JP2010509769A - 発光ダイオードアセンブリ及び製造方法 - Google Patents

発光ダイオードアセンブリ及び製造方法 Download PDF

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Publication number
JP2010509769A
JP2010509769A JP2009536220A JP2009536220A JP2010509769A JP 2010509769 A JP2010509769 A JP 2010509769A JP 2009536220 A JP2009536220 A JP 2009536220A JP 2009536220 A JP2009536220 A JP 2009536220A JP 2010509769 A JP2010509769 A JP 2010509769A
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JP
Japan
Prior art keywords
led
lens
light emitting
array
emitting surface
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Pending
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JP2009536220A
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English (en)
Japanese (ja)
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JP2010509769A5 (enExample
Inventor
リ，イ−チュン
ドン，イ
シャン，ウェイ
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Intematix Corp
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Intematix Corp
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Publication of JP2010509769A publication Critical patent/JP2010509769A/ja
Publication of JP2010509769A5 publication Critical patent/JP2010509769A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
JP2009536220A 2006-11-09 2007-05-08 発光ダイオードアセンブリ及び製造方法 Pending JP2010509769A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US85821106P 2006-11-09 2006-11-09
US11/800,977 US7737636B2 (en) 2006-11-09 2007-05-07 LED assembly with an LED and adjacent lens and method of making same
PCT/US2007/011187 WO2008063216A2 (en) 2006-11-09 2007-05-08 Light emitting diode assembly and method of fabrication

Publications (2)

Publication Number Publication Date
JP2010509769A true JP2010509769A (ja) 2010-03-25
JP2010509769A5 JP2010509769A5 (enExample) 2010-05-06

Family

ID=39368374

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009536220A Pending JP2010509769A (ja) 2006-11-09 2007-05-08 発光ダイオードアセンブリ及び製造方法

Country Status (5)

Country Link
US (1) US7737636B2 (enExample)
EP (1) EP2098099A4 (enExample)
JP (1) JP2010509769A (enExample)
KR (1) KR20090082469A (enExample)
WO (1) WO2008063216A2 (enExample)

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US20080064131A1 (en) * 2006-09-12 2008-03-13 Mutual-Tek Industries Co., Ltd. Light emitting apparatus and method for the same
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EP2188737A4 (en) 2007-09-14 2011-05-18 Intellectual Ventures Holding 67 Llc PROCESSING BREAKFAST USER INTERACTIONS
KR101361575B1 (ko) * 2007-09-17 2014-02-13 삼성전자주식회사 발광 다이오드 패키지 및 그 제조방법
US8159682B2 (en) 2007-11-12 2012-04-17 Intellectual Ventures Holding 67 Llc Lens system
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US20100039500A1 (en) * 2008-02-15 2010-02-18 Matthew Bell Self-Contained 3D Vision System Utilizing Stereo Camera and Patterned Illuminator
US8259163B2 (en) 2008-03-07 2012-09-04 Intellectual Ventures Holding 67 Llc Display with built in 3D sensing
US8595218B2 (en) 2008-06-12 2013-11-26 Intellectual Ventures Holding 67 Llc Interactive display management systems and methods
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US8608328B2 (en) 2011-05-06 2013-12-17 Teledyne Technologies Incorporated Light source with secondary emitter conversion element
DE102011078572B4 (de) * 2011-07-04 2016-06-02 Osram Gmbh Beleuchtungsvorrichtung
US9115865B1 (en) 2012-06-19 2015-08-25 Forever Gifts, Inc. Lighting device having light-distributing void
US20140307431A1 (en) * 2013-04-16 2014-10-16 Xeralux, Inc. Field Configurable Industrial LED Light Fixture
DE102013209919B4 (de) * 2013-05-28 2025-06-26 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches Bauelement mit einem Gehäuse mit mehreren Öffnungen
US20150133753A1 (en) * 2013-11-14 2015-05-14 General Electric Company Arrays of emitters for pulse oximetry devices and methods of making the same
US9465175B2 (en) * 2014-07-23 2016-10-11 Sifotonics Technologies Co., Ltd. Integrated lens-array-on-substrate for optical coupling system and fabrication method thereof
US10066160B2 (en) 2015-05-01 2018-09-04 Intematix Corporation Solid-state white light generating lighting arrangements including photoluminescence wavelength conversion components
US20180073686A1 (en) * 2016-09-14 2018-03-15 Osram Sylvania Inc. Solid state lighting device with electronically adjustable light beam distribution
DE102016224090B4 (de) * 2016-12-05 2024-03-28 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches Bauelement, Modul mit mindestens zwei optoelektronischen Bauelementen und Verfahren zum Herstellen eines optoelektronischen Bauelements
DE102018101786A1 (de) * 2018-01-26 2019-08-01 Osram Opto Semiconductors Gmbh Lichtemittierendes Halbleiterbauteil
CN109411460B (zh) * 2018-12-20 2024-03-29 广州美锐健康产业股份有限公司 多光谱固态发光器件及多光谱照射光源
KR102832754B1 (ko) 2019-12-27 2025-07-10 에스엘 주식회사 렌즈어셈블리 및 이의 제작방법
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KR102857693B1 (ko) * 2020-10-13 2025-09-10 주식회사 루멘스 칩 스케일 패키지 엘이디 및 그 제조방법
KR102663213B1 (ko) 2021-10-06 2024-05-03 주식회사 싸이너스 양면 패턴 쉴드 기능을 갖는 mla 소자 및 제조 방법
CN117832363B (zh) * 2024-03-04 2024-06-25 山东云海国创云计算装备产业创新中心有限公司 一种自带导光的光电极、神经电极及制备方法

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WO2006089508A1 (de) * 2005-02-28 2006-08-31 Osram Opto Semiconductors Gmbh Led-array

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JPH04239781A (ja) * 1991-01-23 1992-08-27 Eastman Kodak Japan Kk Ｌｅｄアレイチップ
JPH05251485A (ja) * 1992-03-06 1993-09-28 Sharp Corp 発光装置のレンズ成形方法
JPH06151972A (ja) * 1992-11-09 1994-05-31 Omron Corp レンズ・オン・チップ型発光装置及びその製造方法
JPH1146015A (ja) * 1997-07-28 1999-02-16 Nichia Chem Ind Ltd 発光ダイオード及びその形成方法
JP2001111109A (ja) * 1999-10-07 2001-04-20 Sharp Corp 窒化ガリウム系化合物半導体発光素子
JP2003209286A (ja) * 2001-11-08 2003-07-25 Nichia Chem Ind Ltd 発光装置およびその製造方法
JP2005175417A (ja) * 2003-07-28 2005-06-30 Ricoh Co Ltd 発光素子アレイ、光書込ユニットおよび画像形成装置
JP2005109059A (ja) * 2003-09-30 2005-04-21 Sanyo Electric Co Ltd 発光素子およびその製造方法
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WO2006038648A1 (ja) * 2004-10-06 2006-04-13 Matsushita Electric Industrial Co., Ltd. マイクロレンズ、マイクロレンズアレイ及びその製造方法
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Also Published As

Publication number Publication date
US7737636B2 (en) 2010-06-15
EP2098099A4 (en) 2012-10-10
US20080111141A1 (en) 2008-05-15
WO2008063216A2 (en) 2008-05-29
KR20090082469A (ko) 2009-07-30
EP2098099A2 (en) 2009-09-09
WO2008063216A3 (en) 2008-10-30

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