT/US2007/011187 patent/WO2008063216A2/en not_active Ceased
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20210083587A (ko) | 2019-12-27 | 2021-07-07 | 에스엘 주식회사 | 렌즈어셈블리 및 이의 제작방법 |
| KR20230049311A (ko) | 2021-10-06 | 2023-04-13 | 주식회사 싸이너스 | 양면 패턴 쉴드 기능을 갖는 mla 소자 및 제조 방법 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2008063216A3 (en) | 2008-10-30 |
| US20080111141A1 (en) | 2008-05-15 |
| EP2098099A4 (en) | 2012-10-10 |
| WO2008063216A2 (en) | 2008-05-29 |
| JP2010509769A (ja) | 2010-03-25 |
| US7737636B2 (en) | 2010-06-15 |
| EP2098099A2 (en) | 2009-09-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR20090082469A (ko) | 발광다이오드 어셈블리 및 그 제조방법 | |
| US8564004B2 (en) | Complex primary optics with intermediate elements | |
| TWI497774B (zh) | 發光元件及其製造方法 | |
| US20150014708A1 (en) | Package for light emitting and receiving devices | |
| KR102222215B1 (ko) | 기판내에 산란 특징을 갖는 led | |
| CN102057507B (zh) | 具有分隔的波长转换材料的半导体光发射器件及其形成方法 | |
| CN103199185B (zh) | 发光装置、面光源、液晶显示装置和制造发光装置的方法 | |
| TWI636584B (zh) | 發光二極體組件、包括該發光二極體組件的發光二極體、及微光學多層結構 | |
| KR101908449B1 (ko) | 비대칭 방사 패턴을 가진 발광 디바이스 및 제조 방법 | |
| JP2012529766A (ja) | 遠隔の蛍燐光体の層及び反射性のサブマウントを備えたled | |
| KR20160029030A (ko) | 광전자 컴포넌트를 제조하기 위한 방법 | |
| KR20090002835A (ko) | 질화물계 발광 소자 및 그 제조방법 | |
| TWI745820B (zh) | 超光滑側壁畫素陣列led | |
| EP3906585B1 (en) | Pixelated led array with optical elements | |
| CN101653039B (zh) | 发光二极管组合件及其制造方法 | |
| CN110494990A (zh) | 用于生产光电元件的方法 | |
| US11506933B2 (en) | Light-emitting module, method for manufacturing the same, and liquid-crystal display device | |
| JP2023009160A (ja) | 高い近接場コントラスト比を有するledモジュール | |
| KR101460742B1 (ko) | 반도체 소자 구조물을 제조하는 방법 | |
| TWI835720B (zh) | 發光二極體模組及其製造方法及相關之閃光燈模組、汽車頭燈或投影發光二極體系統 | |
| WO2025122711A1 (en) | Lenses formed by additive manufacturing for light-emitting diode packages | |
| WO2023046431A1 (en) | Semiconductor light source, cover body and method to produce the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
Patent event date: 20090609 Patent event code: PA01051R01D Comment text: International Patent Application |
|
| PG1501 | Laying open of application | ||
| A201 | Request for examination | ||
| AMND | Amendment | ||
| PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 20120507 Comment text: Request for Examination of Application |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20130521 Patent event code: PE09021S01D |
|
| AMND | Amendment | ||
| E601 | Decision to refuse application | ||
| PE0601 | Decision on rejection of patent |
Patent event date: 20131128 Comment text: Decision to Refuse Application Patent event code: PE06012S01D Patent event date: 20130521 Comment text: Notification of reason for refusal Patent event code: PE06011S01I |
|
| J201 | Request for trial against refusal decision | ||
| PJ0201 | Trial against decision of rejection |
Patent event date: 20131227 Comment text: Request for Trial against Decision on Refusal Patent event code: PJ02012R01D Patent event date: 20131128 Comment text: Decision to Refuse Application Patent event code: PJ02011S01I Appeal kind category: Appeal against decision to decline refusal Appeal identifier: 2013101009075 Request date: 20131227 |
|
| AMND | Amendment | ||
| PB0901 | Examination by re-examination before a trial |
Comment text: Amendment to Specification, etc. Patent event date: 20140116 Patent event code: PB09011R02I Comment text: Request for Trial against Decision on Refusal Patent event date: 20131227 Patent event code: PB09011R01I Comment text: Amendment to Specification, etc. Patent event date: 20130722 Patent event code: PB09011R02I Comment text: Amendment to Specification, etc. Patent event date: 20120507 Patent event code: PB09011R02I |
|
| B601 | Maintenance of original decision after re-examination before a trial | ||
| PB0601 | Maintenance of original decision after re-examination before a trial |
Comment text: Report of Result of Re-examination before a Trial Patent event code: PB06011S01D Patent event date: 20140306 |
|
| J301 | Trial decision |
Free format text: TRIAL DECISION FOR APPEAL AGAINST DECISION TO DECLINE REFUSAL REQUESTED 20131227 Effective date: 20140923 |
|
| PJ1301 | Trial decision |
Patent event code: PJ13011S01D Patent event date: 20140924 Comment text: Trial Decision on Objection to Decision on Refusal Appeal kind category: Appeal against decision to decline refusal Request date: 20131227 Decision date: 20140923 Appeal identifier: 2013101009075 |